Produktdetails

Processor Arm® Cortex®-M33 Type Wireless MCU Technology Bluetooth® LE, Wi-Fi Protocols Qualified against Bluetooth® Core 5.4, Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS Certifications Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 20 Features 2M PHY, 802.11ax, AP, COEX, Coded PHY, Extended advertising, LE Secure Connections, STA Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG
Processor Arm® Cortex®-M33 Type Wireless MCU Technology Bluetooth® LE, Wi-Fi Protocols Qualified against Bluetooth® Core 5.4, Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Operating system FreeRTOS Certifications Wi-Fi CERTIFIED Chip Throughput UDP (max) (Mbps) 20 Features 2M PHY, 802.11ax, AP, COEX, Coded PHY, Extended advertising, LE Secure Connections, STA Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, PSA level 1 and 2 ready, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Cryptographic accelerators RNG
VQFN (RSH) 56 49 mm² 7 x 7

Microcontroller

  • Powerful 160MHz Arm Cortex-M33 processor with FPU, TrustZone, and AI acceleration
  • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption
  • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code execution performance
  • 1.1MB embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth Low Energy, networking, and application data

Peripherals

  • Up to 38 I/Os with flexible multiplexing options
  • 8 × general-purpose timers and pulse-width modulation (PWM)
  • 3 × universal asynchronous receiver-transmitter (UART)
  • 2 × Serial Peripheral Interface (SPI)
  • 2 × inter-integrated circuit (I2C)
  • Inter-IC sound (I2S)
  • Pulse density modulation (PDM)
  • Secure digital and multimedia card (SD/MMC)
  • Secure digital input output (SDIO) 2.0
  • Controller area network (CAN) 2.0
  • 8-channel, 12-bit analog-to-digital converter (ADC)

System Services

  • Direct memory access (DMA)
  • One-time-programmable memory (OTP)
  • Real-time clock (RTC) and watchdog timer (WDT)

Radio

  • Wi-Fi 6 (802.11ax)

    • 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP)
    • Compatible with IEEE 802.11 a/b/g/n/ax
      • Orthogonal frequency-division multiple access (OFDMA)
      • Target wake time (TWT)
      • Trigger frames
      • Basic service set (BSS) color
    • Integrated PA for a complete WLAN system with up to 20.5dBm output power at 1 DSSS
    • Role support: STA, softAP , Wi-Fi direct, multi-role AP + STA
    • Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise
    • Wi-Fi TX Power:
      • 20.5dBm at 1DSSS
      • 17.8dBm at 54OFDM
    • Wi-Fi RX Sensitivity:
      • –98.7dBm at 1DSSS
      • –76.6dBm at 54OFDM
  • Bluetooth low energy
    • Bluetooth low energy 5.4 certified stack
    • Supports long-range and high-speed PHYs (up to 2Mbps)

Security Features

  • ARM TrustZone
  • Hardware security module supporting all of the following:
    • ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
    • Secure key storage
  • Initial secure programming
  • Secure boot
  • Software IP and cloning protection
  • Debug security through JTAG and debug port lock
  • OTP with the ability to program root-of-trust public key
  • Secure over-the-air (OTA) updates
  • Anti-rollback protection

Clock Source

  • Fast clock: 52MHz XTAL
  • Slow clock: Internal low-frequency oscillator, 32.768kHz XTAL, or external slow clock source

Power Management

  • Support for 3.3V and 1.8V on multiple I/O domains
  • Supplies: VPA: 3.3V, VMAIN: 1.8V, VIO: 1.8/3.3V

Key Benefits

  • Complete software development kit with open-source TCP/IP and TLS stacks
  • Operating temperature: –40°C to +105°C
  • Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee)
  • Antenna selection capability

Package

  • Easy to design with 56-pin, 7mm × 7mm quad flat no leaded (QFN) package

Microcontroller

  • Powerful 160MHz Arm Cortex-M33 processor with FPU, TrustZone, and AI acceleration
  • High-speed quad-SPI and octal-SPI for XiP flash with on-the-fly decryption
  • Flexible configuration of low-latency TCM (up to 32KB) and Cache (32KB or 64KB) for improved code execution performance
  • 1.1MB embedded SRAM including 128KB TCM for Wi-Fi™, Bluetooth Low Energy, networking, and application data

Peripherals

  • Up to 38 I/Os with flexible multiplexing options
  • 8 × general-purpose timers and pulse-width modulation (PWM)
  • 3 × universal asynchronous receiver-transmitter (UART)
  • 2 × Serial Peripheral Interface (SPI)
  • 2 × inter-integrated circuit (I2C)
  • Inter-IC sound (I2S)
  • Pulse density modulation (PDM)
  • Secure digital and multimedia card (SD/MMC)
  • Secure digital input output (SDIO) 2.0
  • Controller area network (CAN) 2.0
  • 8-channel, 12-bit analog-to-digital converter (ADC)

System Services

  • Direct memory access (DMA)
  • One-time-programmable memory (OTP)
  • Real-time clock (RTC) and watchdog timer (WDT)

Radio

  • Wi-Fi 6 (802.11ax)

    • 2.4GHz and 5GHz, single-stream 20MHz channels with application throughput up to 20Mbps (UDP)
    • Compatible with IEEE 802.11 a/b/g/n/ax
      • Orthogonal frequency-division multiple access (OFDMA)
      • Target wake time (TWT)
      • Trigger frames
      • Basic service set (BSS) color
    • Integrated PA for a complete WLAN system with up to 20.5dBm output power at 1 DSSS
    • Role support: STA, softAP , Wi-Fi direct, multi-role AP + STA
    • Support for personal and enterprise Wi-Fi security: WPA and WPA2 PSK, WPA2 Enterprise, WPA3 personal or enterprise
    • Wi-Fi TX Power:
      • 20.5dBm at 1DSSS
      • 17.8dBm at 54OFDM
    • Wi-Fi RX Sensitivity:
      • –98.7dBm at 1DSSS
      • –76.6dBm at 54OFDM
  • Bluetooth low energy
    • Bluetooth low energy 5.4 certified stack
    • Supports long-range and high-speed PHYs (up to 2Mbps)

Security Features

  • ARM TrustZone
  • Hardware security module supporting all of the following:
    • ECC, RSA, AES, SHA2/3, MD5, CRC 16/32, and TRNG
    • Secure key storage
  • Initial secure programming
  • Secure boot
  • Software IP and cloning protection
  • Debug security through JTAG and debug port lock
  • OTP with the ability to program root-of-trust public key
  • Secure over-the-air (OTA) updates
  • Anti-rollback protection

Clock Source

  • Fast clock: 52MHz XTAL
  • Slow clock: Internal low-frequency oscillator, 32.768kHz XTAL, or external slow clock source

Power Management

  • Support for 3.3V and 1.8V on multiple I/O domains
  • Supplies: VPA: 3.3V, VMAIN: 1.8V, VIO: 1.8/3.3V

Key Benefits

  • Complete software development kit with open-source TCP/IP and TLS stacks
  • Operating temperature: –40°C to +105°C
  • Support for 3-wire PTA coexistence interface for use with external 2.4GHz radios (for example Thread or Zigbee)
  • Antenna selection capability

Package

  • Easy to design with 56-pin, 7mm × 7mm quad flat no leaded (QFN) package

The SimpleLink™ Wi-Fi system-on-chip CC35xx family is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC35xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 wireless microcontrollers (MCUs). The CC3550E and CC3551E are the first dual-band devices in this pin-to-pin compatible family.

  • CC3550E: 2.4GHz and 5GHz Wi-Fi 6 wireless MCU
  • CC3551E: 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 wireless MCU

The CC355xE offers the latest standards from Wi-Fi and Bluetooth Low Energy while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n)and Wi-Fi 5 (802.11 ac). These CC355xE are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC355xE is based on proven technology. These devices are an excellent choice to use in cost-sensitive embedded applications with RTOS software. CC355xE brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials. Future device flavors will include in-package PSRAM for additional runtime memory, see the table below.

The SimpleLink™ Wi-Fi system-on-chip CC35xx family is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC35xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 wireless microcontrollers (MCUs). The CC3550E and CC3551E are the first dual-band devices in this pin-to-pin compatible family.

  • CC3550E: 2.4GHz and 5GHz Wi-Fi 6 wireless MCU
  • CC3551E: 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 wireless MCU

The CC355xE offers the latest standards from Wi-Fi and Bluetooth Low Energy while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n)and Wi-Fi 5 (802.11 ac). These CC355xE are the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC355xE is based on proven technology. These devices are an excellent choice to use in cost-sensitive embedded applications with RTOS software. CC355xE brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT), with a small PCB footprint and highly optimized bill of materials. Future device flavors will include in-package PSRAM for additional runtime memory, see the table below.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet CC355xE SimpleLink 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Wireless MCU datasheet PDF | HTML 11 Dez 2024
* Errata CC355xE SimpleLink 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Wireless MCU Errata PDF | HTML 05 Dez 2025
User guide CC35xx SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU Technical Reference Manual PDF | HTML 11 Dez 2025
Technical article Solving key wireless connectivity cyber security challenges with low-power wireless MCUs (Rev. A) PDF | HTML 11 Dez 2024

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

LP-EM-CC35X1 — CC35xxE LaunchPad™-Entwicklungskit für drahtlose Low Energy-MCU mit SimpleLink™, WLAN 6 und Bluetoot

Das Entwicklungskit LP-EM-CC35X1 für SimpleLink™ und LaunchPad™ stellt die drahtlose Lösung CC3551E für WLAN 6 und Bluetooth® Low Energy Drahtlos-MCU vor und bietet eine Test- und Entwicklungsplatine, die über auf der Platine integrierte Sensoren, Tasten und einfache Schnittstellenoptionen für (...)
Benutzerhandbuch: PDF | HTML
Tochterkarte

BDE-3P-BW3551X — Drahtlose TI CC3551E-Module

BDE-BW3551 ist eine drahtlose 2,4 GHz- und 5 GHz-Dualband-Wi-Fi® 6- und Bluetooth® LE-Kombimodul-Serie auf Basis des SimpleLink™ Wi-Fi-System-on-Chip-CC3551 von TI. Diese Modulserie eignet sich perfekt für kostengünstige integrierte Anwendungen mit RTOS-Software, bei denen der Spitzendurchsatz von (...)
Tochterkarte

TTC-3P-SR3551 — TTC SR-355101PC2N unterstützt 2,4 GHz und 5 GHz Dual-Band Wi-Fi 6 und BLE

Das CC3551E-Modul ist ein drahtloses WIFI+-Bluetooth-Dual-in-One-Modul, das auf der Basis des CC3551E als Kern entwickelt wurde. Wifi unterstützt MAC-, Basisband- und HF-Transceiver von IEEE 802.11b /g/n/ax bei 2,4 GHz und 5 GHz, 20 MHz-Single-Stream-Kanal, Anwendungsdurchsatz bis zu 20 Mbps (UDP), (...)

Entwicklungskit

WS-3P-WS8712 — 2,4-GHz- und 5-GHz-Dualband-WiFi-6- und BLE5.4-Bluetooth-Modul

Das WS8712 ist ein hochleistungsfähiges, hochzuverlässiges Dualband-WiFi-6- und Bluetooth®-Modul, das auf der Grundlage des WiFi-6-Chips der nächsten Generation CC3551E von TI entwickelt wurde. Es verfügt über einen leistungsstarken integrierten Arm® Cortex® M33 Prozessor mit 160 MHz, FPU, (...)

Software-Entwicklungskit (SDK)

SIMPLELINK-WIFI-SDK SimpleLink Wi-Fi SDK for the CC35xxE Devices

The SimpleLink™ Wi-Fi® SDK provides a comprehensive software toolkit for developing IoT applications on the CC35xxE family of wireless MCUs. This powerful SDK includes essential components like the Bluetooth® LE protocol stack supporting Bluetooth 5.4, Wi-Fi 6 with an included networking stack (...)
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Anwendungssoftware und Frameworks

SIMPLELINK-WIFI-TOOLBOX SimpleLink Wi-Fi Toolbox collection of tools to help development and testing of the CC33xx and CC35xxE Devices

The Wi-Fi toolbox package provides all the capabilities required to debug and monitor WLAN/Bluetooth® Low Energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

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IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

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IDE, Konfiguration, Compiler oder Debugger

SYSCONFIG Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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Software-Programmiertool

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RSH) 56 Ultra Librarian

Bestellen & Qualität

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  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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