SNAU297 July   2025 LMK5B12212 , LMK5C22212A

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 Using LMK5B12212EVM to evaluate LMK5C22212A
  6. 2Hardware
    1. 2.1 Test Equipment Recommended
    2. 2.2 LMK5B12212EVM Default Settings
    3. 2.3 EVM Quick Start
  7. 3Software
    1. 3.1 Getting Started With TICS Pro
    2. 3.2 Programming the LMK5B12212
    3. 3.3 Configuring TICS Pro
      1. 3.3.1  Using the Start Page
        1. 3.3.1.1 Step 1
        2. 3.3.1.2 Step 2
        3. 3.3.1.3 Step 3
        4. 3.3.1.4 Step 4
        5. 3.3.1.5 Step 5
        6. 3.3.1.6 Step 6
        7. 3.3.1.7 Step 7
        8. 3.3.1.8 Step 8
      2. 3.3.2  Using the Status Page
      3. 3.3.3  Using the Input Page
        1. 3.3.3.1 Cascaded Configurations
          1. 3.3.3.1.1 Cascade VCO to APLL Reference
      4. 3.3.4  Using APLLx Pages
        1. 3.3.4.1 APLL DCO
      5. 3.3.5  Using the DPLLx Page
        1. 3.3.5.1 DPLL DCO
      6. 3.3.6  Using the Validation Page
      7. 3.3.7  Using the GPIO Page
        1. 3.3.7.1 SYNC/SYSREF/1-PPS Page
      8. 3.3.8  Using the Outputs Page
      9. 3.3.9  EEPROM Page
      10. 3.3.10 Design Report Page
  8. 4EVM Configuration
    1. 4.1 Evaluation Setup
      1. 4.1.1 Power Supply
      2. 4.1.2 Logic Inputs and Outputs
      3. 4.1.3 Switching Between I2C and SPI
      4. 4.1.4 Generating SYSREF Request
      5. 4.1.5 XO Input
        1. 4.1.5.1 48MHz TCXO (Default)
        2. 4.1.5.2 External Clock Input
        3. 4.1.5.3 Additional XO Input Options
        4. 4.1.5.4 APLL Reference Options
      6. 4.1.6 Reference Clock Inputs
      7. 4.1.7 Clock Outputs
      8. 4.1.8 Status Outputs and LEDS
      9. 4.1.9 Requirements for Making Measurements
    2. 4.2 Typical Phase Noise Characteristics
  9. 5Hardware Design Files
    1. 5.1 Schematics
      1. 5.1.1  Power Supply Schematic
      2. 5.1.2  Alternative Power Supply Schematic
      3. 5.1.3  Power Distribution Schematic
      4. 5.1.4  LMK5B12212 and Input References IN0 to IN1 Schematic
      5. 5.1.5  Clock Outputs OUT0 to OUT3 Schematic
      6. 5.1.6  Clock Outputs OUT4 to OUT7 Schematic
      7. 5.1.7  Clock Outputs OUT8 to OUT11 Schematic
      8. 5.1.8  XO Schematic
      9. 5.1.9  Logic I/O Interfaces Schematic
      10. 5.1.10 USB2ANY Schematic
    2. 5.2 PCB Layouts
      1. 5.2.1 Layout Guidelines
      2. 5.2.2 Layout Example
      3. 5.2.3 Thermal Reliability
    3. 5.3 Bill of Materials (BOM)
      1. 5.3.1 Loop Filter and Vibration Nonsensitive Capacitors

5.2.1 Layout Guidelines

  • Isolate input, XO/OCXO/TCXO and output clocks from adjacent clocks with different frequencies and other nearby dynamic signals.
  • Consider the XO/OCXO/TCXO placement and layout in terms of the supply/ground noise and thermal gradients from nearby circuitry (for example, power supplies, FPGA, ASIC) as well as system-level vibration and shock. These factors can affect the frequency stability/accuracy and transient performance of the oscillator.
  • Avoid impedance discontinuities on controlled-impedance 50Ω single-ended (or 100Ω differential) traces for clock and dynamic logic signals.
  • Place bypass capacitors close to the VDD and VDDO pins on the same side as the IC, or directly below the IC pins on the opposite side of the PCB. Larger decoupling capacitor values can be placed further away.
  • Place external capacitors close to the CAP_x and LFx pins.
  • Use multiple vias to connect wide supply traces to the respective power islands or planes if possible.
  • Use at least a 6×6 through-hole via pattern to connect the IC ground/thermal pad to the PCB ground planes.
  • See the Land Pattern Example, Solder Mask Details, and Solder Paste Example in Mechanical, Packaging, and Orderable Information section.