TIDUF75 April   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 System Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1  Determining the Number of eFuse Devices to use in Parallel
      2. 2.2.2  Setting up the Primary and Secondary Devices in a Parallel Configuration
      3. 2.2.3  Selecting the CDVDT Capacitor to Control the Output Slew Rate and Start-Up Time
      4. 2.2.4  Selecting the RIREF Resistor to set the Reference Voltage for Overcurrent Protection and Active Current Sharing
      5. 2.2.5  Selecting the RIMON Resistor to set the Overcurrent (Circuit Breaker) and Fast-Trip Thresholds During Steady-State
      6. 2.2.6  Selecting the RILIM Resistor to set the Current Limit and Fast-Trip Thresholds During Start-Up and the Active Sharing Threshold During Steady-State
      7. 2.2.7  Selecting the CITIMER Capacitor to Set the Overcurrent Blanking Timer
      8. 2.2.8  Selecting the Resistors to set the Under-voltage Lockout Threshold
      9. 2.2.9  Selecting the R-C Filter Between VIN and VDD
      10. 2.2.10 Selecting the Pullup Resistors and Power Supplies for SWEN, PG, FLT, and CMPOUT Pins
      11. 2.2.11 TVS Diode Selection at Input and Schottky Diode Selection at Output
      12. 2.2.12 Selecting CIN and COUT
    3. 2.3 Highlighted Products
      1. 2.3.1 TPS25985
      2. 2.3.2 LM94022 and LM94022-Q1
      3. 2.3.3 INA241x
      4. 2.3.4 TLV760
      5. 2.3.5 SN74LVC1G123
      6. 2.3.6 UCC27511A
      7. 2.3.7 CSD18510Q5B
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1.      36
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 Altium Project
      4. 4.1.4 Gerber Files
    2. 4.2 Tools
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

Figure 3-9 through Figure 3-26 show various test results in the TIDA-050077 reference design.

TIDA-050077 Hot-Plug Profile With Two Devices on the Top Layer and Two Devices on the Bottom LayerFigure 3-9 Hot-Plug Profile With Two Devices on the Top Layer and Two Devices on the Bottom Layer
TIDA-050077 Power-Up Using ENABLE With Two Devices on the Top Layer and Two Devices on the Bottom LayerFigure 3-10 Power-Up Using ENABLE With Two Devices on the Top Layer and Two Devices on the Bottom Layer
TIDA-050077 Current Sharing Among the Devices During Power-Up With Four Devices in ParallelFigure 3-11 Current Sharing Among the Devices During Power-Up With Four Devices in Parallel
TIDA-050077 Power-Up Into Output Short Response With Four Devices in ParallelFigure 3-12 Power-Up Into Output Short Response With Four Devices in Parallel
TIDA-050077 Current Sharing Among the Devices During Power-Up Into Short With Four Devices in ParallelFigure 3-13 Current Sharing Among the Devices During Power-Up Into Short With Four Devices in Parallel
TIDA-050077 Overcurrent Performance With Four Devices in ParallelFigure 3-14 Overcurrent Performance With Four Devices in Parallel
TIDA-050077 Overcurrent Performance With Four Devices in ParallelFigure 3-15 Overcurrent Performance With Four Devices in Parallel
TIDA-050077 Transient Overload Performance With Four Devices in ParallelFigure 3-16 Transient Overload Performance With Four Devices in Parallel
TIDA-050077 Transient Overload Performance With Four Devices in ParallelFigure 3-17 Transient Overload Performance With Four Devices in Parallel
TIDA-050077 Current Sharing Among the Devices During an Overcurrent Event With Four Devices in ParallelFigure 3-18 Current Sharing Among the Devices During an Overcurrent Event With Four Devices in Parallel
TIDA-050077 Current Sharing Among the Devices During Transient Overload Events With Four Devices in ParallelFigure 3-19 Current Sharing Among the Devices During Transient Overload Events With Four Devices in Parallel
TIDA-050077 Active Current Sharing Among the Devices During Load Transients With Four Devices in ParallelFigure 3-20 Active Current Sharing Among the Devices During Load Transients With Four Devices in Parallel
TIDA-050077 Active Current Sharing Among the Devices During Steady-State With Four Devices in ParallelFigure 3-21 Active Current Sharing Among the Devices During Steady-State With Four Devices in Parallel
TIDA-050077 Output Hot-Short ResponseFigure 3-22 Output Hot-Short Response
TIDA-050077 Power-Up Using ENABLE With Four Devices on the Top Layer and Two Devices on the Bottom LayerFigure 3-23 Power-Up Using ENABLE With Four Devices on the Top Layer and Two Devices on the Bottom Layer
TIDA-050077 Power-Up Into Output Short Response With Six Devices in ParallelFigure 3-24 Power-Up Into Output Short Response With Six Devices in Parallel
TIDA-050077 Transient Overload Performance With Six Devices in ParallelFigure 3-25 Transient Overload Performance With Six Devices in Parallel
TIDA-050077 Overcurrent Performance With Six Devices in ParallelFigure 3-26 Overcurrent Performance With Six Devices in Parallel

Figure 3-27 through Figure 3-29 show the thermal performance of the TIDA-050077 reference design under the given conditions.

TIDA-050077 Four Devices
All four devices are on the top layer in parallel.
Figure 3-27 Four Devices
TIDA-050077 Bottom Layer of the Board With Four devices
Two devices are on the top layer and the other two devices are
on the bottom layer exactly at same location as the top layer
devices, in parallel.
Figure 3-29 Bottom Layer of the Board With Four devices
TIDA-050077 Top Layer of the Board With Four Devices
Two devices are on the top layer and the other two devices are on the bottom layer exactly at same location as the top layer devices, in parallel.
Figure 3-28 Top Layer of the Board With Four Devices
TIDA-050077 Top Layer of the Board With Six Devices in Parallel
VIN = 12V, IOUT = 300A, and no external air flow
Figure 3-30 Top Layer of the Board With Six Devices in Parallel
TIDA-050077 Bottom Layer of the Board With Six Devices in Parallel
VIN = 12V, IOUT = 300A, and no external air flow
Figure 3-31 Bottom Layer of the Board With Six Devices in Parallel