SNAS800 July   2021 LMX1204

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Range of Dividers and Multiplier
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power On Reset
      2. 7.3.2 Clock Outputs
        1. 7.3.2.1 Clock Output Buffers
        2. 7.3.2.2 Clock MUX
        3. 7.3.2.3 Clock Divider
        4. 7.3.2.4 Clock Multiplier
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Output Buffers
          1. 7.3.3.1.1 SYSREF Output Buffer for Main Clocks
          2. 7.3.3.1.2 SYSREF Output Buffer for LOGICLK
        2. 7.3.3.2 SYSREF Frequency and Delay Generation
        3. 7.3.3.3 SYSREFREQ pins
          1. 7.3.3.3.1 SYSREFREQ Pins Common Mode Voltage
          2. 7.3.3.3.2 SYSREFREQ Pin Windowing Feature
        4. 7.3.3.4 SYNC Feature
      4. 7.3.4 LOGICLK Output
        1. 7.3.4.1 LOGICLK Output Format
        2. 7.3.4.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Applications Information
      1. 8.1.1 Current Consumption
      2. 8.1.2 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Current Consumption

The current consumption varies as a function of the setup condition. By adding up all the block currents shown in Table 8-1, a reasonable estimate of the current for any setup condition can be obtained.

Table 8-1 Current Consumption per Block
BLOCK CONDITION CURRENT (mA)
Input Path CLK_MUX = Bypass 257
CLK_MUX = Divide 295
CLK_MUX = Multiply 539
Channel Path SYSREF_EN = 0 28
SYSREF_EN = 1 42
CLKOUT Buffer CLKOUTx_EN = CHx_EN = 1 5.8 × (OUTx_PWR + 1)
SYSOUT Buffer SYSOUT_EN = CHx_EN = 1 74 + SYSOUTx_PWR*5
SYSREF Generator SYSREF_EN = 1 200
SYSREF_EN = 0, SYNC_EN = 1 60
LOGICLK Path SYSREF_EN = 0 55
SYSREF_EN = 1 73
LOGICLK Buffer LOGICLK_FMT = LVDS 12
LOGICLK_FMT = LVPECL 40
LOGICLK_FMT = CML 12
LOGICLK Buffer LOGICLK_FMT = LVPECL 40
LOGICLK_FMT = CML 12
LOGICLK_FMT = LVDS 12

If all the output clocks, LOGICLK, multiplier, and multiplier are all enabled, it is possible for this device to consume a significant amount of current. In order to mitigate this, It is recommended to turn off the SYSREF output buffers when not using the SYSREF feature to conserve current.