TIDUFG2 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Sensor Selection
    3. 2.3 Highlighted Products
      1. 2.3.1 TLV387
      2. 2.3.2 TLV9054
      3. 2.3.3 MSPM0G5187-LP
      4. 2.3.4 LOG300
      5. 2.3.5 UCC28881
      6. 2.3.6 TPS709
  9. 3System Design Theory
    1. 3.1 Current Sensor
    2. 3.2 Hybrid Integrator
    3. 3.3 Band-Pass Filter
      1. 3.3.1 Log Amplifier
      2. 3.3.2 Current Low-Pass Filter
      3. 3.3.3 Non-isolated Voltage Sensing
      4. 3.3.4 Auto Labeling Circuit
        1. 3.3.4.1 Line Voltage Sensing
        2. 3.3.4.2 Arc Gap Voltage Sensing
        3. 3.3.4.3 Differential to Single-Ended Conversion
      5. 3.3.5 Power Supply
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software
    3. 4.3 Test Setup
      1. 4.3.1 Arc Testing Setup
    4. 4.4 Test Results
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

Features

  • Built in PCB Rogowski
  • LaunchPadâ„¢ Development Kit connection for MSPM0G5187 with AI accelerator
  • Hybrid integrator with > 10MHz Bandwidth
  • LOG300 with 40MHz bandwidth
  • Auto labeling circuitry for easy data collection