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CSD95373BQ5M

ACTIVO

Etapa de potencia inteligente NexFET™ buck sincrónico de 45 A

Detalles del producto

Rating Catalog VDS (V) 20 Ploss current (A) 25 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
Rating Catalog VDS (V) 20 Ploss current (A) 25 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
LSON-CLIP (DQP) 12 30 mm² (6 mm × 5 mm)
  • 45-A Continuous Operating Current Capability
  • 92.7% System Efficiency at 25 A
  • Low-Power Loss of 2.6 W at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 45-A Continuous Operating Current Capability
  • 92.7% System Efficiency at 25 A
  • Low-Power Loss of 2.6 W at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos CSD95373BQ5M Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) PDF | HTML 12/07/2017

Diseño y desarrollo

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LSON-CLIP (DQP) 12 Ultra Librarian

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