Inicio Interfaz Serializadores-deserializadores de alta velocidad Serializadores-deserializadores FPD-Link

Transmisor LVDS programable de 3.3 V para pantalla plana de 24 bits (FPD-Link) y 65 MHz

Detalles del producto

Applications In-vehicle Infotainment (IVI) EMI reduction LVDS Rating Catalog Operating temperature range (°C) to
Applications In-vehicle Infotainment (IVI) EMI reduction LVDS Rating Catalog Operating temperature range (°C) to
TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • 20 to 65 MHz shift clock support
  • Programmable transmitter (DS90C383) strobe select
    (Rising or Falling edge strobe)
  • Single 3.3V supply
  • Chipset (Tx + Rx) power consumption < 250 mW (typ)
  • Power-down mode (< 0.5 mW total)
  • Single pixel per clock XGA (1024x768) ready
  • Supports VGA, SVGA, XGA and higher addressability.
  • Up to 227 Megabytes/sec bandwidth
  • Up to 1.8 Gbps throughput
  • Narrow bus reduces cable size and cost
  • 290 mV swing LVDS devices for low EMI
  • PLL requires no external components
  • Low profile 56-lead TSSOP package.
  • DS90CF384 also available in 64 ball, 0.8mm fine pitch
    ball grid array(FBGA) package
  • Falling edge data strobe Receiver
  • Compatible with TIA/EIA-644 LVDS standard
  • ESD rating >7 kV
  • Operating Temperature: –40°C to +85°C

  • 20 to 65 MHz shift clock support
  • Programmable transmitter (DS90C383) strobe select
    (Rising or Falling edge strobe)
  • Single 3.3V supply
  • Chipset (Tx + Rx) power consumption < 250 mW (typ)
  • Power-down mode (< 0.5 mW total)
  • Single pixel per clock XGA (1024x768) ready
  • Supports VGA, SVGA, XGA and higher addressability.
  • Up to 227 Megabytes/sec bandwidth
  • Up to 1.8 Gbps throughput
  • Narrow bus reduces cable size and cost
  • 290 mV swing LVDS devices for low EMI
  • PLL requires no external components
  • Low profile 56-lead TSSOP package.
  • DS90CF384 also available in 64 ball, 0.8mm fine pitch
    ball grid array(FBGA) package
  • Falling edge data strobe Receiver
  • Compatible with TIA/EIA-644 LVDS standard
  • ESD rating >7 kV
  • Operating Temperature: –40°C to +85°C

The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999).

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999).

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

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Documentación técnica

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Tipo Título Fecha
* Data sheet DS90C383/F384 3.3VProg LVDS Trans 24Bit FPD, 65MHz,3.3VLVDS Rcvr 24Bit FPD 65MHz datasheet (Rev. A) 13 may 2004
Application note High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs 09 nov 2018

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

DS90C383 IBIS Model

SNLM079.ZIP (4 KB) - IBIS Model
Herramienta de simulación

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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

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TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Paquete Pasadores Descargar
TSSOP (DGG) 56 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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