Produktdetails

Processor External MCU, External MPU Type MCU or MPU attach Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 50 Security FW authentication and anti-rollback protection, Networking security (WPA3), Secured host interface Features 802.11ax, AP, Bluetooth low energy, COEX, Multirole, STA Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MCU, External MPU Type MCU or MPU attach Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 50 Security FW authentication and anti-rollback protection, Networking security (WPA3), Secured host interface Features 802.11ax, AP, Bluetooth low energy, COEX, Multirole, STA Operating temperature range (°C) -40 to 105 Rating Catalog
WQFN (RSB) 40 25 mm² 5 x 5

Key Features

  • Wi-Fi 6 (802.11ax)

  • Bluetooth Low Energy 5.4 in CC33x1 devices

  • Companion IC to any processor or MCU host capable of running a TCP/IP stack

  • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power.

  • Operating temperature: –40°C to +105°C

  • Application throughput up to 50Mbps

Extended Features

  • Wi-Fi 6
    • 2.4GHz and 5GHz, 20MHz, single spatial stream
    • MAC, baseband, and RF transceiver with support for IEEE 802.11 a/b/g/n/ax
    • OFDMA, Trigger frame, MU-MIMO (downlink), basic service set coloring, and target wake time (TWT) for improved efficiency
    • Hardware-based encryption and decryption supporting WPA2 and WPA3
    • Excellent interoperability
    • Support for 4-bit SDIO or SPI host interfaces
  • Bluetooth Low Energy 5.4
    • LE coded PHYs (long range), LE 2M PHY (high speed) and advertising extension
    • Host controller interface (HCI) transport with option for UART or shared SDIO
  • Enhanced security
    • Secured host interface
    • Firmware authentication
    • Anti-rollback protection
  • Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
  • Optional antenna diversity or selection
  • 3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (for example, Thread or Zigbee)
  • Power management
    • VMAIN, VIO, Vpp: 1.8V
    • VPA: 3.3V
  • Clock sources
    • 40-MHz XTAL fast clock
    • Internal slow clock or external 32.768kHz slow clock
  • Small package size
    • Easy to design with 40-pin, 5mm × 5mm quad flat no-leaded (QFN) package, 0.4mm pitch

Key Features

  • Wi-Fi 6 (802.11ax)

  • Bluetooth Low Energy 5.4 in CC33x1 devices

  • Companion IC to any processor or MCU host capable of running a TCP/IP stack

  • Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power.

  • Operating temperature: –40°C to +105°C

  • Application throughput up to 50Mbps

Extended Features

  • Wi-Fi 6
    • 2.4GHz and 5GHz, 20MHz, single spatial stream
    • MAC, baseband, and RF transceiver with support for IEEE 802.11 a/b/g/n/ax
    • OFDMA, Trigger frame, MU-MIMO (downlink), basic service set coloring, and target wake time (TWT) for improved efficiency
    • Hardware-based encryption and decryption supporting WPA2 and WPA3
    • Excellent interoperability
    • Support for 4-bit SDIO or SPI host interfaces
  • Bluetooth Low Energy 5.4
    • LE coded PHYs (long range), LE 2M PHY (high speed) and advertising extension
    • Host controller interface (HCI) transport with option for UART or shared SDIO
  • Enhanced security
    • Secured host interface
    • Firmware authentication
    • Anti-rollback protection
  • Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
  • Optional antenna diversity or selection
  • 3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (for example, Thread or Zigbee)
  • Power management
    • VMAIN, VIO, Vpp: 1.8V
    • VPA: 3.3V
  • Clock sources
    • 40-MHz XTAL fast clock
    • Internal slow clock or external 32.768kHz slow clock
  • Small package size
    • Easy to design with 40-pin, 5mm × 5mm quad flat no-leaded (QFN) package, 0.4mm pitch

The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 devices. The CC3350 and CC3351 are the first dual-band devices in this pin-to-pin compatible family.

  • CC3350: A 2.4GHz and 5GHz Wi-Fi 6 companion IC

  • CC3351: A 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 companion IC

The CC335x offers Wi-Fi 6 and BLE while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5 (802.11ac). These CC335x are the 10th-generation connectivity combination chip from Texas Instruments. As such, the CC335x is based on proven technology. These devices are ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP. CC335x brings the efficiency of Wi-Fi 6 to embedded device applications for the internet of things (IoT), with a small PCB footprint and highly optimized bill of materials.

The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 devices. The CC3350 and CC3351 are the first dual-band devices in this pin-to-pin compatible family.

  • CC3350: A 2.4GHz and 5GHz Wi-Fi 6 companion IC

  • CC3351: A 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 companion IC

The CC335x offers Wi-Fi 6 and BLE while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5 (802.11ac). These CC335x are the 10th-generation connectivity combination chip from Texas Instruments. As such, the CC335x is based on proven technology. These devices are ideal for use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP. CC335x brings the efficiency of Wi-Fi 6 to embedded device applications for the internet of things (IoT), with a small PCB footprint and highly optimized bill of materials.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CC335x SimpleLink 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Companion IC datasheet PDF | HTML 08 Apr 2024
User guide CC33xx Hardware Integration User's Guide PDF | HTML 20 Dez 2023
Application note CC33xx Production Line Guide (Rev. A) PDF | HTML 16 Nov 2023
User guide CC33xx WLAN Features User's Guide (Rev. B) PDF | HTML 14 Sep 2023

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

BP-CC3351 — Plug-In-Modul für SimpleLink™ CC3351 Dualband Wi-Fi 6 und energieeffizientes Bluetooth® BoosterPack™

Die SimpleLink™ CC3351 Dual-BandWi-Fi 6 und Bluetooth® Low Energy-Bausteine ermöglichen erschwingliche, zuverlässige und sichere Konnektivität in Embedded-Anwendungen mit einem Prozessor-Host unter Linux® oder einem MCU-Host unter RTOS. Das CC3351 BoosterPackTM; Steckmodul (BP-CC3351) ist ein Test- (...)

Benutzerhandbuch: PDF | HTML
Tochterkarte

BDE-3P-WIRELESS-MODULES — BDE SimpleLink MCU modules

BDE Technology, Inc. is a TI-certified third-party module provider. Based on TI's CCXXXX wireless connectivity products, BDE's modules allow customers to shorten development cycles, reduce design uncertainty, lower production cost and release more competitive products into markets quickly (...)

Anwendungssoftware und Frameworks

SIMPLELINK-WIFI-TOOLBOX SimpleLink Wi-Fi Toolbox collection of tools to help development and testing of the CC33xx

The Wi-Fi toolbox package provides all the capabilities required to debug and monitor WLAN/Bluetooth® Low Energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

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CC33XX-LINUX-MPU CC33xx device driver source for MPUs running Linux OS.

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CCSTUDIO Code Composer Studio integrated development environment (IDE)

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