TIDUF75 April   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 System Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1  Determining the Number of eFuse Devices to use in Parallel
      2. 2.2.2  Setting up the Primary and Secondary Devices in a Parallel Configuration
      3. 2.2.3  Selecting the CDVDT Capacitor to Control the Output Slew Rate and Start-Up Time
      4. 2.2.4  Selecting the RIREF Resistor to set the Reference Voltage for Overcurrent Protection and Active Current Sharing
      5. 2.2.5  Selecting the RIMON Resistor to set the Overcurrent (Circuit Breaker) and Fast-Trip Thresholds During Steady-State
      6. 2.2.6  Selecting the RILIM Resistor to set the Current Limit and Fast-Trip Thresholds During Start-Up and the Active Sharing Threshold During Steady-State
      7. 2.2.7  Selecting the CITIMER Capacitor to Set the Overcurrent Blanking Timer
      8. 2.2.8  Selecting the Resistors to set the Under-voltage Lockout Threshold
      9. 2.2.9  Selecting the R-C Filter Between VIN and VDD
      10. 2.2.10 Selecting the Pullup Resistors and Power Supplies for SWEN, PG, FLT, and CMPOUT Pins
      11. 2.2.11 TVS Diode Selection at Input and Schottky Diode Selection at Output
      12. 2.2.12 Selecting CIN and COUT
    3. 2.3 Highlighted Products
      1. 2.3.1 TPS25985
      2. 2.3.2 LM94022 and LM94022-Q1
      3. 2.3.3 INA241x
      4. 2.3.4 TLV760
      5. 2.3.5 SN74LVC1G123
      6. 2.3.6 UCC27511A
      7. 2.3.7 CSD18510Q5B
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1.      36
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 Altium Project
      4. 4.1.4 Gerber Files
    2. 4.2 Tools
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

2.2.12 Selecting CIN and COUT

TI recommends adding ceramic bypass capacitors to help stabilize the voltages on the input and output. The value of CIN must be kept small to minimize the current spike during hot-plug events. For each device, 0.1µF of CIN is a reasonable target. Because COUT does not get charged during hot-plug, a larger value such as 2.2µF can be used at the OUT pin of each device.