SLVSHX5A July   2025  – December 2025 TPS2HC08-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Accurate Current Sense
        1. 8.3.1.1 SNS Response Time
        2. 8.3.1.2 SNS Output Filter
        3. 8.3.1.3 Multiplexing of Current Sense Across Channels
        4. 8.3.1.4 Multiplexing of Current Sense Across Devices
      2. 8.3.2  Overcurrent Protection
        1. 8.3.2.1 Adjustable Current Limit
          1. 8.3.2.1.1 Current Limiting With Thermal Regulation
          2. 8.3.2.1.2 Current Limiting With No Thermal Regulation
          3. 8.3.2.1.3 Current Limit Foldback
          4. 8.3.2.1.4 Current Limit Accuracy
        2. 8.3.2.2 Thermal Shutdown
          1. 8.3.2.2.1 Relative Thermal Shutdown
          2. 8.3.2.2.2 Absolute Thermal Shutdown
      3. 8.3.3  Retry Protection Mechanism From Thermal Shutdown
        1. 8.3.3.1 Reliable Switch-On Behavior
      4. 8.3.4  Inductive-Load Switching-Off Clamp
      5. 8.3.5  Slower Slew Rate Option
      6. 8.3.6  Capacitive Load Charging
        1. 8.3.6.1 Adjustable Current Limiting for Inrush Control
        2. 8.3.6.2 Current Limit with Thermal Regulation for Capacitive Loads
        3. 8.3.6.3 Retry Thermal Shutdown Behavior for Capacitive Loads
        4. 8.3.6.4 Impact of DC Load on Capacitive Charging Capability
        5. 8.3.6.5 Device Capability
      7. 8.3.7  Bulb Charging
        1. 8.3.7.1 Non-Thermal Regulated Mode for Bulb Loads
        2. 8.3.7.2 Thermal Management During Bulb Inrush
        3. 8.3.7.3 Device Capability
      8. 8.3.8  Fault Detection and Reporting
        1. 8.3.8.1 Diagnostic Enable Function
        2. 8.3.8.2 FLT Reporting
        3. 8.3.8.3 FLT Timings
        4. 8.3.8.4 Fault Table
      9. 8.3.9  Full Diagnostics
        1. 8.3.9.1 Open-Load Detection
          1. 8.3.9.1.1 Channel On
          2. 8.3.9.1.2 Channel Off
        2. 8.3.9.2 Short-to-Battery Detection
        3. 8.3.9.3 Reverse-Polarity and Battery Protection
      10. 8.3.10 Full Protections
        1. 8.3.10.1 UVLO Protection
        2. 8.3.10.2 Loss of GND Protection
        3. 8.3.10.3 Loss of Power Supply Protection
        4. 8.3.10.4 Reverse Current Protection
        5. 8.3.10.5 Protection for MCU I/Os
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 EMC Transient Disturbances Test
      3. 9.2.3 Transient Thermal Performance
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
      3. 9.4.3 Wettable Flank Package
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Adjustable Current Limiting for Inrush Control

Adjustable current limit feature of the device allows precise control of inrush current during capacitive load charging. By selecting an appropriate external resistor value on the ILIM pin, designers can:

  • Tailor the maximum charging current to match specific capacitive load requirements.

  • Protect upstream power supplies from excessive current draw during startup.

  • Reduce PCB trace width requirements and connector sizing by limiting peak currents.

  • Minimize voltage droop on the supply rail during capacitive charging.

  • Enable the use of smaller, more cost-effective components throughout the system.

Figure 8-30 and Figure 8-31 compares the 1mF capacitive load charging at same conditions with device configured to minimum (ILIM pin OPEN) and maximum (ILIM pin shorted to ground (STG)) current limit setting. The lower current limit limits the inrush current while charging the 1mF capacitive load and provides clean startup of the load without triggering thermal shutdown.

TPS2HC08-Q1 1mF Capacitive Load Charging with Channel 1 of TPS2HC08-Q1 Device at 13.5V VBB, ILIM Pin shorted to ground and 125°C Ambient Temperature (no load on channel 2)Figure 8-30 1mF Capacitive Load Charging with Channel 1 of TPS2HC08-Q1 Device at 13.5V VBB, ILIM Pin shorted to ground and 125°C Ambient Temperature (no load on channel 2)
TPS2HC08-Q1 1mF Capacitive Load Charging with Channel 1 of TPS2HC08-Q1 Device at 13.5V VBB, ILIM Pin OPEN and 125°C Ambient Temperature (no load on channel 2)Figure 8-31 1mF Capacitive Load Charging with Channel 1 of TPS2HC08-Q1 Device at 13.5V VBB, ILIM Pin OPEN and 125°C Ambient Temperature (no load on channel 2)