設計工具
產品規格表
TPSM53603
- Functional Safety-Capable
- 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
- Industry’s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided)
- Low EMI: meets CISPR11 radiated emissions
- Excellent thermal performance: Up to 18 W output power at 85°C, no airflow
- Standard footprint: single large thermal pad and all pins accessible from perimeter
- Input voltage range: 3.8 V to 36 V
- Output voltage range: 1 V to 7 V
- Efficiency up to 95%
- Power-good flag
- Precision enable
- Built-in hiccup-mode short-circuit protection, overtemperature protection, start-up into pre-bias output, soft start, and UVLO
- Operating IC junction range: –40°C to +125°C
- Operating ambient range: –40°C to +105°C
- Shock and vibration tested to Mil-STD-883D
- Pin compatible with: 4-A TPSM53604 and 2-A TPSM53602
- Download the EVM Design Files for fast board design
- Create a custom design using the TPSM53603 with the WEBENCH Power Designer
The TPSM53603 power module is a highly integrated 3-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53603 an excellent device for powering a wide range of applications.
技術文件
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檢視所有 6 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPSM53603 36-V Input, 3-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. B) | PDF | HTML | 2021年 9月 30日 |
| Functional safety information | TPSM53603 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021年 8月 24日 | |
| Application note | Bang for your Buck-An Intro to Buck Converter vs. Buck Power Module Comparison | PDF | HTML | 2020年 8月 28日 | |
| Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020年 3月 5日 | ||
| EVM User's guide | Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) | 2019年 12月 13日 | ||
| White paper | Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging | 2019年 11月 19日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
TPSM53603EVM — 採用小型封裝的 3.8-V 至 36-V、3-A 降壓電源模組評估板
The TPSM53603 evaluation board (EVM) is configured to evaluate the operation of the TPSM53603 power module for current up to 3 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53603 operation.
使用指南: PDF
| 封裝 | 引腳 | 下載 |
|---|---|---|
| B3QFN (RDA) | 15 | 檢視選項 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點