SBASAE4 December   2025 ADS125P08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 SFDR Measurement
    12. 6.12 Noise Performance
    13. 6.13 TUE (Total Unadjusted Error) Measurement
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Multiplexer
      2. 7.3.2  High-Impedance Input Buffers
      3. 7.3.3  Input Range
      4. 7.3.4  ADC Reference Voltage
      5. 7.3.5  Power Supplies
        1. 7.3.5.1 AVDD and AVSS
        2. 7.3.5.2 IOVDD
        3. 7.3.5.3 CAPA and CAPD
        4. 7.3.5.4 Power-On Reset (POR)
      6. 7.3.6  Clock Operation
        1. 7.3.6.1 Internal Oscillator
        2. 7.3.6.2 External Clock
      7. 7.3.7  Modulator
      8. 7.3.8  Digital Filter
        1. 7.3.8.1 Digital Filter Latency
        2. 7.3.8.2 Sinc3 and Sinc4 Filters
        3. 7.3.8.3 Sinc4 + Sinc1 Cascade Filter
        4. 7.3.8.4 50/60Hz Notch Filters
      9. 7.3.9  FIFO Buffer
        1. 7.3.9.1 FIFO Buffer Read and Write
        2. 7.3.9.2 FIFO Overflow and Underflow
        3. 7.3.9.3 FIFO Depth Indicator
        4. 7.3.9.4 FIFO Enable and Flush
        5. 7.3.9.5 FIFO Thresholds
      10. 7.3.10 Channel Auto-Sequencer
        1. 7.3.10.1 Auto-Sequencer: Basic Operation
        2. 7.3.10.2 Sequencer Modes
          1. 7.3.10.2.1 Single-Shot Mode
          2. 7.3.10.2.2 Single Step Continuous Conversion Mode
          3. 7.3.10.2.3 Single Sequence Mode
          4. 7.3.10.2.4 Continuous Sequence Mode
        3. 7.3.10.3 Configuring the Auto-Sequencer
        4. 7.3.10.4 Starting and Stopping the Sequencer
        5. 7.3.10.5 Auto-Sequencer and DRDY Behavior
      11. 7.3.11 Offset and Gain Calibration
      12. 7.3.12 General Purpose IOs (GPIOs)
        1. 7.3.12.1 DRDY Output
        2. 7.3.12.2 FAULT Output
      13. 7.3.13 Burn-Out Current Sources
      14. 7.3.14 Open Wire Detection with ADC 0-code output
      15. 7.3.15 System Monitors
        1. 7.3.15.1 Internal Short (Offset Calibration)
        2. 7.3.15.2 Internal Temperature Sensor
        3. 7.3.15.3 External Reference Voltage Readback
        4. 7.3.15.4 Power-Supply Readback
      16. 7.3.16 Monitor Flags, Indicators and Counters
        1. 7.3.16.1  Reset (RESETn flag)
        2. 7.3.16.2  AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.16.3  Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.16.4  Modulator Overrange Monitor (MOD_OVR_FAULTn flag)
        5. 7.3.16.5  Register Map CRC (REG_MAP_CRC_FAULTn flag)
        6. 7.3.16.6  Memory Map CRC (MEM_INTERNAL_FAULTn flag)
        7. 7.3.16.7  FIFO Overflow (FIFO_OFn flag) and FIFO Underflow (FIFO_UFn flag)
        8. 7.3.16.8  FIFO CRC Fault (FIFO_CRC_FAULTn flag)
        9. 7.3.16.9  GPIO Readback
        10. 7.3.16.10 SPI CRC Fault (SPI_CRC_FAULTn flag)
        11. 7.3.16.11 Register Write Fault (REG_WRITE_FAULTn flag)
        12. 7.3.16.12 DRDY Indicator (DRDY bit)
        13. 7.3.16.13 Sequencer Active Indicator (SEQ_ACTIVE bit)
        14. 7.3.16.14 Sequence Step Indicator (STEP_INDICATOR[4:0])
        15. 7.3.16.15 ADC Conversion Counter (CONV_COUNT[3:0])
        16. 7.3.16.16 FIFO Depth Indicator (FIFO_DEPTH[8:0])
        17. 7.3.16.17 Completed Sequence Counter (SEQ_COUNT[3:0])
      17. 7.3.17 Test DAC (TDAC)
      18. 7.3.18 Parallel Post Filters
        1. 7.3.18.1 Configuring the Parallel Post Filters
        2. 7.3.18.2 Frequency Response of the Parallel Post Filters
        3. 7.3.18.3 Settling Times and DRDY Behavior When Using the Post Filters
        4. 7.3.18.4 Examples of Recommended Post Filter Settings
      19. 7.3.19 Chip Select Forwarding
        1. 7.3.19.1 Configuring the CS forward feature
        2. 7.3.19.2 CS Forward Timeout
        3. 7.3.19.3 CS Forward Header, Frame, and State Diagram
        4. 7.3.19.4 Disabling the CS-FWD mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Scalable Speed Modes
      2. 7.4.2 Sequencer Functional Modes
      3. 7.4.3 Idle Mode and Standby Mode
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Reset
        1. 7.4.5.1 RESET Pin
        2. 7.4.5.2 Reset by SPI Register Write
        3. 7.4.5.3 Reset by SPI Input Pattern
      6. 7.4.6 Synchronization
      7. 7.4.7 Conversion-Start Delay Time
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No-Operation
        2. 7.5.4.2 Read Conversion Data
        3. 7.5.4.3 Read Register Command
        4. 7.5.4.4 Write Register Command
        5. 7.5.4.5 Read FIFO Buffer Command
      5. 7.5.5  Continuous Read Mode
        1. 7.5.5.1 Read Conversion Data in Continuous Read Mode
        2. 7.5.5.2 Read Registers in Continuous Read Mode
        3. 7.5.5.3 Read FIFO Buffer in Continuous Read Mode
      6. 7.5.6  SPI communication after POR or Reset
      7. 7.5.7  DRDY Pin Behavior
      8. 7.5.8  Daisy-Chain Operation
      9. 7.5.9  3-Wire SPI Mode
        1. 7.5.9.1 3-Wire SPI Mode Frame Re-Align
      10. 7.5.10 Conversion Data
      11. 7.5.11 Data Ready
        1. 7.5.11.1 DRDY Pin and SDO/DRDY Pin
        2. 7.5.11.2 DRDY Bit
        3. 7.5.11.3 Clock Counting
    6. 7.6 Register Map
      1. 7.6.1 ADS125P08 Status and General Configuration Page
      2. 7.6.2 ADS125P08 Step Configuration Page
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Serial Interface Connections
      2. 8.1.2 Interfacing with Multiple Devices
      3. 8.1.3 Unused Inputs and Outputs
      4. 8.1.4 Device Initialization
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots - Crosstalk
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supplies
      2. 8.3.2 Power-Supply Sequencing
      3. 8.3.3 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.4.6 Synchronization

Conversions are synchronized and controlled by the START pin or, optionally, through SPI operation. If controlling conversions through SPI operation, keep the START pin low to avoid contention with the pin.

A conversion starts when writing 1b to the START bit. Likewise, a conversion stops when writing a 1b to the STOP bit. The stop behavior is configurable using the STOP_BEHAVIOR[1:0] bits. See the Starting and Stopping the Sequencer section for details on the stop behavior. Writing a 1b to the START and STOP bits at the same time has no effect on conversions.

The Start bit clears after a sequence begins so the bit reads back 0b. The Stop bit clears after the sequencer stops. The user can read back 1b if the sequencer hasn’t completed a sequence after writing Stop bit.

Configure the GPIO0/START pin to START pin operation using the GPIO0_CFG[1:0] bits. A rising edge on the START pin is equivalent to writing to the START bit. A falling edge on the START pin is equivalent to writing to the STOP bit. The step page is determined by the STEP_INIT[4:0] bits, just as with the START and STOP bits. If the START pin is high at power-up, a start operation begins after the power-up cycle completes. See the Starting and Stopping the Sequencer section for details.

If a start is issued during a conversion, the conversion stops and restarts. If a start is issued while a stop request is pending (per STOP_BEHAVIOR[1:0]), the stop request is cleared and a new start initiates.

When a start event occurs, either from the START pin or writing the START bit, a new conversion begins as soon as the modulator is ready. The wait time depends on whether the ADC is in idle or standby mode, and the data rate, the filter mode and are a combination of internal and user-set values.

After the ADC is synchronized, the first conversion is fully settled data but incurs a delay (latency time) compared to the normal data period. This latency is needed to account for full settling of the digital filter. The latency time depends on the data rate and the filter mode (see the Digital Filter section for filter latency details).