SNAS800B July   2021  – February 2024 LMX1204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers and Multiplier
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Outputs
        1. 6.3.3.1 Clock Output Buffers
        2. 6.3.3.2 Clock MUX
        3. 6.3.3.3 Clock Divider
        4. 6.3.3.4 Clock Multiplier and Filter Modes
          1. 6.3.3.4.1 General Information About the Clock Multiplier
          2. 6.3.3.4.2 State Machine Clock for the Clock Multiplier
            1. 6.3.3.4.2.1 State Machine Clock
          3. 6.3.3.4.3 Calibration for the Clock Multiplier
          4. 6.3.3.4.4 Using the x1 Clock Multiplier as a Filter
          5. 6.3.3.4.5 Lock Detect for the Clock Multiplier
      4. 6.3.4 Device Functional Modes Configurations
      5. 6.3.5 LOGICLK Output
        1. 6.3.5.1 LOGICLK Output Format
        2. 6.3.5.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
      6. 6.3.6 SYSREF
        1. 6.3.6.1 SYSREF Output Buffers
          1. 6.3.6.1.1 SYSREF Output Buffers for Main Clocks (SYSREFOUT)
          2. 6.3.6.1.2 SYSREF Output Buffer for LOGICLK
        2. 6.3.6.2 SYSREF Frequency and Delay Generation
        3. 6.3.6.3 SYSREFREQ pins and SYSREFREQ_SPI Field
          1. 6.3.6.3.1 SYSREFREQ Pins Common-Mode Voltage
          2. 6.3.6.3.2 SYSREFREQ Windowing Feature
            1. 6.3.6.3.2.1 General Procedure Flowchart for SYSREF Windowing Operation
            2. 6.3.6.3.2.2 SYSREFREQ Repeater Mode With Delay Gen (Retime)
      7. 6.3.7 SYNC Feature
    4. 6.4 Device Functional Modes
  8. 7 Register Map
    1. 7.1 LMX1204 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SYSREFREQ Input Configuration
      2. 8.1.2 Reducing SYSREF Common Mode Voltages
      3. 8.1.3 Current Consumption
      4. 8.1.4 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.3.6.3.2 SYSREFREQ Windowing Feature

The SYSREF windowing can be used to internally calibrate the timing between the SYSREFREQ and CLKIN pins to optimize setup and hold timing and trim out any mismatches between SYSREFREQ and CLKIN paths. This feature requires that the timing from the SYSREFREQ rising edge to the CLKIN rising edge is consistent. The timing from the SYSREFREQ rising edge to the CLKIN rising edges can be tracked with the rb_CLKPOS field. Once the timing to the rising edge of the CLKIN pin is found, then the SYSREFREQ rising edge can be internally adjusted with the SYSREFREQ_DELAY_STEP and SYSREF_DELAY_STEPSIZE fields to optimize setup or hold times.

GUID-20240214-SS0I-WJVR-RTS4-NWQTDJ6NMVBZ-low.svg Figure 6-9 SYSREFREQ Internal Timing Adjustment