TIDUFF8 September   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LDC5072-Q1
      2. 2.3.2 MSPM0G3507
      3. 2.3.3 TPSM365R3
      4. 2.3.4 TLV9062
  9. 3System Design Theory
    1. 3.1 Hardware Design
      1. 3.1.1 Target PCB
      2. 3.1.2 Coil PCB
      3. 3.1.3 Signal Chain PCB
        1. 3.1.3.1 Inductive Angle Position Sensor Front-End Schematic
        2. 3.1.3.2 Differential to Single-Ended Signal Conversion
      4. 3.1.4 MSPM0G3507 Schematic Design
      5. 3.1.5 Power Supply Design
    2. 3.2 Absolute Position Calculation
    3. 3.3 Software Design
      1. 3.3.1 Angle Calculation Timing
      2. 3.3.2 Rotary Angle Error Sources and Compensation
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
      1. 4.1.1 PCB Overview
      2. 4.1.2 Encoder Interface
    2. 4.2 Software
    3. 4.3 Test Setup
    4. 4.4 Test Results
      1. 4.4.1 Inductive Sensor Sine and Cosine Noise Measurement
      2. 4.4.2 Absolute Angle Noise Measurement
      3. 4.4.3 Rotary Angle Accuracy Measurement
      4. 4.4.4 Impact of Air Gap on Noise, 4th Electrical Harmonics and Total Angle Accuracy
      5. 4.4.5 Power Consumption Measurement
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout
      4. 5.1.4 Altium Project Files
      5. 5.1.5 Gerber Files
      6. 5.1.6 Assembly Drawings
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5.     Trademarks
  12. 6About the Author

3.3 Software Design

An internal TI test software validates this reference design with the MSPM0G3507 using the MSPM0 software development kit for M0 MCUs.