SNAS800 July   2021 LMX1204

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Range of Dividers and Multiplier
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power On Reset
      2. 7.3.2 Clock Outputs
        1. 7.3.2.1 Clock Output Buffers
        2. 7.3.2.2 Clock MUX
        3. 7.3.2.3 Clock Divider
        4. 7.3.2.4 Clock Multiplier
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Output Buffers
          1. 7.3.3.1.1 SYSREF Output Buffer for Main Clocks
          2. 7.3.3.1.2 SYSREF Output Buffer for LOGICLK
        2. 7.3.3.2 SYSREF Frequency and Delay Generation
        3. 7.3.3.3 SYSREFREQ pins
          1. 7.3.3.3.1 SYSREFREQ Pins Common Mode Voltage
          2. 7.3.3.3.2 SYSREFREQ Pin Windowing Feature
        4. 7.3.3.4 SYNC Feature
      4. 7.3.4 LOGICLK Output
        1. 7.3.4.1 LOGICLK Output Format
        2. 7.3.4.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Current Consumption
      2. 8.1.2 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Design Requirements

Table 8-3 shows the design parameters for this example.

If not all the outputs or SYSREF are used, TI recommends to compress the layout to minimize trace lengths, especially that of the input trace. For the multiplier, however, there is a specific range where the multiplier works, so make sure to satisfy those requirements.

Table 8-3 Design Parameters
PARAMETER VALUE
LMX2820 Input Frequency 100 MHz
LMX2820 Output Frequency 3 GHz
LMX1204 Input Clock Frequency 3 GHz
LMX1204 Output Clock Frequency 6 GHz
Multiplier Value x3