Produktdetails

Sample rate (max) (Msps) 1000, 2000 Resolution (bps) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2700 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3510 Architecture Folding Interpolating SNR (dB) 60.1 ENOB (bit) 9.6 SFDR (dB) 75 Operating temperature range (°C) -40 to 85 Input buffer Yes
Sample rate (max) (Msps) 1000, 2000 Resolution (bps) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2700 Features Ultra High Speed Rating Catalog Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3510 Architecture Folding Interpolating SNR (dB) 60.1 ENOB (bit) 9.6 SFDR (dB) 75 Operating temperature range (°C) -40 to 85 Input buffer Yes
PBGA (NXA) 292 729 mm² 27 x 27
  • Excellent Noise and Linearity up to and Above fIN =
    2.7 GHz
  • Configurable to Either 3.2 or 2 GSPS Interleaved
    or 1600 or 1000 MSPS Dual ADC
  • New DESCLKIQ Mode for High Bandwidth, High
    Sampling Rate Apps
  • Pin-Compatible With ADC10D1x00, ADC12D1x00
  • AutoSync Feature for Multi-Chip Synchronization
  • Internally Terminated, Buffered, Differential Analog
    Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Time Stamp Feature to Capture External Trigger
  • Programmable Gain, Offset, and tAD Adjust
    Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • Key Specifications
    • Resolution 12 Bits
    • Interleaved 3.2- and 2-GSPS ADC
      • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73
        dBFS (Typical)
      • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85
        dBFS (Typical)
      • Noise Floor –154.6/–154 dBm/Hz (Typical)
      • Power 3.94/3.42 W (Typical)
    • Dual 1600/1000 MSPS ADC, Fin = 498 MHz
      • ENOB 9.2/9.4 Bits (Typical)
      • SNR 58.2/58.8 dB (Typical)
      • SFDR 66.7/71.9 dBc (Typical)
      • Power per Channel 1.97/1.71 W (Typical)
  • Excellent Noise and Linearity up to and Above fIN =
    2.7 GHz
  • Configurable to Either 3.2 or 2 GSPS Interleaved
    or 1600 or 1000 MSPS Dual ADC
  • New DESCLKIQ Mode for High Bandwidth, High
    Sampling Rate Apps
  • Pin-Compatible With ADC10D1x00, ADC12D1x00
  • AutoSync Feature for Multi-Chip Synchronization
  • Internally Terminated, Buffered, Differential Analog
    Inputs
  • Interleaved Timing Automatic and Manual Skew
    Adjust
  • Test Patterns at Output for System Debug
  • Time Stamp Feature to Capture External Trigger
  • Programmable Gain, Offset, and tAD Adjust
    Feature
  • 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
  • Key Specifications
    • Resolution 12 Bits
    • Interleaved 3.2- and 2-GSPS ADC
      • IMD3 (Fin = 2.7 GHz at –13 dBFS) –63.7/–73
        dBFS (Typical)
      • IMD3 (Fin = 2.7 GHz at –16 dBFS) –66.7/–85
        dBFS (Typical)
      • Noise Floor –154.6/–154 dBm/Hz (Typical)
      • Power 3.94/3.42 W (Typical)
    • Dual 1600/1000 MSPS ADC, Fin = 498 MHz
      • ENOB 9.2/9.4 Bits (Typical)
      • SNR 58.2/58.8 dB (Typical)
      • SFDR 66.7/71.9 dBc (Typical)
      • Power per Channel 1.97/1.71 W (Typical)

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

The 12-bit 3.2- and 2-GSPS ADC12D1x00RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1x00RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone

The ADC12D1x00RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common-mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet ADC12D1x00RF 12-Bit, 3.2-GSPS and 2-GSPS RF-Sampling ADC datasheet (Rev. H) PDF | HTML 31 Aug 2015
Application note AN-2132 Synchronizing Multiple GSPS ADCs in a System: The AutoSync Feature (Rev. G) 03 Feb 2017
Application note Signal Chain Noise Figure Analysis 29 Okt 2014
Application note Maximizing SFDR Performance in the GSPS ADC: Spur Sources and Methods of Mitigat 09 Dez 2013
Application note AN-2128 ADC1xD1x00 Pin Compatibility (Rev. C) 01 Mai 2013
User guide Schematic and Layout Recommendations for the GSPS ADC 29 Apr 2013
Application note AN-2177 Using the LMH6554 as a ADC Driver (Rev. A) 26 Apr 2013
Application note From Sample Instant to Data Output: Understanding Latency in the GSPS ADC 18 Dez 2012
Product overview ADC12Dxx00RF Direct RF-Sampling ADC Family 16 Mai 2012

Design und Entwicklung

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