DS90CR485
- Up to 6.384-Gbps Throughput
- 66-MHz to 133-MHz Input Clock Support
- Reduces Cable and Connector Size and Cost
- Pre‐Emphasis Reduces Cable Loading Effects
- DC Balance Reduces ISI Distortion
- 24-Bit Double Edge Inputs
- 3-V Tolerant LVCMOS/LVTTL Inputs
- Low Power, 2.5-V Supply
- Flow-Through Pinout
- 100-Pin TQFP Package
- Conforms With TIA/EIA‐644-A LVDS Standard
The DS90CR485 device serializes the 24 LVCMOS/LVTTL double-edge inputs (48 bits data latched in per clock cycle) onto eight Low Voltage Differential Signaling (LVDS) streams. A phase-locked transmit clock is also in parallel with the data streams over a 9th LVDS link. The reduction of the wide TTL bus to a few LVDS lines reduces cable and connector size and cost. The double-edge input strobes data on both the rising and falling edges of the clock. This minimizes the pin count required and simplifies PCB routing between the host chip and the serializer.
This chip can help resolve EMI and interconnect size problems for high throughput point-to-point applications.
The DS90CR485 is compatible with the DS90CR486 Channel-Link receiver. The device is also backward-compatible with other Channel-Link receivers such as the DS90CR482 and DS90CR484.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90CR485 133-MHz, 48-Bit Channel Link Serializer (6.384 Gbps) datasheet (Rev. E) | 2019年 9月 10日 | |
Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
EVM User's guide | 48-bit Channel Link Serializer Deserializer Evaluation Board 133MHz | 2012年 1月 26日 | ||
Design guide | Channel Link I Design Guide | 2007年 3月 29日 | ||
Application note | Multi-Drop Channel-Link Operation | 2004年 10月 4日 | ||
White paper | The Many Flavors of LVDS | 2002年 2月 1日 | ||
Application note | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998年 10月 5日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
QFP (NEZ) | 100 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點