TPSI8830
- Integrated back-back MOSFETs with ± 80V
Operation
- RON = 30mΩ (TJ = 25°C)
- IOFF = 1µA at 60V (TJ = 105°C)
- Power path overcurrent protection with fault
signal across isolation
- Version A: 4A
- Version B: 6A
- Wide supply range: 3.0V to 5.5V
- Configurable fault retry timer (TMR)
- Low on-state primary side supply current (VDD)
- 5mA ON state VDD current
- Wide temperature range:–40 to 125°C
- Functional isolation:
- 200VRMS, 250VDC working voltage
- 570VRMS, 800VDC transient voltage (60s)
- SSOP 14-pin (DFP) package with 8mm of creepage and clearance
-
Functional Safety Capable
- Documentation available to aid in ISO 26262 and IEC 61508 system design
The TPSI8830 is an isolated solid-state relay designed for industrial applications. The TPSI8830 uses TI’s high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated option requiring no secondary side power supply. The TPSI8830 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wear-out or photo degradation failure modes common in mechanical relay and photo relay components.
The primary side of the device is powered by only 5mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device must connect to a system supply from 3.0V to 5.5V and the EN pin of the device must be driven by a GPIO output with logic HI from 1.8V to 5.5V. In other applications, the VDD and EN pins can be driven together directly from the system supply or from a GPIO output.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±80V from S1 to S2. The TPSI8830 integrates bidirectional overcurrent protection to prevent damage due to output miswiring or short to ground.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | TPSI8830 80V, 30mΩ, 3A, Solid-State Relay With Overcurrent Protection, Load Diagnostics, and Functional Isolation datasheet | PDF | HTML | 2026. 5. 28 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPSI88XXEVM — TPSI88xx 평가 모듈
TPSI88XXEVM은 TPSI88XX 제품군의 장치 성능을 평가하기 위한 하드웨어 평가 모듈입니다. TPSI88XXEVM을 사용하여 서모스탯 및 PLC 디지털 출력 모듈과 같은 애플리케이션 요구 사항을 평가할 수 있습니다. EVM에는 TPSI8830ZB(DFP 패키지)가 탑재되어 있습니다.
TPSI88XXEVM-DOC-CERT — TPSI88XXEVM EU Declaration of Conformity (DoC)
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SSOP (DFJ) | 14 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.