SLLS890C August   2008  – April 2024 TL28L92

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configurations and Functions
  5. 4Electrical Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Static Characteristics for 5V Operation
    3. 4.3 Static Characteristics for 3.3V Operation
    4. 4.4 Dynamic Characteristics for 5V Operation
    5. 4.5 Dynamic Characteristics for 3.3V Operation
    6. 4.6 Typical Performance
    7. 4.7 Timing Diagrams
    8. 4.8 Test Information
  6. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Data Bus Buffer
      2. 5.3.2 Operation Control
      3. 5.3.3 Interrupt Control
      4. 5.3.4 FIFO Configuration
      5. 5.3.5 68xxx Mode
      6. 5.3.6 Timing Circuits
        1. 5.3.6.1  Crystal Clock
        2. 5.3.6.2  Baud Rate Generator
        3. 5.3.6.3  Counter/Timer
        4. 5.3.6.4  Timer Mode
        5. 5.3.6.5  Counter Mode
        6. 5.3.6.6  Time-Out Mode
        7. 5.3.6.7  Time-Out Mode Caution
        8. 5.3.6.8  Communications Channels A and B
        9. 5.3.6.9  Input Port
        10. 5.3.6.10 Output Port
      7. 5.3.7 Operation
        1. 5.3.7.1 Transmitter
        2. 5.3.7.2 Receiver
        3. 5.3.7.3 Transmitter Reset and Disable
        4. 5.3.7.4 Receiver FIFO
        5. 5.3.7.5 Receiver Status Bits
        6. 5.3.7.6 Receiver Reset and Disable
        7. 5.3.7.7 Watchdog
        8. 5.3.7.8 Receiver Time-Out Mode
        9. 5.3.7.9 Time-Out Mode Caution
  7. 6Programming
    1. 6.1 Register Overview
    2. 6.2 Condensed Register Bit Formats
    3. 6.3 Register Descriptions
      1. 6.3.1  Mode Registers
        1. 6.3.1.1 Mode Register 0 Channel A (MR0A)
        2. 6.3.1.2 Mode Register 1 Channel A (MR1A)
        3. 6.3.1.3 Mode Register 2 Channel A (MR2A)
        4. 6.3.1.4 Mode Register 0 Channel B (MR0B)
        5. 6.3.1.5 Mode Register 1 Channel B (MR1B)
        6. 6.3.1.6 Mode Register 2 Channel B (MR2B)
      2. 6.3.2  Clock Select Registers
        1. 6.3.2.1 Clock Select Register Channel A (CSRA)
        2. 6.3.2.2 Clock Select Register Channel B (CSRB)
      3. 6.3.3  Command Registers
        1. 6.3.3.1 Command Register Channel A (CRA)
        2. 6.3.3.2 Command Register Channel B (CRB)
      4. 6.3.4  Status Registers
        1. 6.3.4.1 Status Register Channel A (SRA)
        2. 6.3.4.2 Status Register Channel B (SRB)
      5. 6.3.5  Output Configuration Control Register (OPCR)
      6. 6.3.6  Set Output Port Bits Register (SOPR)
      7. 6.3.7  Reset Output Port Bits Register (ROPR)
      8. 6.3.8  Output Port Register (OPR)
      9. 6.3.9  Auxiliary Control Register (ACR)
      10. 6.3.10 Input Port Change Register (IPCR)
      11. 6.3.11 Interrupt Status Register (ISR)
      12. 6.3.12 Interrupt Mask Register (IMR)
      13. 6.3.13 Interrupt Vector Register (IVR; 68xxx Mode) or General Purpose Register (GP; 80xxx Mode)
      14. 6.3.14 Counter and Timer Registers
    4. 6.4 Output Port Notes
    5. 6.5 CTS, RTS, CTS Enable Tx Signals
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Tamb Ambient temperature(2)(3) –40 85 °C
Tstg Storage temperature –65 150 °C
VCC Voltage from VCC to GND(3) –0.5 7 V
VS Voltage from any pin to GND(3) –0.5 VCC + 0.5 V
PD Package power dissipation QFP44 package 1.78 W
HVQFN48 package 0.5
Pder Dissipation derating factor (above 25°C) QFP44 package 14 mW/°C
HVQFN48 package 28
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For operation at elevated temperatures, the device must be derated based on 150°C maximum junction temperature.
(3) Parameters are valid over specified temperature range.