250mA 고속 버퍼 - 업그레이드된 버전은 BUF634A 참조

BUF634은(는) 새 설계에 권장하지 않습니다.
이 제품은 기존 고객을 위해 계속 제공됩니다. 새로운 설계는 대체 제품을 고려해야 합니다.
open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
BUF634A 활성 210MHz, 250mA 고속 버퍼 BUF634A has higher slew rate (3750 V/µs) and wider bandwidth (210 MHz) at a 40% lower quiescent current (8.5 mA) and is available at a lower cost

제품 상세 정보

Architecture Fixed Gain/Buffer Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 GBW (typ) (MHz) 180 BW at Acl (MHz) 180 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 2000 Vn at flatband (typ) (nV√Hz) 4 Vn at 1 kHz (typ) (nV√Hz) 4 Iq per channel (typ) (mA) 15 Vos (offset voltage at 25°C) (max) (mV) 100 Rail-to-rail No Features Adjustable BW/IQ/IOUT Rating Catalog Operating temperature range (°C) -40 to 125 Input bias current (max) (pA) 20000000 Offset drift (typ) (µV/°C) 100 Iout (typ) (mA) 250 2nd harmonic (dBc) 75 3rd harmonic (dBc) 83 Frequency of harmonic distortion measurement (MHz) 1
Architecture Fixed Gain/Buffer Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 5 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 GBW (typ) (MHz) 180 BW at Acl (MHz) 180 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 2000 Vn at flatband (typ) (nV√Hz) 4 Vn at 1 kHz (typ) (nV√Hz) 4 Iq per channel (typ) (mA) 15 Vos (offset voltage at 25°C) (max) (mV) 100 Rail-to-rail No Features Adjustable BW/IQ/IOUT Rating Catalog Operating temperature range (°C) -40 to 125 Input bias current (max) (pA) 20000000 Offset drift (typ) (µV/°C) 100 Iout (typ) (mA) 250 2nd harmonic (dBc) 75 3rd harmonic (dBc) 83 Frequency of harmonic distortion measurement (MHz) 1
SOIC (D) 8 29.4 mm² 4.9 x 6 TO-220 (KC) 5 45.212 mm² 10.16 x 4.45 TO-263 (KTT) 5 154.8384 mm² 10.16 x 15.24
  • A newer version of this device is now available: BUF634A
  • High output current: 250mA
  • Slew rate: 2000V/µs
  • Pin-selected bandwidth: 30MHz to 180MHz
  • Low quiescent current: 1.5mA (30MHz BW)
  • Wide supply range: ±2.25V to ±18V
  • Internal current limit
  • Thermal shutdown protection
  • Packages:
    • 5-pin SOIC
    • 5-pin TO-220
    • 5-pin TO-263 surface-mount
  • A newer version of this device is now available: BUF634A
  • High output current: 250mA
  • Slew rate: 2000V/µs
  • Pin-selected bandwidth: 30MHz to 180MHz
  • Low quiescent current: 1.5mA (30MHz BW)
  • Wide supply range: ±2.25V to ±18V
  • Internal current limit
  • Thermal shutdown protection
  • Packages:
    • 5-pin SOIC
    • 5-pin TO-220
    • 5-pin TO-263 surface-mount

The BUF634 is a high-speed, unity-gain, open-loop buffer recommended for a wide range of applications. The BUF634 can be used inside the feedback loop of op amps to increase output current, eliminate thermal feedback, and improve capacitive load drive.

For low-power applications, the BUF634 operates on 1.5mA quiescent current with 250mA output, 2000V/µs slew rate, and 30MHz bandwidth. Bandwidth can be adjusted from 30MHz to 180MHz by connecting a resistor between V– and the BW pin.

Output circuitry is fully protected by internal current limit and thermal shutdown, making the device rugged and easy to use.

The BUF634 is available in a variety of packages to meet mechanical and power-dissipation requirements. Types include SOIC‑8 surface-mount, 5‑lead TO‑220, and a 5‑lead TO‑263 (DDPAK) surface-mount plastic power packages.

The BUF634 is a high-speed, unity-gain, open-loop buffer recommended for a wide range of applications. The BUF634 can be used inside the feedback loop of op amps to increase output current, eliminate thermal feedback, and improve capacitive load drive.

For low-power applications, the BUF634 operates on 1.5mA quiescent current with 250mA output, 2000V/µs slew rate, and 30MHz bandwidth. Bandwidth can be adjusted from 30MHz to 180MHz by connecting a resistor between V– and the BW pin.

Output circuitry is fully protected by internal current limit and thermal shutdown, making the device rugged and easy to use.

The BUF634 is available in a variety of packages to meet mechanical and power-dissipation requirements. Types include SOIC‑8 surface-mount, 5‑lead TO‑220, and a 5‑lead TO‑263 (DDPAK) surface-mount plastic power packages.

다운로드

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet BUF634 250mA High-Speed Buffer datasheet (Rev. C) PDF | HTML 2024/03/01

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치