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SN74AUP1G126

ACTIVO

Búfer único de baja potencia, de 0.8 V a 3.6 V, con salidas de 3 estados

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SN74AUP1G126

ACTIVO
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Detalles del producto

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) -4 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) -4 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22−
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Input-Disable Feature Allows Floating Input Conditions
  • Ioff Supports Partial-Power-Down Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.6 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22−
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Input-Disable Feature Allows Floating Input Conditions
  • Ioff Supports Partial-Power-Down Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.6 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity ).

This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.

To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity ).

This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.

To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet SN74AUP1G126 Low-Power Single Bus Buffer Gate With Tri-State Output datasheet (Rev. G) PDF | HTML 15 nov 2017
Selection guide Logic Guide (Rev. AC) PDF | HTML 13 nov 2025
Application brief Understanding Schmitt Triggers (Rev. B) PDF | HTML 17 abr 2025
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 ago 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación de lógico genérico para encapsulados DCK, DCT, DCU, DRL y DBV,de 5- a 8-pines

EVM flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV y entre 5 y 8 pines.
Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

5-8-NL-LOGIC-EVM — EVM genérico de lógica y traducción compatible con paquetes DPW, DQE, DRY, DSF, DTM, DTQ y DTT de 5

EVM genérico diseñado para admitir cualquier dispositivo lógico o de conversión que tenga un encapsulado DTT, DRY, DPW, DTM, DQE, DQM, DSF o DTQ. El diseño del tablero permite una evaluación flexible.

Guía del usuario: PDF | HTML
No disponible en TI.com
Modelo de simulación

SN74AUP1G126 Behavioral SPICE Model

SCEM688.ZIP (7 KB) - PSpice Model
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Modelo de simulación

SN74AUP1G126 IBIS Model (Rev. B)

SCEM459B.ZIP (79 KB) - IBIS Model
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFP) 6 Ultra Librarian
DSBGA (YZP) 5 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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