TMS470MF06607

ACTIVE

Product details

CPU Arm Cortex-M3 Frequency (MHz) 80 ADC 10-bit GPIO 49 Number of I2Cs 0 TI functional safety category Functional Safety-Compliant Operating temperature range (C) -40 to 125
CPU Arm Cortex-M3 Frequency (MHz) 80 ADC 10-bit GPIO 49 Number of I2Cs 0 TI functional safety category Functional Safety-Compliant Operating temperature range (C) -40 to 125
LQFP (PZ) 100 256 mm² 16 x 16
  • High-Performance Automotive Grade Microcontroller with Safety Features
    • Full Automotive Temperature Range
    • ECC on Flash and SRAM
    • CPU and Memory BIST (Built-In Self Test)
  • ARM Cortex™-M3 32-Bit RISC CPU
    • Efficient 1.2 DMIPS/MHz
    • Optimized Thumb2 Instruction Set
    • Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
    • Built-In Debug Module
  • Operating Features
    • Up to 80MHz System Clock
    • Single 3.3V Supply Voltage
  • Integrated Memory
    • 640KB Total Program Flash with ECC
    • Support for Flash EEPROM Emulation
    • 64K-Byte Static RAM (SRAM) with ECC
  • Key Peripherals
    • High-End Timer, MibADC, CAN, MibSPI
  • Common TMS470M/570 Platform Architecture
    • Consistent Memory Map across the family
    • Real-Time Interrupt Timer (RTI)
    • Digital Watchdog
    • Vectored Interrupt Module (VIM)
    • Cyclic Redundancy Checker (CRC)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMZPLL)-Based Clock Module
    • Oscillator and PLL clock monitor
  • Up to 77 Peripheral IO pins
    • 8 Dedicated GIO - w/ External Interrupts
    • Programmable External Clock (ECLK)
  • Communication Interfaces
    • Two CAN ControllersOne with 32 mailboxes, one with 16Parity on mailbox RAM
    • Two Multi-buffered Serial Peripheral Interface (MibSPI)12 total chip selects64 buffers with parity on eachOne with 4 bit parallel mode
    • One Standard SPI Interface4 chip selectsEnable Pin
    • Two UART (SCI) interfacesH/W Support for Local Interconnect Network (LIN 2.0)
  • High-End Timer (HET)
    • Up to 26 Programmable I/O Channels
    • 64 Word Instruction RAM with parity
  • 10-Bit Multi-Buffered ADCs (MibADC)
    • Up to 16 ADC Input channels
    • 64 Result FIFO Buffer with parity
    • 1.55uS total conversion time
    • Calibration and Self Test features
  • On-Chip Scan-Base Emulation Logic
    • IEEE Standard 1149.1 (JTAG) Test-Access Port and Boundary Scan
  • Packages supported
    • 144-Pin Plastic Quad Flatpack (PGE Suffix)
    • 100-Pin Plastic Quad Flatpack (PZ Suffix)
    • Green/Lead-Free
  • Development Tools Available
    • Development Boards
    • Code Composer Studio™ Integrated Development Environment (IDE)
    • HET Assembler and Simulator
    • nowFlash™ Flash Programming Tool
  • Community Reesources

All other trademarks are the property of their respective owners

  • High-Performance Automotive Grade Microcontroller with Safety Features
    • Full Automotive Temperature Range
    • ECC on Flash and SRAM
    • CPU and Memory BIST (Built-In Self Test)
  • ARM Cortex™-M3 32-Bit RISC CPU
    • Efficient 1.2 DMIPS/MHz
    • Optimized Thumb2 Instruction Set
    • Memory Protection Unit (MPU)
    • Open Architecture With Third-Party Support
    • Built-In Debug Module
  • Operating Features
    • Up to 80MHz System Clock
    • Single 3.3V Supply Voltage
  • Integrated Memory
    • 640KB Total Program Flash with ECC
    • Support for Flash EEPROM Emulation
    • 64K-Byte Static RAM (SRAM) with ECC
  • Key Peripherals
    • High-End Timer, MibADC, CAN, MibSPI
  • Common TMS470M/570 Platform Architecture
    • Consistent Memory Map across the family
    • Real-Time Interrupt Timer (RTI)
    • Digital Watchdog
    • Vectored Interrupt Module (VIM)
    • Cyclic Redundancy Checker (CRC)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMZPLL)-Based Clock Module
    • Oscillator and PLL clock monitor
  • Up to 77 Peripheral IO pins
    • 8 Dedicated GIO - w/ External Interrupts
    • Programmable External Clock (ECLK)
  • Communication Interfaces
    • Two CAN ControllersOne with 32 mailboxes, one with 16Parity on mailbox RAM
    • Two Multi-buffered Serial Peripheral Interface (MibSPI)12 total chip selects64 buffers with parity on eachOne with 4 bit parallel mode
    • One Standard SPI Interface4 chip selectsEnable Pin
    • Two UART (SCI) interfacesH/W Support for Local Interconnect Network (LIN 2.0)
  • High-End Timer (HET)
    • Up to 26 Programmable I/O Channels
    • 64 Word Instruction RAM with parity
  • 10-Bit Multi-Buffered ADCs (MibADC)
    • Up to 16 ADC Input channels
    • 64 Result FIFO Buffer with parity
    • 1.55uS total conversion time
    • Calibration and Self Test features
  • On-Chip Scan-Base Emulation Logic
    • IEEE Standard 1149.1 (JTAG) Test-Access Port and Boundary Scan
  • Packages supported
    • 144-Pin Plastic Quad Flatpack (PGE Suffix)
    • 100-Pin Plastic Quad Flatpack (PZ Suffix)
    • Green/Lead-Free
  • Development Tools Available
    • Development Boards
    • Code Composer Studio™ Integrated Development Environment (IDE)
    • HET Assembler and Simulator
    • nowFlash™ Flash Programming Tool
  • Community Reesources

All other trademarks are the property of their respective owners

The TMS470MF06607 device is a member of the Texas Instruments TMS470M family of Automotive Grade 16/32-bit reduced instruction set computer (RISC) microcontrollers. The TMS470M microcontrollers offer high performance utilizing the high efficiency ARM Cortex™-M3 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The TMS470M microcontroller architecture offers solutions to these performance and cost demands while maintaining low power consumption.

The TMS470MF06607 device contains the following:

  • 16/32-Bit RISC CPU Core
  • 640K-Byte Total Flash with SECDED ECC
    • 512K-Byte Program Flash
    • 128K- Byte Flash for additional program space or EEPROM Emulation
  • 64K-Byte Static RAM (SRAM) with SECDED ECC
  • Real-Time Interrupt Timer (RTI)
  • Vectored Interrupt Module (VIM)
  • Hardware built-in self-test (BIST) checkers for SRAM (MBIST) and CPU (LBIST)
  • 64-bit Cyclic Redundancy Checker (CRC)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMZPLL)-Based Clock Module With Prescaler
  • Two Multi-buffered Serial Peripheral Interfaces (MibSPI)
  • Two UARTs (SCI) with Local Interconnect Network Interfaces (LIN)
  • Two CAN Controller (DCAN)
  • High-End Timer (HET)
  • External Clock Prescale (ECP) Module
  • One 16-Channel 10-Bit Multi-Buffered ADC (MibADC)
  • Error Signaling Module (ESM)
  • Four Dedicated General-Purpose I/O (GIO) Pins and 47 (2 of them are muxed with JTAG pins) Additional Peripheral I/Os (100-Pin Package)

The TMS470M memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes. The SRAM on the TMS470M devices can be protected by means of ECC. This feature utilizes a single error correction and double error detection circuit (SECDED circuit) to detect and optionally correct single bit errors as well as detect all dual bit and some multi-bit errors. This is achieved by maintaining an 8-bit ECC checksum/code for each 64-bit double-word of memory space in a separate ECC RAM memory space.

The TMS470MF06607 device is a member of the Texas Instruments TMS470M family of Automotive Grade 16/32-bit reduced instruction set computer (RISC) microcontrollers. The TMS470M microcontrollers offer high performance utilizing the high efficiency ARM Cortex™-M3 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The TMS470M microcontroller architecture offers solutions to these performance and cost demands while maintaining low power consumption.

The TMS470MF06607 device contains the following:

  • 16/32-Bit RISC CPU Core
  • 640K-Byte Total Flash with SECDED ECC
    • 512K-Byte Program Flash
    • 128K- Byte Flash for additional program space or EEPROM Emulation
  • 64K-Byte Static RAM (SRAM) with SECDED ECC
  • Real-Time Interrupt Timer (RTI)
  • Vectored Interrupt Module (VIM)
  • Hardware built-in self-test (BIST) checkers for SRAM (MBIST) and CPU (LBIST)
  • 64-bit Cyclic Redundancy Checker (CRC)
  • Frequency-Modulated Zero-Pin Phase-Locked Loop (FMZPLL)-Based Clock Module With Prescaler
  • Two Multi-buffered Serial Peripheral Interfaces (MibSPI)
  • Two UARTs (SCI) with Local Interconnect Network Interfaces (LIN)
  • Two CAN Controller (DCAN)
  • High-End Timer (HET)
  • External Clock Prescale (ECP) Module
  • One 16-Channel 10-Bit Multi-Buffered ADC (MibADC)
  • Error Signaling Module (ESM)
  • Four Dedicated General-Purpose I/O (GIO) Pins and 47 (2 of them are muxed with JTAG pins) Additional Peripheral I/Os (100-Pin Package)

The TMS470M memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes. The SRAM on the TMS470M devices can be protected by means of ECC. This feature utilizes a single error correction and double error detection circuit (SECDED circuit) to detect and optionally correct single bit errors as well as detect all dual bit and some multi-bit errors. This is achieved by maintaining an 8-bit ECC checksum/code for each 64-bit double-word of memory space in a separate ECC RAM memory space.

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Technical documentation

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Type Title Date
* Data sheet TMS470MF06607 16/32-Bit RISC Flash Microcontroller datasheet (Rev. C) 31 Jan 2012
* Errata TMS470MF0660x Microcontroller Silicon Errata (Silicon Revision B) (Rev. A) 11 Nov 2015
* User guide TMS470M Series Technical Reference Manual (Rev. C) 11 Mar 2013
Technical article 5 ways high-performance MCUs are reshaping the industry 12 Jul 2021
Application note Using the SPI as an Extra UART Transmitter 26 Jul 2016
White paper Extending TI’s Hercules MCUs with the integrated flexible HET 29 Sep 2015
Application note Limiting Clamp Currents on TMS470/TMS570 Digital and Analog Inputs (Rev. A) 08 Dec 2014
Application note Interfacing TPS65381 With Hercules Microcontrollers (Rev. A) 14 Feb 2014
Application note CAN Bus Bootloader for TMS470M MCU 16 Sep 2013
User guide Safety Manual for Hercules TMS470M ARM Safety Critical MCUs 25 Apr 2012
User guide HET Integrated Development Environment User's Guide (Rev. A) 17 Nov 2011
Application note Important ARM Ltd Application Notes for TI Hercules ARM Safety MCUs 17 Nov 2011
Application note 3.3 V I/O Considerations for Hercules Safety MCUs (Rev. A) 06 Sep 2011
Application note ADC Source Impedance for Hercules ARM Safety MCUs (Rev. B) 06 Sep 2011
Application note Configuring a CAN Node on Hercules ARM Safety MCUs 06 Sep 2011
Application note Configuring the Hercules ARM Safety MCU SCI/LIN Module for UART Communication (Rev. A) 06 Sep 2011
User guide TI ICEPick Module Type C Reference Guide Public Version 17 Feb 2011
More literature TMS470M Transportation Microcontroller Family 07 Jan 2011
Application note Generating Operating System Tick Using RTI on a Hercules ARM Safety MCU 13 Jul 2010
Application note Usage of MPU Subregions on TI Hercules ARM Safety MCUs 10 Mar 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Debug probe

TMDSEMU200-U — XDS200 USB Debug Probe

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices.  The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2.  It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)

In stock
Limit: 3
Debug probe

TMDSEMU560V2STM-U — XDS560v2 System Trace USB Debug Probe

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

In stock
Limit: 1
Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

In stock
Limit: 1
Code example or demo

HERCULES_SAFETY_MCU_DEMOS — Hercules Safety MCU Demos

The Hercules Safety MCU Demos are designed to highlight key safety, data acquisition and control features of the Hercules platform of microcontrollers. The demos are designed to be run on a PC in conjunction with either a Hercules USB Development Sick or a Hercules Development Kit (HDK).
Driver or library

F035FLASHAPI — TMS470/570 Platform F035 Flash API

The TMS470/570 F035 Flash Application Programming Interface (API) provides a software library of functions to program, erase, and verify the TMS470/570 on-chip Flash memory.

These functions must be used when creating Flash bootloaders or other programming utilities for the TMS470/570 (...)
IDE, configuration, compiler or debugger

CCSTUDIO-SAFETY — Code Composer Studio (CCS) Integrated Development Environment (IDE) for Hercules Safety MCUs

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, (...)

IDE, configuration, compiler or debugger

HALCOGEN — Hardware Abstraction Layer Code Generator for Hercules MCUs

HALCoGen allows users to generate hardware abstraction layer device drivers for Hercules™ microcontrollers. HALCoGen provides a graphical user interface that allows the user to configure peripherals, interrupts, clocks, and other Hercules microcontroller parameters. Once the Hercules device (...)
IDE, configuration, compiler or debugger

HET_IDE — High End Timer (HET)

The High-End Timer (HET) is a programmable timer co-processor available on TI’s high-performance Hercules Microcontrollers. The HET enables sophisticated timing functions for real-time control applications. Programming the HET provides an alternate approach to the use of costly FPGAs or ASICs which (...)
IDE, configuration, compiler or debugger

NHET-ASSEMBLER — NHET Assembler Tool

TI's Enhanced High-End Timer (NHET) module provides sophisticated timing functions for real-time control applications.

The NHET Assembler translates programs written in the NHET assembly language into multiple output formats for use in code-generation tools such as TI's Code Composer Studio.
Software programming tool

NOWECC — ECC generation tool

The Hercules microcontroller family contains as part of the embedded flash module a circuit that provides, the capability to detect and correct memory faults. This Single bit Error Correction and Double bit Error Detection circuit (SECDED) needs 8 Error correction check bits for every 64 bit of (...)
Software programming tool

UNIFLASH — UniFlash stand-alone flash tool for microcontrollers, Sitara™; processors and SimpleLink™

Supported devices: CC13xx, CC25xx, CC26xx, CC3x20, CC3x30, CC3x35, Tiva, C2000, MSP43x, Hercules, PGA9xx, IWR12xx, IWR14xx, IWR16xx, IWR18xx , IWR68xx, AWR12xx, AWR14xx, AWR16xx, AWR18xx.  Command line only: AM335x, AM437x, AM571x, AM572x, AM574x, AM65XX, K2G

CCS Uniflash is a standalone tool used (...)

Simulation model

TMS470MF06607 PZ BSDL Models

SPNM047.ZIP (5 KB) - BSDL Model
Calculation tool

FMZPLL_CALCULATOR — FMzPLL Configuration Tool

The FMzPLL Calculator assists a user with the configuration of the FMzPLL on TMS570 microcontrollers. It allows the user to input:
  • OSCIN speed
  • multiplier setting
  • divider settings
  • frequency modulation settings
  • PLL/OSC fail options
Once the user has configured the desired options, the calculator displays (...)
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LQFP (PZ) 100 View options

Ordering & quality

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  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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Support & training

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