SLVSHJ7A February   2025  – September 2025 DRV8163-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1. 5.1 HW Variant
    2. 5.2 SPI Variant
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Timing Diagrams
    7. 6.7 Thermal Information
      1. 6.7.1 Transient Thermal Impedance & Current Capability
    8. 6.8 Switching Waveforms
      1. 6.8.1 Output switching transients
        1. 6.8.1.1 High-Side Recirculation
        2. 6.8.1.2 Low-Side Recirculation
      2. 6.8.2 Wake-up Transients
        1. 6.8.2.1 HW Variant
        2. 6.8.2.2 SPI Variant
      3. 6.8.3 Fault Reaction Transients
        1. 6.8.3.1 Retry setting
        2. 6.8.3.2 Latch setting
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
        1. 7.3.1.1 HW Variant
        2. 7.3.1.2 SPI Variant
      2. 7.3.2 Bridge Control
        1. 7.3.2.1 Register - Pin Control - SPI Variant Only
      3. 7.3.3 Device Configuration
        1. 7.3.3.1 Slew Rate (SR)
        2. 7.3.3.2 IPROPI
        3. 7.3.3.3 ITRIP Regulation
        4. 7.3.3.4 DIAG
          1. 7.3.3.4.1 HW variant
          2. 7.3.3.4.2 SPI variant
      4. 7.3.4 Protection and Diagnostics
        1. 7.3.4.1 Over Current Protection (OCP)
        2. 7.3.4.2 Over Temperature Warning (OTW) - SPI Variant Only
        3. 7.3.4.3 Over Temperature Protection (TSD)
        4. 7.3.4.4 Off-State Diagnostics (OLP)
        5. 7.3.4.5 On-State Diagnostics (OLA) - SPI Variant Only
        6. 7.3.4.6 VM Over Voltage Monitor - SPI Variant Only
        7. 7.3.4.7 VM Under Voltage Monitor
        8. 7.3.4.8 Power On Reset (POR)
        9. 7.3.4.9 Event Priority
      5. 7.3.5 Device Functional Modes
        1. 7.3.5.1 SLEEP State
        2. 7.3.5.2 STANDBY State
        3. 7.3.5.3 Wake-up to STANDBY State
        4. 7.3.5.4 ACTIVE State
        5. 7.3.5.5 nSLEEP Reset Pulse (HW Variant, LATCHED setting Only)
      6. 7.3.6 Programming - SPI Variant Only
        1. 7.3.6.1 Serial Peripheral Interface (SPI)
        2. 7.3.6.2 Standard Frame
        3. 7.3.6.3 SPI for Multiple Peripherals
          1. 7.3.6.3.1 Daisy Chain Frame for Multiple Peripherals
      7. 7.3.7 Register Map - SPI Variant Only
        1. 7.3.7.1 User Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Load Summary
    2. 8.2 Typical Application
      1. 8.2.1 HW Variant
      2. 8.2.2 SPI Variant
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance Sizing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.3.3.2 IPROPI

The device features an output (IPROPI pin) for current sensing and die temperature measurement. This information can be used for status or regulation of loads (on OUTx), or to check die temperature. These integrated features eliminate the need for multiple external sense resistors or sense circuitry, reducing system size, cost and complexity.

The device senses the load current by using a shunt-less high-side current mirror topology. This way the device can only sense an uni-directional high-side current from VM → OUT → Load through the high-side FET when the device is fully turned ON (linear mode).

The IPROPI pin must be connected to an external resistor (RIPROPI) to ground to generate a proportional voltage VIPROPI. This allows for the load current to be measured as a voltage-drop across the RIPROPI resistor with an analog to digital converter (ADC). The RIPROPI resistor can be sized based on the expected load current in the application so that the full range of the controller ADC is utilized.

Depending on the ISEL bits setting, the IPROPI pin can also output analog current representation of the die temperature. This is intended for use in testing and evaluation, but not during device run-time.

Table 7-5 ISEL settings for DRV8163-Q1

ISEL

IPROPI

11bIHS x AIPROPI
00b

Die Temperature Readout

Note: ISEL = 01b or 10b are not recommended

When the IPROPI output is configured for die temperature readout, the device outputs a current as per the following formula -

Current (μA) = 3.00 * (Temperature in °C) + 863

This equation is valid for temperatures between -40 °C and 185 °C. For example, when the die temperature is 85° C and ISEL is selected for the die temperature readout, current out of the IPROPI pin is 1.118mA.