SN65LVDM1677

現行

16 通道 LVDM 收發器

產品詳細資料

Function Transceiver Protocols LVDM, LVDS Number of transmitters 16 Number of receivers 16 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols LVDM, LVDS Number of transmitters 16 Number of receivers 16 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 64 137.7 mm² 17 x 8.1
  • Sixteen Low-Voltage Differential Transceivers. Designed for Signaling Rates up to 200 Mbps per Receiver or 650 Mbps per Transmitter.
  • Simplex (Point-to-Point) or Half-Duplex (Multipoint) Interface
  • Typical Differential Output Voltage of 340 mV Into a 50- Line Termination on 'LVDM1677 Product
  • Propagation Delay Time:
    • Driver: 2.5 ns Typ
    • Receiver: 3 ns Typ
  • Driver is High Impedance When Disabled or With VCC < 1.5 V for Power Up/Down Glitch-Free Performance and Hot-Plugging Events
  • Bus-Terminal ESD Protection Exceeds 12 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels Are 5-V Tolerant
  • Packaged in Thin Shrink Small-Outline Package With 20 mil Terminal Pitch

  • Sixteen Low-Voltage Differential Transceivers. Designed for Signaling Rates up to 200 Mbps per Receiver or 650 Mbps per Transmitter.
  • Simplex (Point-to-Point) or Half-Duplex (Multipoint) Interface
  • Typical Differential Output Voltage of 340 mV Into a 50- Line Termination on 'LVDM1677 Product
  • Propagation Delay Time:
    • Driver: 2.5 ns Typ
    • Receiver: 3 ns Typ
  • Driver is High Impedance When Disabled or With VCC < 1.5 V for Power Up/Down Glitch-Free Performance and Hot-Plugging Events
  • Bus-Terminal ESD Protection Exceeds 12 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels Are 5-V Tolerant
  • Packaged in Thin Shrink Small-Outline Package With 20 mil Terminal Pitch

The SN65LVDM1676 and SN65LVDM1677 (integrated termination) are sixteen differential line transmitters or receivers (tranceivers) that use low-voltage differential signaling (LVDS) to achieve signaling rates up to 200 Mbps per transceiver configured as a receiver and up to 650 Mbps per transceiver configured as a transmitter. These products are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers are doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of 100 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from -40°C to 85°C.

The SN65LVDM1676 and SN65LVDM1677 (integrated termination) are sixteen differential line transmitters or receivers (tranceivers) that use low-voltage differential signaling (LVDS) to achieve signaling rates up to 200 Mbps per transceiver configured as a receiver and up to 650 Mbps per transceiver configured as a transmitter. These products are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers are doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of 100 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from -40°C to 85°C.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4
類型 標題 日期
* Data sheet High-Speed Differential Line Transceivers datasheet (Rev. D) 2007年 6月 14日
Application note An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) PDF | HTML 2023年 6月 22日
Application brief How Far, How Fast Can You Operate MLVDS? 2018年 8月 6日
Application note SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) 2001年 11月 20日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

SN65LVDM1676/77 IBIS Model Version 1.1 (Rev. A)

SLLC051A.ZIP (38 KB) - IBIS Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 引腳 下載
TSSOP (DGG) 64 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片