TPS2376-H
- Adjustable Turn-on Thresholds
- Permits High-power 26 W Designs
- Integrated 0.58-Ω, 100-V, Low-Side Switch
- 15-kV System Level ESD Capable
- Industrial Temperature Range: –40°C to 85°C
- 8-Pin PowerPad™ SOIC Package
The 8-pin integrated circuit contains all of the features needed to develop a high power IEEE 802.3af style powered device (PD). The TPS2376-H offers a higher current limit and increased thermal dissipation capability over the TPS237X family of devices. The TPS2376-H implements a fully compliant PoE interface while permitting non-standard implementations that draw more power. A 26 W PD may be constructed when working from a 52-V minimum PSE over 100 m of CAT-5 cable. The TPS2376-H features a 100-V rating, 600-mA capability, adjustable inrush limiting, fault protection with auto-retry, and true open-drain power-good functionality.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPS2376-H IEEE802.3af, 600-mA Capable, PD Controller datasheet (Rev. B) | PDF | HTML | 2018年 11月 9日 |
| Application note | PoE Powered Devices Debug Guidelines | PDF | HTML | 2021年 7月 19日 | |
| Application note | PoE PD Schematic Review Guidelines | PDF | HTML | 2021年 4月 29日 | |
| Application note | Lightning Surge Considerations for PoE Powered Devices | 2015年 4月 30日 | ||
| EVM User's guide | HPA244 EVM (Rev. B) | 2007年 9月 26日 | ||
| Analog Design Journal | Current balancing in four-pair, high-power PoE applications | 2007年 5月 18日 | ||
| Application note | High Power PoE PD Using the TPS2375/77-1 | 2006年 2月 28日 | ||
| Application note | Wall Adapter Powers IEEE 802.3af Powered Device | 2006年 2月 1日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
TPS2376HEVM — TPS2376H 評估模組
The TPS2376HEVM evaluation board demonstrates a complete PD solution including detection, classification, and current limiting required for many PoE applications and delivers an isolated 5 V at 5 A to the load.
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
| 封裝 | 引腳 | 下載 |
|---|---|---|
| HSOIC (DDA) | 8 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。