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TPS22915

現行

具輸出放電的 5.5V、2-A、39-mΩ 負載開關

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
TPS22991 現行 具有選用輸出放電的 5V、3A、25mΩ 負載開關 Higher maximum current ( 3A)

產品詳細資料

Imax (A) 2 Vin (max) (V) 5.5 Vin (min) (V) 1.05 Number of channels 1 Features Inrush current control, Quick output discharge Quiescent current (Iq) (typ) (µA) 7.7 Soft start Fixed Rise Time Rating Catalog Ron (typ) (mΩ) 38 Shutdown current (ISD) (typ) (µA) 0.5 Current limit type None Function Inrush current control FET Internal Operating temperature range (°C) -40 to 105 Device type Load switches
Imax (A) 2 Vin (max) (V) 5.5 Vin (min) (V) 1.05 Number of channels 1 Features Inrush current control, Quick output discharge Quiescent current (Iq) (typ) (µA) 7.7 Soft start Fixed Rise Time Rating Catalog Ron (typ) (mΩ) 38 Shutdown current (ISD) (typ) (µA) 0.5 Current limit type None Function Inrush current control FET Internal Operating temperature range (°C) -40 to 105 Device type Load switches
DSBGA (YFP) 4 1 mm² 1 x 1
  • Integrated Single Channel Load Switch
  • Input Voltage Range: 1.05V to 5.5V
  • Low On-Resistance (RON)
    • RON = 37mΩ (Typical) at VIN = 5V
    • RON = 38mΩ (Typical) at VIN = 3.3V
    • RON = 43mΩ (Typical) at VIN = 1.8V
  • 2A Maximum Continuous Switch Current
  • Low Quiescent Current
    • 7.7µA (Typical) at VIN = 3.3V
  • Low Control Input Threshold Enables Use of 1V or Higher GPIO
  • Controlled Slew Rate
    • tR(TPS22914B/15B) = 64µs at VIN = 3.3V
    • tR(TPS22914C/15C) = 913µs at VIN = 3.3V
  • Quick Output Discharge (TPS22915 only)
  • Ultra-Small Wafer-Chip-Scale Package
    • 0.74mm × 0.74mm, 0.4mm Pitch, 0.5mm Height (YFP)
  • ESD Performance Tested per JESD 22
    • 2kV HBM and 1kV CDM
  • Integrated Single Channel Load Switch
  • Input Voltage Range: 1.05V to 5.5V
  • Low On-Resistance (RON)
    • RON = 37mΩ (Typical) at VIN = 5V
    • RON = 38mΩ (Typical) at VIN = 3.3V
    • RON = 43mΩ (Typical) at VIN = 1.8V
  • 2A Maximum Continuous Switch Current
  • Low Quiescent Current
    • 7.7µA (Typical) at VIN = 3.3V
  • Low Control Input Threshold Enables Use of 1V or Higher GPIO
  • Controlled Slew Rate
    • tR(TPS22914B/15B) = 64µs at VIN = 3.3V
    • tR(TPS22914C/15C) = 913µs at VIN = 3.3V
  • Quick Output Discharge (TPS22915 only)
  • Ultra-Small Wafer-Chip-Scale Package
    • 0.74mm × 0.74mm, 0.4mm Pitch, 0.5mm Height (YFP)
  • ESD Performance Tested per JESD 22
    • 2kV HBM and 1kV CDM

The TPS22914/15 is a small, low RON, single channel load switch with controlled slew rate. The device contains an N-channel MOSFET that can operate over an input voltage range of 1.05V to 5.5V and can support a maximum continuous current of 2A. The switch is controlled by an on and off input, which is capable of interfacing directly with low-voltage control signals.

The small size and low RON makes the device designed for being use in space-constrained, battery-powered applications. The wide input voltage range of the switch makes the device a versatile design for many different voltage rails. The controlled rise time of the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. The TPS22915 further reduces the total solution size by integrating a 143Ω pulldown resistor for quick output discharge (QOD) when the switch is turned off.

The TPS22914/15 is available in a small, space-saving 0.74mm × 0.74mm, 0.4mm pitch, 0.5mm height 4-pin Wafer-Chip-Scale (WCSP) package (YFP). The device is characterized for operation over the free-air temperature range of –40°C to +105°C.

The TPS22914/15 is a small, low RON, single channel load switch with controlled slew rate. The device contains an N-channel MOSFET that can operate over an input voltage range of 1.05V to 5.5V and can support a maximum continuous current of 2A. The switch is controlled by an on and off input, which is capable of interfacing directly with low-voltage control signals.

The small size and low RON makes the device designed for being use in space-constrained, battery-powered applications. The wide input voltage range of the switch makes the device a versatile design for many different voltage rails. The controlled rise time of the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. The TPS22915 further reduces the total solution size by integrating a 143Ω pulldown resistor for quick output discharge (QOD) when the switch is turned off.

The TPS22914/15 is available in a small, space-saving 0.74mm × 0.74mm, 0.4mm pitch, 0.5mm height 4-pin Wafer-Chip-Scale (WCSP) package (YFP). The device is characterized for operation over the free-air temperature range of –40°C to +105°C.

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TPS22914 現行 5.5-V、2-A、37-mΩ 負載開關 Low quiescent current with short input skew

技術文件

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類型 標題 日期
* Data sheet TPS2291xx, 5.5V, 2A, 37mΩ On-Resistance Load Switch datasheet (Rev. F) PDF | HTML 2025年 7月 29日
E-book 11 Ways to Protect Your Power Path 2019年 7月 3日
Application brief Making the Switch to an Integrated Load Switch 2019年 6月 11日
Application note Integrated Load Switches Versus Discrete MOSFETs (Rev. A) 2019年 5月 6日
Application note Basics of Power Switches (Rev. A) PDF | HTML 2019年 4月 26日
Application note Load Switch Thermal Considerations (Rev. A) 2018年 10月 11日
Application note Basics of Load Switches (Rev. A) 2018年 9月 5日
Application note Power Supply Design for NXP i.MX 6 Using the TPS65023 2018年 2月 22日
Application note Selecting a Load Switch to Replace a Discrete Solution 2017年 4月 30日
Technical article Don’t leave it floating! Power off your outputs with quick output discharge PDF | HTML 2016年 12月 9日
Application note Implementing Ship Mode Using the TPS22915B Load Switches 2016年 9月 12日
Technical article How to use load switches to power your wearable PDF | HTML 2015年 10月 19日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPS22915BEVM-078 — TPS22915B 評估模組

The TPS22914/15EVM-078 is a two sided PCB containing the TPS22914/15 load switch device. The VIN and VOUT connections to the device and the PCB layout routing are capable of handling high continuous currents and provide a low resistance pathway into and out of the device under test. Test point (...)

使用指南: PDF
TI.com 無法提供
開發板

TPS22915CEVM-078 — 具有超低 Ron 的 TPS22915C 單通道負載開關評估模組

The TPS22914/15EVM-078 is a two sided PCB containing the TPS22914/15 load switch device. The VIN and VOUT connections to the device and the PCB layout routing are capable of handling high continuous currents and provide a low resistance pathway into and out of the device under test. Test point (...)

使用指南: PDF
TI.com 無法提供
開發板

TPS65219EVM-SKT — TPS65219 非揮發性記憶體 (NVM) 程式設計基板

TPS65219 非揮發性記憶體 (NVM) 程式設計基板使用 MSP430F5529 微控制器 (MCU),以供客戶針對 TPS65219 電源管理 IC (PMIC) 進行 NVM 編程。該基板也包含電源端子和所有 DC 穩壓器輸入和輸出的跨接器,以及通用於量測的測試點。此程式設計基板具備一個用於在焊接到原型板之前用於編程單元的通訊端。TPS65219EVM-SKT 可用於針對 RHB 5-mm x 5-mm (0.5 mm 節距) 封裝進行編程,而 TPS65219EVM-RSM 可用於為 RSM 4-mm x 4-mm (0.4 mm 封裝) 編程。

使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TPS22914C PSpice transient model

SNVM667.ZIP (3 KB) - PSpice Model
模擬型號

TPS22915B Unencrypted PSpice Transient Model Package (Rev. A)

SLVMAC2A.ZIP (48 KB) - PSpice Model
模擬型號

TPS22915C Unencrypted PSpice transient model Package (Rev. A)

SLVMAG3A.ZIP (52 KB) - PSpice Model
參考設計

TIDA-01589 — 具備雜訊消除與回波抵銷功能的高保真、近場雙向音訊參考設計

人機互動需要聲學介面,以提供全雙工免手持通訊。在免手持模式下,來自喇叭的部分遠端或近端音訊訊號會耦合至麥克風。此外,在雜訊環境中,除了可擷取有用的近端音訊訊號外,麥克風還會擷取環境雜訊。擷取的多麥克風音訊訊號會受到聲學背景雜訊及回波訊號破壞,這些訊號會大幅降低所需訊號的清晰度,並限制後續音訊處理系統的性能。此參考設計展示了雙麥克風,其用於透過立體聲 ADC 實現音訊輸入,透過低功耗 DSP 執行雜訊降低、聲音回波消除和其他音訊品質強化演算法。此設計還採用了 TI 智慧型放大器技術,可透過微型喇叭實現高品質、高 SPL 音訊輸出。
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00556 — 適用於穿戴式裝置的負載開關式運送模式參考設計

The TIDA-00556 is a low power, space saving "ship mode" reference design targeted specifically for wearables and other small portable electronics that can be implemented with a simple, low cost load switch.
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00675 — 使用動態切換的功率降低參考設計

The TIDA-00675 shows the power reduction benefits of dynamically switching a load on/off using a load switch. The design guide shows how frequency of switching, duty cycle, and the use of a discharge resistor can have an impact on power consumption.
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFP) 4 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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