TIDUFG2 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Sensor Selection
    3. 2.3 Highlighted Products
      1. 2.3.1 TLV387
      2. 2.3.2 TLV9054
      3. 2.3.3 MSPM0G5187-LP
      4. 2.3.4 LOG300
      5. 2.3.5 UCC28881
      6. 2.3.6 TPS709
  9. 3System Design Theory
    1. 3.1 Current Sensor
    2. 3.2 Hybrid Integrator
    3. 3.3 Band-Pass Filter
      1. 3.3.1 Log Amplifier
      2. 3.3.2 Current Low-Pass Filter
      3. 3.3.3 Non-isolated Voltage Sensing
      4. 3.3.4 Auto Labeling Circuit
        1. 3.3.4.1 Line Voltage Sensing
        2. 3.3.4.2 Arc Gap Voltage Sensing
        3. 3.3.4.3 Differential to Single-Ended Conversion
      5. 3.3.5 Power Supply
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software
    3. 4.3 Test Setup
      1. 4.3.1 Arc Testing Setup
    4. 4.4 Test Results
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  12. 6About the Author

Current Sensor

PCB Rogowski is selected due to linearity over wide bandwidth and low cost. TI devices solve the design challenges of integration and low sensitivity of the coil.

The coil functions as a differential coil with matching return loops. Distance from the conductor determines Rogowski sensitivity by controlling magnetic field density and loop area. External magnetic fields couple into the signal when loop path mismatch occurs in this differential signal with high gain.

The coil design uses a novel layout to match loop paths while offsetting inner vias. This allows greater loop density. Four interleaved Rogowski coils accomplish this design. Two coils, an outer and inner coil, wind in opposite directions and connect in series. These connect differentially with the other pair wound identically.

This topology provides inductive and capacitive noise rejection while increasing coil density. Traditional winding schemes do not offset vias. This invention uses contributions from TIDA01063 and PCB Rogowski research into winding topologies(1).

TIDA-010971 PCB Rogowski Winding Layout Figure 3-1 PCB Rogowski Winding Layout

Figure 3-2 shows a model of the equivalent circuit.

TIDA-010971 TINA Simulation Schematic of Rogowski Coil Figure 3-2 TINA Simulation Schematic of Rogowski Coil

The Rogowski coil output equals the derivative of the current. For a periodic signal the derivative can be calculated using Equation 1.

Equation 1. s i n ( w t ) = w × c o s ( w t )

This matches the simulated transfer function up to the self-resonance point of the PCB coil. For this small coil the theoretical self-resonance point exceeds 40MHz. See TIDA-010987 and TIDA-01063 for more details about PCB Rogowski design.

TIDA-010971 Simulated Bode Plot of PCB Rogowski Figure 3-3 Simulated Bode Plot of PCB Rogowski