SBASAE4 December   2025 ADS125P08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 SFDR Measurement
    12. 6.12 Noise Performance
    13. 6.13 TUE (Total Unadjusted Error) Measurement
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Multiplexer
      2. 7.3.2  High-Impedance Input Buffers
      3. 7.3.3  Input Range
      4. 7.3.4  ADC Reference Voltage
      5. 7.3.5  Power Supplies
        1. 7.3.5.1 AVDD and AVSS
        2. 7.3.5.2 IOVDD
        3. 7.3.5.3 CAPA and CAPD
        4. 7.3.5.4 Power-On Reset (POR)
      6. 7.3.6  Clock Operation
        1. 7.3.6.1 Internal Oscillator
        2. 7.3.6.2 External Clock
      7. 7.3.7  Modulator
      8. 7.3.8  Digital Filter
        1. 7.3.8.1 Digital Filter Latency
        2. 7.3.8.2 Sinc3 and Sinc4 Filters
        3. 7.3.8.3 Sinc4 + Sinc1 Cascade Filter
        4. 7.3.8.4 50/60Hz Notch Filters
      9. 7.3.9  FIFO Buffer
        1. 7.3.9.1 FIFO Buffer Read and Write
        2. 7.3.9.2 FIFO Overflow and Underflow
        3. 7.3.9.3 FIFO Depth Indicator
        4. 7.3.9.4 FIFO Enable and Flush
        5. 7.3.9.5 FIFO Thresholds
      10. 7.3.10 Channel Auto-Sequencer
        1. 7.3.10.1 Auto-Sequencer: Basic Operation
        2. 7.3.10.2 Sequencer Modes
          1. 7.3.10.2.1 Single-Shot Mode
          2. 7.3.10.2.2 Single Step Continuous Conversion Mode
          3. 7.3.10.2.3 Single Sequence Mode
          4. 7.3.10.2.4 Continuous Sequence Mode
        3. 7.3.10.3 Configuring the Auto-Sequencer
        4. 7.3.10.4 Starting and Stopping the Sequencer
        5. 7.3.10.5 Auto-Sequencer and DRDY Behavior
      11. 7.3.11 Offset and Gain Calibration
      12. 7.3.12 General Purpose IOs (GPIOs)
        1. 7.3.12.1 DRDY Output
        2. 7.3.12.2 FAULT Output
      13. 7.3.13 Burn-Out Current Sources
      14. 7.3.14 Open Wire Detection with ADC 0-code output
      15. 7.3.15 System Monitors
        1. 7.3.15.1 Internal Short (Offset Calibration)
        2. 7.3.15.2 Internal Temperature Sensor
        3. 7.3.15.3 External Reference Voltage Readback
        4. 7.3.15.4 Power-Supply Readback
      16. 7.3.16 Monitor Flags, Indicators and Counters
        1. 7.3.16.1  Reset (RESETn flag)
        2. 7.3.16.2  AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.16.3  Reference Undervoltage Monitor (REV_UVn flag)
        4. 7.3.16.4  Modulator Overrange Monitor (MOD_OVR_FAULTn flag)
        5. 7.3.16.5  Register Map CRC (REG_MAP_CRC_FAULTn flag)
        6. 7.3.16.6  Memory Map CRC (MEM_INTERNAL_FAULTn flag)
        7. 7.3.16.7  FIFO Overflow (FIFO_OFn flag) and FIFO Underflow (FIFO_UFn flag)
        8. 7.3.16.8  FIFO CRC Fault (FIFO_CRC_FAULTn flag)
        9. 7.3.16.9  GPIO Readback
        10. 7.3.16.10 SPI CRC Fault (SPI_CRC_FAULTn flag)
        11. 7.3.16.11 Register Write Fault (REG_WRITE_FAULTn flag)
        12. 7.3.16.12 DRDY Indicator (DRDY bit)
        13. 7.3.16.13 Sequencer Active Indicator (SEQ_ACTIVE bit)
        14. 7.3.16.14 Sequence Step Indicator (STEP_INDICATOR[4:0])
        15. 7.3.16.15 ADC Conversion Counter (CONV_COUNT[3:0])
        16. 7.3.16.16 FIFO Depth Indicator (FIFO_DEPTH[8:0])
        17. 7.3.16.17 Completed Sequence Counter (SEQ_COUNT[3:0])
      17. 7.3.17 Test DAC (TDAC)
      18. 7.3.18 Parallel Post Filters
        1. 7.3.18.1 Configuring the Parallel Post Filters
        2. 7.3.18.2 Frequency Response of the Parallel Post Filters
        3. 7.3.18.3 Settling Times and DRDY Behavior When Using the Post Filters
        4. 7.3.18.4 Examples of Recommended Post Filter Settings
      19. 7.3.19 Chip Select Forwarding
        1. 7.3.19.1 Configuring the CS forward feature
        2. 7.3.19.2 CS Forward Timeout
        3. 7.3.19.3 CS Forward Header, Frame, and State Diagram
        4. 7.3.19.4 Disabling the CS-FWD mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Scalable Speed Modes
      2. 7.4.2 Sequencer Functional Modes
      3. 7.4.3 Idle Mode and Standby Mode
      4. 7.4.4 Power-Down Mode
      5. 7.4.5 Reset
        1. 7.4.5.1 RESET Pin
        2. 7.4.5.2 Reset by SPI Register Write
        3. 7.4.5.3 Reset by SPI Input Pattern
      6. 7.4.6 Synchronization
      7. 7.4.7 Conversion-Start Delay Time
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No-Operation
        2. 7.5.4.2 Read Conversion Data
        3. 7.5.4.3 Read Register Command
        4. 7.5.4.4 Write Register Command
        5. 7.5.4.5 Read FIFO Buffer Command
      5. 7.5.5  Continuous Read Mode
        1. 7.5.5.1 Read Conversion Data in Continuous Read Mode
        2. 7.5.5.2 Read Registers in Continuous Read Mode
        3. 7.5.5.3 Read FIFO Buffer in Continuous Read Mode
      6. 7.5.6  SPI communication after POR or Reset
      7. 7.5.7  DRDY Pin Behavior
      8. 7.5.8  Daisy-Chain Operation
      9. 7.5.9  3-Wire SPI Mode
        1. 7.5.9.1 3-Wire SPI Mode Frame Re-Align
      10. 7.5.10 Conversion Data
      11. 7.5.11 Data Ready
        1. 7.5.11.1 DRDY Pin and SDO/DRDY Pin
        2. 7.5.11.2 DRDY Bit
        3. 7.5.11.3 Clock Counting
    6. 7.6 Register Map
      1. 7.6.1 ADS125P08 Status and General Configuration Page
      2. 7.6.2 ADS125P08 Step Configuration Page
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Serial Interface Connections
      2. 8.1.2 Interfacing with Multiple Devices
      3. 8.1.3 Unused Inputs and Outputs
      4. 8.1.4 Device Initialization
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots - Crosstalk
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supplies
      2. 8.3.2 Power-Supply Sequencing
      3. 8.3.3 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.10 Channel Auto-Sequencer

The ADS125P08 controls ADC conversion by means of a highly flexible channel auto-sequencer (or "sequencer"). The ADS125P08 sequencer offers up to 32 individual sequence steps. Sequence steps are operating modes which are executed sequentially: Each sequence step (or "step") represents a finite number of ADC conversions (programmable 1 up to 512 per step) and an independent configuration of the ADC for this step, including input channel selection, gain/offset, digital filter settings and timing parameters.

The sequencer stores multiple independent configurations of the ADC in the device memory up front (immediately after power-up), eliminating the need for SPI communication to re-configure the device during the subsequent device operation. This is beneficial in applications where data from very different signal sources is acquired sequentially in a short timeframe. Many of those applications require to switch between multiple ADC configurations for time-interleaving of sensor measurements (high precision, low speed) with diagnostic measurements (low precision, high speed).

The sequencer operation and configuration is controlled by multiple register pages in the user register space: A separate register page exists for each step configuration (pages 1 to 32), referred to as the "Step Configuration Pages". The step registers are identified by the prefix "STEP_x", with x = 0 to 31 indicating the sequence step number, see the Register Map section. Page 0 is referred to as the "Status and General Configuration Page" (or just "General Configuration Page") and holds status and generic configuration data.

The 32 sequence steps are individually enabled or disabled using the SEQ_STEP_x_EN bits (x = 0 to 31) on the General Configuration Page. Figure 7-20 shows the register page structure and illustrates the relationship between step enable bits and corresponding Step Configuration Pages.

ADS125P08 Register Page Structure Figure 7-20 Register Page Structure

The General Configuration Page, as well as the individual Step Configuration Pages are addressed using the PAGE_POINTER[7:0] register, which is available on all pages at the same absolute address. See the Configuring the Auto-Sequencer section for details on page addressing, and how to configure the auto-sequencer.

The CONVERSION_CTRL, SEQUENCER_CFG and SEQUENCE_STEP_EN_n (n = 0 to 4) registers in the Status and General Configuration Page control the flow of the sequencer. See the Auto-Sequencer: Basic Operation section, the Sequencer Modes section and the Starting and Stopping the Sequencer section for details on how to control the sequencer flow.

The sequencer operation can be monitored by detecting transitions of the DRDY pin. See the Auto-Sequencer and DRDY Behavior section for details.

Table 7-26 provides an overview of the sequencer architecture.

Table 7-19 Auto-Sequencer Architecture
SPECIFICATION VALUE DESCRIPTION
Architecture Register page based sequencer

1 Status and General Configuration Page (holds enable bits for all sequence steps).

1 Step Configuration Page per sequence step.
Maximum number of sequence steps 32 Up to 32 individual pages available to define sequence step configurations.
Maximum number of conversions per step 512 Up to 512 ADC conversions for each sequence step. Individually programmable for each step.