SN65MLVD203B
- Compatible with the M-LVDS standard TIA/EIA-899 for multipoint data interchange
- Low-voltage differential 30-Ω to 55-Ω line driver and receiver for signaling rates(1) up to 200 Mbps, clock frequencies up to 100 MHz
- Type-1 receiver incorporates 25 mV of hysteresis
- Bus I/O protection
- ±8-kV HBM
- ±8-kV IEC 61000-4-2 contact discharge
- Controlled driver output voltage transition times for improved signal quality
- –1-V to 3.4-V common-mode voltage range allows data transfer with 2 V of ground noise
- Bus pins high impedance when disabled or VCC ≤ 1.5 V
- 100-Mbps device available (SN65MLVD202B)
- Improved alternatives to SN65MLVD203 (1)
(1)The signaling rate of a line is the number of voltage transitions that are made per second expressed in the bps of the unit (bits per second).
The SN65MLVD203B device is a multipoint low-voltage differential signaling (M-LVDS) line driver and receiver which is optimized to operate at signaling rates up to 200 Mbps. This device has a robust 3.3-V driver and receiver in the standard QFN footprint for demanding industrial applications. The bus pins are robust to ESD events, with high levels of protection to human-body model and IEC contact discharge specifications.
The device combines a differential driver and a differential receiver (transceiver), which operates from a single 3.3-V supply. The transceiver is optimized to operate at signaling rates up to 200 Mbps.
The SN65MLVD203B has enhancements over similar devices. Improved features include a controlled slew rate on the driver output to help minimize reflections from unterminated stubs, resulting in better signal integrity. The devices are characterized for operation from –40°C to 125°C.
The SN65MLVD203B M-LVDS transceiver is part of the TI extensive M-LVDS portfolio.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SN65MLVD203B Full-Duplex Type-1 Multipoint-LVDS Transceiver With IEC ESD Protection datasheet (Rev. B) | PDF | HTML | 2022/11/02 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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