SN65MLVD203B
- Compatible with the M-LVDS standard TIA/EIA-899 for multipoint data interchange
- Low-voltage differential 30-Ω to 55-Ω line driver
and receiver for signaling rates(1) up to 200 Mbps, clock frequencies up to 100 MHz
- Type-1 receiver incorporates 25 mV of hysteresis
- Bus I/O protection
- ±8-kV HBM
- ±8-kV IEC 61000-4-2 contact discharge
- Controlled driver output voltage transition times for improved signal quality
- –1-V to 3.4-V common-mode voltage range allows data transfer with 2 V of ground noise
- Bus pins high impedance when disabled or VCC ≤ 1.5 V
- 100-Mbps device available (SN65MLVD202B)
- Improved alternatives to SN65MLVD203 (1)
(1)The signaling rate of a line is the number of voltage transitions that are made per second expressed in the bps of the unit (bits per second).
The SN65MLVD203B device is a multipoint low-voltage differential signaling (M-LVDS) line driver and receiver which is optimized to operate at signaling rates up to 200 Mbps. This device has a robust 3.3-V driver and receiver in the standard QFN footprint for demanding industrial applications. The bus pins are robust to ESD events, with high levels of protection to human-body model and IEC contact discharge specifications.
The device combines a differential driver and a differential receiver (transceiver), which operates from a single 3.3-V supply. The transceiver is optimized to operate at signaling rates up to 200 Mbps.
The SN65MLVD203B has enhancements over similar devices. Improved features include a controlled slew rate on the driver output to help minimize reflections from unterminated stubs, resulting in better signal integrity. The devices are characterized for operation from –40°C to 125°C.
The SN65MLVD203B M-LVDS transceiver is part of the TI extensive M-LVDS portfolio.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | SN65MLVD203B Full-Duplex Type-1 Multipoint-LVDS Transceiver With IEC ESD Protection datasheet (Rev. B) | PDF | HTML | 2022. 11. 2 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN (RUM) | 16 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.