SLVSHJ7A February   2025  – September 2025 DRV8163-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
    1. 5.1 HW Variant
    2. 5.2 SPI Variant
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Timing Diagrams
    7. 6.7 Thermal Information
      1. 6.7.1 Transient Thermal Impedance & Current Capability
    8. 6.8 Switching Waveforms
      1. 6.8.1 Output switching transients
        1. 6.8.1.1 High-Side Recirculation
        2. 6.8.1.2 Low-Side Recirculation
      2. 6.8.2 Wake-up Transients
        1. 6.8.2.1 HW Variant
        2. 6.8.2.2 SPI Variant
      3. 6.8.3 Fault Reaction Transients
        1. 6.8.3.1 Retry setting
        2. 6.8.3.2 Latch setting
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
        1. 7.3.1.1 HW Variant
        2. 7.3.1.2 SPI Variant
      2. 7.3.2 Bridge Control
        1. 7.3.2.1 Register - Pin Control - SPI Variant Only
      3. 7.3.3 Device Configuration
        1. 7.3.3.1 Slew Rate (SR)
        2. 7.3.3.2 IPROPI
        3. 7.3.3.3 ITRIP Regulation
        4. 7.3.3.4 DIAG
          1. 7.3.3.4.1 HW variant
          2. 7.3.3.4.2 SPI variant
      4. 7.3.4 Protection and Diagnostics
        1. 7.3.4.1 Over Current Protection (OCP)
        2. 7.3.4.2 Over Temperature Warning (OTW) - SPI Variant Only
        3. 7.3.4.3 Over Temperature Protection (TSD)
        4. 7.3.4.4 Off-State Diagnostics (OLP)
        5. 7.3.4.5 On-State Diagnostics (OLA) - SPI Variant Only
        6. 7.3.4.6 VM Over Voltage Monitor - SPI Variant Only
        7. 7.3.4.7 VM Under Voltage Monitor
        8. 7.3.4.8 Power On Reset (POR)
        9. 7.3.4.9 Event Priority
      5. 7.3.5 Device Functional Modes
        1. 7.3.5.1 SLEEP State
        2. 7.3.5.2 STANDBY State
        3. 7.3.5.3 Wake-up to STANDBY State
        4. 7.3.5.4 ACTIVE State
        5. 7.3.5.5 nSLEEP Reset Pulse (HW Variant, LATCHED setting Only)
      6. 7.3.6 Programming - SPI Variant Only
        1. 7.3.6.1 Serial Peripheral Interface (SPI)
        2. 7.3.6.2 Standard Frame
        3. 7.3.6.3 SPI for Multiple Peripherals
          1. 7.3.6.3.1 Daisy Chain Frame for Multiple Peripherals
      7. 7.3.7 Register Map - SPI Variant Only
        1. 7.3.7.1 User Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Load Summary
    2. 8.2 Typical Application
      1. 8.2.1 HW Variant
      2. 8.2.2 SPI Variant
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance Sizing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.8.3.1 Retry setting

DRV8163-Q1 Fault reaction with RETRY setting (shown for OCP occurrence on high-side when OUT is shorted to ground)Figure 6-10 Fault reaction with RETRY setting (shown for OCP occurrence on high-side when OUT is shorted to ground)

Short occurrence and recovery scenario with RETRY setting:

  • t1: An external short occurs.
  • t2: OCP (Over Current Protection) fault confirmed after tOCP, output disabled, nFAULT asserted low to indicate fault.
  • t3: Device automatically attempts retry (auto retry) after tRETRY. Each time output is briefly turned on to confirm short occurrence and then immediately disabled after tOCP. nFAULT remains asserted low through out. Cycle repeats till driver is disabled by the user or external short is removed, as illustrated further. Note that, in case of a TSD (Thermal Shut Down) event, automatic retry time depends on the cool off based on thermal hysteresis.
  • t4: The external short is removed.
  • t5: Device attempts auto retry. But this time, no fault occurs and device continues to keep the output enabled.
  • t6: After a fault free operation for a period of tCLEAR is confirmed, nFAULT is de-asserted.
  • SPI variant only – Fault status remains latched until a CLR_FLT command is issued.

Note that, in the event of an output short to ground causing the high-side OCP fault detection, IPROPI pin continues to be pulled up to VIPROPI_LIM voltage to indicate this type of short, while the output is disabled. This is especially useful for the HW variant to differentiate the indication of a short to ground fault from the other faults.