SNAS800 July   2021 LMX1204

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Range of Dividers and Multiplier
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power On Reset
      2. 7.3.2 Clock Outputs
        1. 7.3.2.1 Clock Output Buffers
        2. 7.3.2.2 Clock MUX
        3. 7.3.2.3 Clock Divider
        4. 7.3.2.4 Clock Multiplier
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Output Buffers
          1. 7.3.3.1.1 SYSREF Output Buffer for Main Clocks
          2. 7.3.3.1.2 SYSREF Output Buffer for LOGICLK
        2. 7.3.3.2 SYSREF Frequency and Delay Generation
        3. 7.3.3.3 SYSREFREQ pins
          1. 7.3.3.3.1 SYSREFREQ Pins Common Mode Voltage
          2. 7.3.3.3.2 SYSREFREQ Pin Windowing Feature
        4. 7.3.3.4 SYNC Feature
      4. 7.3.4 LOGICLK Output
        1. 7.3.4.1 LOGICLK Output Format
        2. 7.3.4.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Current Consumption
      2. 8.1.2 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 300-MHz to 12.8-GHz output frequency
  • Noise floor of –160 dBc/Hz at 6-GHz output
  • Under 30-fs additive jitter (DC to fCLK integration range)
  • 4 high-frequency clocks with corresponding SYSREF outputs
    • Shared divide by 1 (Bypass), 2, 3, 4, 5, 6, 7, and 8
    • Shared programmable multiplier x2, x3, and x4
  • LOGICLK output with corresponding SYSREF output
    • On separate divide bank
    • 1, 2, 4 pre-divider
    • 1 (bypass), 2, …, 1023 post divider
  • 8 programmable output power levels
  • Synchronized SYSREF clock outputs
    • 508 delay step adjustments of less than 2.5 ps each at 12.8 GHz
    • Generator and repeater modes
    • Windowing feature for SYSREFREQ pins to optimize timing
  • SYNC feature to all divides and multiple devices
  • 2.5-V operating voltage
  • –40ºC to +85ºC operating temperature