產品詳細資料

Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1250, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 2-Port 10Gb switch, 8-Port 1Gb switch PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1250, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 2-Port 10Gb switch, 8-Port 1Gb switch PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
FCBGA (ABD) 1089 729 mm² 27 x 27
  • ARM® Cortex®-A15 MPCore™
    CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • One TMS320C66x DSP Core Subsystem (C66x
    CorePacs), Each With
    • 1.4 GHz C66x Fixed/Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @
        1.2 GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D Per CorePac
      • 512K Byte Local L2 Per CorePac
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by DSP CorePacs
      and ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX
        Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone
        Architecture Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds
      Up to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Thirteen 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C
  • ARM® Cortex®-A15 MPCore™
    CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • One TMS320C66x DSP Core Subsystem (C66x
    CorePacs), Each With
    • 1.4 GHz C66x Fixed/Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @
        1.2 GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D Per CorePac
      • 512K Byte Local L2 Per CorePac
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by DSP CorePacs
      and ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX
        Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone
        Architecture Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds
      Up to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Thirteen 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C

The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.

The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.

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類型 標題 日期
* Data sheet 66AK2E05/02 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet (Rev. D) 2015年 3月 11日
* Errata 66AK2E05/02 KeyStone SoC Silicon Errata (Silicon Rev 1.0) (Rev. B) 2015年 8月 20日
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 2024年 4月 30日
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 2023年 3月 30日
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 2023年 3月 30日
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 2022年 7月 7日
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 2021年 6月 25日
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 2021年 5月 19日
Application note Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 2019年 6月 4日
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 2019年 6月 3日
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 2019年 6月 3日
Application note Keystone Multicore Device Family Schematic Checklist PDF | HTML 2019年 5月 17日
Application note KeyStone II DDR3 interface bring-up 2019年 3月 7日
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 2018年 11月 19日
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 2018年 11月 19日
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 2018年 1月 16日
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 2018年 1月 16日
White paper POWERLINK on TI Sitara Processors (Rev. A) 2018年 1月 10日
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 2017年 9月 30日
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 2017年 9月 30日
User guide KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 2017年 8月 21日
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 2017年 8月 14日
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 2017年 7月 26日
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 2017年 6月 21日
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 2017年 6月 21日
Application note Power Consumption Summary for K2E System-on-Chip (SoC) Device Family 2017年 6月 14日
Application note PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A) 2017年 5月 19日
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017年 4月 12日
Application note Clocking Spreadsheet for K2E Device Family 2017年 1月 26日
User guide Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 2016年 7月 27日
Application note Power Management of KS2 Device (Rev. C) 2016年 7月 15日
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 2016年 4月 30日
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 2016年 4月 30日
Application note SERDES Link Commissioning on KeyStone I and II Devices 2016年 4月 13日
Application note TI DSP Benchmarking 2016年 1月 13日
Application note Throughput Performance Guide for KeyStone II Devices (Rev. B) 2015年 12月 22日
Application note Keystone II DDR3 Debug Guide 2015年 10月 16日
White paper Making your search SIMPLE, even when your ideas are complex 2015年 8月 10日
White paper Processing solutions for biometric systems 2015年 6月 30日
White paper Quality of service on Keystone II architecture 2015年 5月 7日
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 2015年 5月 6日
User guide Gigabit Ethernet (GbE) Switch SS for K2E & K2L Devices User's Guide (Rev. A) 2015年 4月 28日
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 2015年 4月 9日
User guide DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 2015年 3月 27日
White paper Save power and costs with TI's K2E on-chip networking features 2015年 3月 25日
Application note Keystone II DDR3 Initialization 2015年 1月 26日
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 2014年 11月 5日
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 2014年 11月 5日
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 2014年 9月 4日
Product overview 66AK2Ex KeyStone Multicore DSP+ARM(R) System-on-Chips (Rev. A) 2014年 9月 3日
White paper KeyStone™-II-based processors: 10G Ethernet as an optical interface 2014年 8月 25日
User guide Packet Accelerator 2 (PA2) for K2E and K2L Devices User's Guide 2014年 8月 19日
User guide Security Accelerator 2 (SA2) for K2E and K2L Devices User's Guide 2014年 8月 19日
White paper Differentiating AM5K2E02 and AM5K2E04 SoCs from Alternate ARM® Cortex®-A15 Devic 2014年 8月 14日
User guide Network Coprocessor (NETCP) for K2E and K2L Devices User's Guide 2014年 8月 13日
Application note Hardware Design Guide for KeyStone II Devices 2014年 3月 24日
Product overview The Case for 10G Ethernet in Embedded Processing 2013年 11月 13日
User guide PCI Express (PCIe) for KeyStone Devices User's Guide (Rev. D) 2013年 9月 30日
User guide Debug and Trace for KeyStone II Devices User's Guide 2013年 7月 26日
User guide ARM Bootloader User Guide for KeyStone II Devices 2013年 7月 21日
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 2013年 7月 15日
User guide C66x CorePac User's Guide (Rev. C) 2013年 6月 28日
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 2013年 6月 28日
User guide HyperLink for KeyStone Devices User's Guide (Rev. C) 2013年 5月 28日
User guide 10 Gigabit Ethernet Switch Subsystem User Guide for KeyStone II Devices 2013年 2月 8日
User guide Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 2012年 11月 12日
Product overview Industrial Imaging: Applications of the K2H and K2E platforms 2012年 11月 9日
Product overview Video Infrastructure - Applications of the K2E, K2H platforms 2012年 11月 9日
User guide ARM CorePac User Guide for KeyStone II Devices 2012年 10月 31日
Application note Multicore Programming Guide (Rev. B) 2012年 8月 29日
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 2012年 3月 30日
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 2012年 3月 27日
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 2012年 3月 22日
Application note PCIe Use Cases for KeyStone Devices 2011年 12月 13日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 2011年 9月 2日
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 2011年 5月 24日
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011年 5月 19日
User guide C66x CPU and Instruction Set Reference Guide 2010年 11月 9日
User guide C66x DSP Cache User's Guide 2010年 11月 9日
Application note Clocking Design Guide for KeyStone Devices 2010年 11月 9日
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 2010年 11月 9日
Application note Optimizing Loops on the C66x DSP 2010年 11月 9日
User guide Telecom Serial Interface Port (TSIP) for KeyStone Devices User's Guide 2010年 11月 9日
User guide Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices UG 2010年 11月 9日

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TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器 (模擬器)。與低成本 XDS110 和高效能 XDS560v2 相比,XDS200 是兼具低成本與優異效能的完美平衡,可在單一 pod 中支援各種標準 (IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探測器均支援具嵌入式追踪緩衝區 (ETB) 的 Arm® 與 DSP 處理器中的核心和系統追蹤功能。透過針腳進行核心追蹤則需要 XDS560v2 PRO TRACE

XDS200 透過 TI 20 針腳連接器 (配備適用 TI 14 針腳、Arm Cortex® 10 針腳和 Arm 20 針腳的多重轉接器) (...)

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所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

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TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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開發套件

EVMK2EX — K2E 開發基板

The EVMK2EX is a full-featured development tool for 66AK2Exx and AM5K2Exx KeyStone II based SoCs. Get started developing general purpose embedded computing systems for industrial, mission critical, and networking applications today with this double-wide AMC form-factor evaluation board featuring a (...)

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軟體開發套件 (SDK)

BIOSLINUXMCSDK-K2 MCSDK supporting SYS/BIOS RTOS and Linux OS for KeyStone II ARM A15 + DSP C66x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

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Arm 式處理器
66AK2E05 高效能多核心 DSP+Arm - 4x Arm A15 核心、1x C66x DSP 核心、NetCP、10GbE 66AK2H06 高效能多核心 DSP+Arm - 2x Arm A15 核心、4x C66x DSP 核心 66AK2H12 高效能多核心 DSP+Arm - 4x Arm A15 核心、8x C66x DSP 核心 66AK2H14 高效能多核心 DSP+Arm - 4x Arm A15 核心、8x C66x DSP 核心、10GbE AM5K2E02 Sitara 處理器雙 Arm Cortex-A15 AM5K2E04 Sitara 處理器:四 Arm Cortex-A15
數位訊號處理器 (DSP)
66AK2L06 多核心 DSP+ARM KeyStone II 晶片系統 (SoC)
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PROCESSOR-SDK-LINUX-K2E Linux Processor SDK for K2E

 

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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66AK2E05 高效能多核心 DSP+Arm - 4x Arm A15 核心、1x C66x DSP 核心、NetCP、10GbE AM5K2E02 Sitara 處理器雙 Arm Cortex-A15 AM5K2E04 Sitara 處理器:四 Arm Cortex-A15
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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-RT-K2E Linux-RT Processor SDK for K2E

 

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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產品
Arm 式處理器
66AK2E05 高效能多核心 DSP+Arm - 4x Arm A15 核心、1x C66x DSP 核心、NetCP、10GbE AM5K2E02 Sitara 處理器雙 Arm Cortex-A15 AM5K2E04 Sitara 處理器:四 Arm Cortex-A15
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軟體開發套件 (SDK)

PROCESSOR-SDK-RTOS-K2E RTOS Processor SDK for K2E

 

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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產品
Arm 式處理器
66AK2E05 高效能多核心 DSP+Arm - 4x Arm A15 核心、1x C66x DSP 核心、NetCP、10GbE AM5K2E02 Sitara 處理器雙 Arm Cortex-A15 AM5K2E04 Sitara 處理器:四 Arm Cortex-A15
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軟體開發套件 (SDK)

S2MEDDUS — 醫學影像軟體工具套件 (STK)

The TI Embedded Processor Software Toolkit for Medical Imaging (STK-MED) is a collection of several standard ultrasound and optical coherence tomography (OCT) algorithms for TI’s C66x™ and C64x+™ architecture. The algorithms showcase how medical imaging functions can leverage the C66x and (...)
程式碼範例或展示

DEMOVIDEO-MULTICORE — 適用於多核心軟體開發套件 (MCSDK) 的多核心視訊基礎結構示範

This Multicore Video Infrastructure Demo package provides highly-optimized platform and video software components and enables development of real-time video applications on C66x multicore devices. The Multicore Video Infrastructure Demo gives developers the ability to evaluate performance and (...)
驅動程式或資料庫

FFTLIB — 適用於浮點裝置的 FFT 函式庫

The Texas Instruments FFT library is an optimized floating-point math function library for computing the discrete Fourier transform (DFT).
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MATHLIB — 用於浮點裝置的 DSP 數學函式庫

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
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SPRC264 — TMS320C5000/6000 映像庫 (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
使用指南: PDF
驅動程式或資料庫

SPRC265 — TMS320C6000 DSP 庫 (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
使用指南: PDF
IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

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軟體轉碼器

C66XCODECS — 轉碼器 - 視訊、語音 - 適用於 C66x 架構產品

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
模擬型號

66AK2E05 66AK2E02 ABD IBIS Model

SPRM611.ZIP (2180 KB) - IBIS Model
模擬型號

66AK2E05 66AK2E02 ABD BSDL Model

SPRM612.ZIP (28 KB) - BSDL Model
模擬型號

66AK2E05 66AK2E02 ABD Thermal Model

SPRM613.ZIP (5 KB) - Thermal Model
模擬型號

66AK2E05 and 66AK2E02 Power Consumption Model (Rev. A)

SPRM652A.ZIP (143 KB) - Power Model
模擬型號

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI Model
lock = 需要匯出核准 (1 分鐘)
設計工具

PROCESSORS-3P-SEARCH — Arm 架構 MPU、arm 架構 MCU 和 DSP 第三方搜尋工具

TI 已與公司合作,提供各種使用 TI 處理器的軟體、工具和 SOM 以加速生產。下載此搜尋工具,以快速瀏覽我們的第三方解決方案,並找出符合您需求的正確協力廠商。此處列出的軟體、工具和模組,皆由獨立第三方而非由德州儀器生產及管理。

搜尋工具會依產品類型分類,如下所示:

  • 工具包括 IDE/編譯器、偵錯和追蹤、模擬和建模軟體及快閃程式設計師。
  • OS 包含 TI 處理器支援的作業系統。
  • 應用軟體意指特定應用程式軟體,包括在 TI 處理器上執行的中介軟體和程式庫。
  • SOM 意指系統模組解決方案
參考設計

TIDEP0042 — 使用 TPS544C25 和 PMBus 為 K2E 產生 AVS SmartReflex 核心電壓的參考設計

The K2E requires the use of AVS SmartReflex control for the CVDD core voltage. This design provides method of generating the proper voltage using software and the PMBus interface of the TPS544C25. The circuit can be implemented on the XEVMK2EX.
Design guide: PDF
電路圖: PDF
參考設計

TIDEP0041 — 可產生 AVS SmartReflex 核心電壓、適用於 K2E 的 PMBus 參考設計

The K2E requires the use of AVS SmartReflex control for the CVDD core voltage. This design provides method of generating the proper voltage without the need for any software. The circuit is currently implemented on the XEVMK2EX.
Design guide: PDF
電路圖: PDF
參考設計

TIDEP0031 — 使用具有 PMBus 的 UCD9090 為 K2E 進行電源排序

The K2E devices require power supplies to be sequenced in a proper order. This design demonstrates power sequencing for the 66AK2Ex and AM5K2Ex families of KeyStone II ARM+DSP and ARM-only multicore processors by use of the UCD9090. The UCD9090 is a 10-rail PMBus/I2C addressable power-supply (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDEP0026 — K2E 時鐘產生參考設計

A single clock source should not be used to drive multiple clock inputs for a high-performance processor device, such as multicore ARM Cortex-A15 based 66AK2Ex and AM5K2Ex processors, since excessive loading, reflections, and noise will negatively impact performance. These can be avoided through (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCBGA (ABD) 1089 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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