16/32-bit RISC Flash microcontroller



Product details


CPU ARM-Cortex-M3 Frequency (MHz) 80 ADC 10-bit GPIO 49 Number of I2Cs 0 TI functional safety category Functional Safety-Compliant Operating temperature range (C) -40 to 125 open-in-new Find other Arm-based microcontrollers

Package | Pins | Size

LQFP (PZ) 100 256 mm² 16 x 16 open-in-new Find other Arm-based microcontrollers


  • High-Performance Automotive Grade Microcontroller with Safety Features
    • Full Automotive Temperature Range
    • ECC on Flash and SRAM
    • CPU and Memory BIST (Built-In Self Test)
  • ARM Cortex™-M3 32-Bit RISC CPU
    • Efficient 1.2 DMIPS/MHz
    • Optimized Thumb2 Instruction Set
    • Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
    • Built-In Debug Module
  • Operating Features
    • Up to 80MHz System Clock
    • Single 3.3V Supply Voltage
  • Integrated Memory
    • 448KB Total Program Flash with ECC
    • Support for Flash EEPROM Emulation
    • 24K-Byte Static RAM (SRAM) with ECC
  • Key Peripherals
    • High-End Timer, MibADC, CAN, MibSPI
  • Common TMS470M/570 Platform Architecture
    • Consistent Memory Map across the family
    • Real-Time Interrupt Timer (RTI)
    • Digital Watchdog
    • Vectored Interrupt Module (VIM)
    • Cyclic Redundancy Checker (CRC)
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The TMS470MF04207/03107 devices are members of the Texas Instruments TMS470M family of Automotive Grade 16/32-bit reduced instruction set computer (RISC) microcontrollers. The TMS470M microcontrollers offer high performance utilizing the high efficiency Cortex™-M3 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The TMS470M devices utilize the big-endian format where the most-significant byte of a word is stored at the lowest numbered byte and the least-significant byte is stored at the highest numbered byte.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The TMS470M microcontroller architecture offers solutions to these performance and cost demands while maintaining low power consumption.

The TMS470MF04207/03107 device contains the following:

  • 16/32-Bit RISC CPU Core
  • TMS470MF04207 Up to 448K-Byte Program Flash with SECDED ECC
  • TMS470MF03107 Up to 320K-Byte Program Flash with SECDED ECC
  • 64K-Byte Flash with SECDED ECC for additional program space or EEPROM Emulation
  • Up to 24K-Byte Static RAM (SRAM) with SECDED ECC
  • Real-Time Interrupt Timer (RTI)
  • Vectored Interrupt Module
  • (VIM)Hardware built-in self-test (BIST) checkers for SRAM (MBIST) and CPU (LBIST)
  • 64-bit Cyclic Redundancy Checker (CRC)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMzPLL)-Based Clock Module With Prescaler
  • Two Multi-buffered Serial Peripheral Interfaces (MibSPI)
  • Two UARTs (SCI) with Local Interconnect Network Interfaces (LIN)
  • Two CAN Controller (DCAN)
  • High-End Timer (HET)
  • External Clock Prescale (ECP) Module
  • One 16-Channel 10-Bit Multi-Buffered ADC (MibADC)
  • Error Signaling Module (ESM)
  • Four Dedicated General-Purpose I/O (GIO) Pins and 45 Additional Peripheral I/Os (100-Pin Package)

The TMS470M memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes. The SRAM on the TMS470M devices can be protected by means of ECC. This feature utilizes a single error correction and double error detection circuit (SECDED circuit) to detect and optionally correct single bit errors as well as detect all dual bit and some multi-bit errors. This is achieved by maintaining an 8-bit ECC checksum/code for each 64-bit double-word of memory space in a separate ECC RAM memory space.

The flash memory on this device is a nonvolatile, electrically erasable and programmable memory. It is implemented with a 144-bit wide data word (128-bit without ECC) and a 64-bit wide flash module interface. The flash operates with a system clock frequency of up to 28 MHz. Pipeline mode, which allows linear prefetching of flash data, enables a system clock of up to 80 MHz.

The enhanced real-time interrupt (RTI) module on the TMS470M devices has the option to be driven by the oscillator clock. The digital watchdog (DWD) is a 25-bit resetable decrementing counter that provides a system reset when the watchdog counter expires.

The TMS470M devices have six communication interfaces: two LIN/SCIs, two DCANs, and two MibSPIs. The LIN is the Local Interconnect Network standard and also supports an SCI mode. SCI can be used in a full-duplex, serial I/O interface intended for asynchronous communication between the CPU and other peripherals using the standard non-return-to-zero (NRZ) format. The DCAN uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The DCAN is ideal for applications operating in noisy and harsh environments (e.g., automotive and industrial fields) that require reliable serial communication or multiplexed wiring. The MibSPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The MibSPI provides the standard SOMI, SIMO, and SPI clock interface as well as up to eight chip select lines.

The HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. The TMS470M HET peripheral contains the XOR-share feature. This feature allows two adjacent HET high- resolution channels to be XORed together, making it possible to output smaller pulses than a standard HET.

The TMS470M devices have one 10-bit-resolution, sample-and-hold MibADC. Each of the MibADC channels can be grouped by software for sequential conversion sequences. There are three separate groupings, all three of which can be triggered by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode.

The frequency-modulated zero-pin phase-locked loop (FMzPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler. The function of the FMzPLL is to multiply the external frequency reference to a higher frequency for internal use. The FMzPLL provides the input to the global clock module (GCM). The GCM module subsequently provides system clock (HCLK), real-time interrupt clock (RTICLK), CPU clock (GCLK), HET clock (VCLK2), DCAN clock (AVCLK1), and peripheral interface clock (VCLK) to all other TMS470M device modules.

The TMS470MF04207/TMS470MF03107 devices also have two external clock prescaler (ECP) modules that when enabled, output a continuous external clock (ECLK). The ECLK1 frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. The second ECLK output can be selected in place of HET15 output. It shares the same source clock as ECLK1 but can be independently programmed for a separate output frequency from ECLK1.

An error signaling module (ESM) provides a common location within the device for error reporting allowing efficient error checking and identification.

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Technical documentation

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Type Title Date
* Data sheet TMS470MF04207/TMS470MF03107 16/32-Bit RISC Flash Microcontroller datasheet (Rev. C) Jan. 31, 2012
* User guide TMS470M Series Technical Reference Manual (Rev. C) Mar. 11, 2013
Technical article 5 ways high-performance MCUs are reshaping the industry Jul. 12, 2021
Application note Using the SPI as an Extra UART Transmitter Jul. 26, 2016
White paper Extending TI’s Hercules MCUs with the integrated flexible HET Sep. 29, 2015
Application note Limiting Clamp Currents on TMS470/TMS570 Digital and Analog Inputs (Rev. A) Dec. 08, 2014
Application note Interfacing TPS65381 With Hercules Microcontrollers (Rev. A) Feb. 14, 2014
Application note CAN Bus Bootloader for TMS470M MCU Sep. 16, 2013
User guide Automotive Adaptive Front-lighting System Reference Design Jul. 15, 2013
User guide Safety Manual for Hercules TMS470M ARM Safety Critical MCUs Apr. 25, 2012
User guide HET Integrated Development Environment User's Guide (Rev. A) Nov. 17, 2011
Application note Important ARM Ltd Application Notes for TI Hercules ARM Safety MCUs Nov. 17, 2011
Application note 3.3 V I/O Considerations for Hercules Safety MCUs (Rev. A) Sep. 06, 2011
Application note ADC Source Impedance for Hercules ARM Safety MCUs (Rev. B) Sep. 06, 2011
Application note Configuring a CAN Node on Hercules ARM Safety MCUs Sep. 06, 2011
Application note Configuring the Hercules ARM Safety MCU SCI/LIN Module for UART Communication (Rev. A) Sep. 06, 2011
User guide TI ICEPick Module Type C Reference Guide Public Version Feb. 17, 2011
More literature TMS470M Transportation Microcontroller Family Jan. 07, 2011
Application note Generating Operating System Tick Using RTI on a Hercules ARM Safety MCU Jul. 13, 2010
Application note Usage of MPU Subregions on TI Hercules ARM Safety MCUs Mar. 10, 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

XDS200 USB Debug Probe

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices.  The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2.  It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)


The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)


The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)


XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)


The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)


XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

Software development

TMS470/570 Platform F035 Flash API
F035FLASHAPI — The TMS470/570 F035 Flash Application Programming Interface (API) provides a software library of functions to program, erase, and verify the TMS470/570 on-chip Flash memory.

These functions must be used when creating Flash bootloaders or other programming utilities for the TMS470/570 (...)
NHET Assembler Tool
NHET-ASSEMBLER TI's Enhanced High-End Timer (NHET) module provides sophisticated timing functions for real-time control applications.

The NHET Assembler translates programs written in the NHET assembly language into multiple output formats for use in code-generation tools such as TI's Code Composer Studio.
  • .hnc file for use by the host assembler
  • .c and .h files for use by the host compiler
  • .hbj file for use by the NHET Simulator

Refer to the NHET Assembler User Guide for further details.

For more information on Hercules Microcontrollers, visit the Hercules Overview page.

Design tools & simulation

SPNM046.ZIP (5 KB) - BSDL Model
FMzPLL Configuration Tool
FMZPLL_CALCULATOR — The FMzPLL Calculator assists a user with the configuration of the FMzPLL on TMS570 microcontrollers. It allows the user to input:
  • OSCIN speed
  • multiplier setting
  • divider settings
  • frequency modulation settings
  • PLL/OSC fail options
Once the user has configured the desired options, the calculator displays (...)

CAD/CAE symbols

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