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TPS53317

ACTIVO

Convertidor SWIFT™ reductor síncrono de 6 A, de tensión de entrada baja, para terminador de memoria

Detalles del producto

Vin (min) (V) 1 Vin (max) (V) 6 Vout (min) (V) -0.3 Vout (max) (V) 3.6 Features Complete Solution Iq (typ) (mA) 0.32 Rating Catalog Operating temperature range (°C) -40 to 85 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
Vin (min) (V) 1 Vin (max) (V) 6 Vout (min) (V) -0.3 Vout (max) (V) 3.6 Features Complete Solution Iq (typ) (mA) 0.32 Rating Catalog Operating temperature range (°C) -40 to 85 Product type DDR DDR memory type DDR, DDR2, DDR3, DDR3L, DDR4, LPDDR2, LPDDR3
VQFN (RGB) 20 14 mm² 4 x 3.5
  • TI proprietary Integrated MOSFET and Packaging Technology
  • Supports DDR Memory Termination with up to 6-A Continuous Output Source or Sink Current
  • External Tracking
  • Minimum External Components Count
  • to 6-V Conversion Voltage
  • D-CAP+ Mode Architecture
  • Supports All MLCC Output Capacitors and SP/POSCAP
  • Selectable SKIP Mode or Forced CCM
  • Optimized Efficiency at Light and Heavy Loads
  • Selectable 600-kHz or 1-MHz Switching Frequency
  • Selectable Overcurrent Limit (OCL)
  • Overvoltage, Over-Temperature and Hiccup Undervoltage Protection
  • Adjustable Output Voltage from to 2 V
  • 3.5 mm × 4 mm, 20-Pin VQFN Package
  • TI proprietary Integrated MOSFET and Packaging Technology
  • Supports DDR Memory Termination with up to 6-A Continuous Output Source or Sink Current
  • External Tracking
  • Minimum External Components Count
  • to 6-V Conversion Voltage
  • D-CAP+ Mode Architecture
  • Supports All MLCC Output Capacitors and SP/POSCAP
  • Selectable SKIP Mode or Forced CCM
  • Optimized Efficiency at Light and Heavy Loads
  • Selectable 600-kHz or 1-MHz Switching Frequency
  • Selectable Overcurrent Limit (OCL)
  • Overvoltage, Over-Temperature and Hiccup Undervoltage Protection
  • Adjustable Output Voltage from to 2 V
  • 3.5 mm × 4 mm, 20-Pin VQFN Package

The device is a FET-integrated synchronous buck regulator designed mainly for DDR termination. It can provide a regulated output at ½ VDDQ with bothsink and source capability. The device employs D-CAP+ mode operation that provides ease of use, low external componentcount and fast transient response. The device can also be used for other point-of-load (POL)regulation applications requiring up to 6 A. In addition, the device supports full, 6-A, outputsinking current capability with tight voltage regulation.

The device features two switching frequency settings (600 kHz and 1 MHz), integrateddroop support, external tracking capability, pre-bias startup, output soft discharge, integratedbootstrap switch, power good function, V5IN pin UVLO protection, and supports both ceramic andSP/POSCAP capacitors. It supports input voltages up to 6.0 V, and output voltages adjustable from to 2.0 V.

The device is available in the 3.5 mm × 4 mm, 20-pin, VQFNpackage (Green RoHs compliant and Pb free) with TI proprietary Integrated MOSFET and packaging technology and is specified from –40°C to 85°C.

For all available packages, see the orderable addendum at the end of the data sheet.

The device is a FET-integrated synchronous buck regulator designed mainly for DDR termination. It can provide a regulated output at ½ VDDQ with bothsink and source capability. The device employs D-CAP+ mode operation that provides ease of use, low external componentcount and fast transient response. The device can also be used for other point-of-load (POL)regulation applications requiring up to 6 A. In addition, the device supports full, 6-A, outputsinking current capability with tight voltage regulation.

The device features two switching frequency settings (600 kHz and 1 MHz), integrateddroop support, external tracking capability, pre-bias startup, output soft discharge, integratedbootstrap switch, power good function, V5IN pin UVLO protection, and supports both ceramic andSP/POSCAP capacitors. It supports input voltages up to 6.0 V, and output voltages adjustable from to 2.0 V.

The device is available in the 3.5 mm × 4 mm, 20-pin, VQFNpackage (Green RoHs compliant and Pb free) with TI proprietary Integrated MOSFET and packaging technology and is specified from –40°C to 85°C.

For all available packages, see the orderable addendum at the end of the data sheet.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TPS53317 6-A Output, D-CAP+ Mode, Synchronous Step-Down, Integrated-FET Converter for DDR Memory Termination datasheet (Rev. D) PDF | HTML 10 jul 2015
Selection guide SWIFT DC/DC Converters Selector Guide (Rev. G) 06 feb 2019
Selection guide Power Management Guide 2018 (Rev. R) 25 jun 2018
EVM User's guide Using the TPS53317EVM-750 D-CAP+™ Mode Synchronous Step-Down Integrated FETs Con 06 sep 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

TPS53317 IBIS Model

SLUM347.ZIP (10 KB) - IBIS Model
Modelo de simulación

TPS53317 PSpice Transient Model

SLUM370.ZIP (64 KB) - PSpice Model
Paquete Pasadores Descargar
VQFN (RGB) 20 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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