The TRF1305C1
is a very-high-performance, closed-loop, single-channel RF
amplifier that has an operational bandwidth from true dc to > 7GHz. The device has
excellent performance to drive high-speed, high-performance ADCs, such as the ADC12DJ5200RF and ADC32RF5x with a dc- or ac-coupled interface. The amplifier is
optimized for use in RF, zero and complex IF, and high-speed time-domain applications. The
device is optimized for performance in the fixed gain configuration. If lower gain is
desired, use external resistors.
The TRF1305C1
features a VOCM pin that allows setting different output common-mode and input common-mode
voltages; for example, level-shifting or for most IQ down-converter ADC-interface
applications that have differing dc common-mode voltages. The TRF1305C1 also features a floating two-rail split or single-supply option, and a
MODE pin that allows extending the input common-mode range closer to the supplies. The device also has a power-down feature.
The device is fabricated with TIs
proprietary advanced BiCMOS process and is available in a space-saving, 2mm × 2mm,
WQFN-FCRLF package.
The TRF1305C1
is a very-high-performance, closed-loop, single-channel RF
amplifier that has an operational bandwidth from true dc to > 7GHz. The device has
excellent performance to drive high-speed, high-performance ADCs, such as the ADC12DJ5200RF and ADC32RF5x with a dc- or ac-coupled interface. The amplifier is
optimized for use in RF, zero and complex IF, and high-speed time-domain applications. The
device is optimized for performance in the fixed gain configuration. If lower gain is
desired, use external resistors.
The TRF1305C1
features a VOCM pin that allows setting different output common-mode and input common-mode
voltages; for example, level-shifting or for most IQ down-converter ADC-interface
applications that have differing dc common-mode voltages. The TRF1305C1 also features a floating two-rail split or single-supply option, and a
MODE pin that allows extending the input common-mode range closer to the supplies. The device also has a power-down feature.
The device is fabricated with TIs
proprietary advanced BiCMOS process and is available in a space-saving, 2mm × 2mm,
WQFN-FCRLF package.