SLAAET6 August 2025
To counteract pad-introduced impedance deviation, create a ground cutout (anti-pad) under the landing pads on the adjacent reference layer (for example, layer 2). This forces the pad to reference a more distant layer (for example, layer 3), effectively increases the dielectric thickness and raising impedance to offset the capacitive effect of the bigger pad.
Anti-pad size requires careful consideration. Oversized or undersized anti-pad can disrupt the electromagnetic fields and affect signal coupling between the trace and reference plane, which in turn affects the signal impedance.
The best anti-pad size depends on various factors such as the dielectric thickness, trace width, and pad dimensions. Use simulation tools (for example, Ansys® HFSS) to analyze pad effects and determine the best possible anti-pad size.