SLAAET6 August 2025
In automotive applications, high-speed signal interfaces such as video serializer/deserializer (SerDes), Multi-Gigabit Ethernet, USB3.x, and DisplayPort (DP) are increasingly deployed to meet growing bandwidth demand. The single-link data rate of these interfaces can reach multi-gigabit or even tens of gigabits per second.
Signal integrity (SI) is critical for reliable high-speed signal transmission, as waveform distortions caused by reflections, impedance mismatches, crosstalk, or signal attenuation can lead to data corruption and communication failures. To provide robustness, these interfaces define stringent S-parameter requirements, including return loss (S11) and insertion loss (S21), across the entire high-speed channel to maintain maximum performance.
For instance, TI's latest FPD-Link SerDes can now support data rates up to 13.5Gbps over a single coax cable to support 4K+ resolution display. The total FPD-Link™ interface channel comprises a printed circuit board (PCB), passive components, connectors, and cables. Among these, PCB layout design plays a pivotal role in signal integrity preservation. Key design considerations include controlled trace impedance, strategic component placement and via placement, anti-pad sizing, parasitic capacitance mitigation, and so forth.
This application note takes the FPD-Link coax channel design as an example, focusing on PCB channel design requirements and actionable layout design guidelines to optimize PCB S-parameters.