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TPSM560R6H

現行

採用 5-mm x 5.5-mm x 4-mm QFN 封裝的 4.2-V 至 60-V 輸入、1-V 至 16-V 輸出、0.6-A 降壓模組

產品詳細資料

Iout (max) (A) 0.6 Vin (max) (V) 60 Vin (min) (V) 4.2 Vout (max) (V) 16 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Overcurrent protection, Power good Control mode current mode Switching frequency (max) (Hz) 1150000 Switching frequency (min) (Hz) 850000
Iout (max) (A) 0.6 Vin (max) (V) 60 Vin (min) (V) 4.2 Vout (max) (V) 16 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Overcurrent protection, Power good Control mode current mode Switching frequency (max) (Hz) 1150000 Switching frequency (min) (Hz) 850000
B3QFN (RDA) 15 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • 5.0-mm × 5.5-mm × 4.0-mm Enhanced HotRod™ QFN
    • Excellent thermal performance: up to 9.6-W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Designed for reliable and rugged applications
    • Wide input voltage range: 4.2 V to 60 V
    • Input voltage transient protection up to 66 V
    • Operating junction range: –40°C to +125°C
  • Fixed 1-MHz switching frequency
  • FPWM mode of operation
  • Optimized for ultra-low EMI requirements
    • Integrated shielded inductor and high-frequency bypass capacitors
    • Meets EN55011 EMI standards
  • 26-µA nonswitching quiescent current
  • Monotonic start-up into prebiased output
  • No loop-compensation or bootstrap components
  • Precision enable and input UVLO with hysteresis
  • Thermal shutdown protection with hysteresis
  • Create a custom design using the TPSM560R6H with the WEBENCH Power Designer
  • Functional Safety-Capable
  • 5.0-mm × 5.5-mm × 4.0-mm Enhanced HotRod™ QFN
    • Excellent thermal performance: up to 9.6-W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Designed for reliable and rugged applications
    • Wide input voltage range: 4.2 V to 60 V
    • Input voltage transient protection up to 66 V
    • Operating junction range: –40°C to +125°C
  • Fixed 1-MHz switching frequency
  • FPWM mode of operation
  • Optimized for ultra-low EMI requirements
    • Integrated shielded inductor and high-frequency bypass capacitors
    • Meets EN55011 EMI standards
  • 26-µA nonswitching quiescent current
  • Monotonic start-up into prebiased output
  • No loop-compensation or bootstrap components
  • Precision enable and input UVLO with hysteresis
  • Thermal shutdown protection with hysteresis
  • Create a custom design using the TPSM560R6H with the WEBENCH Power Designer

The TPSM560R6H power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The TPSM560R6H is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM560R6H an excellent device to power a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package.

The TPSM560R6H power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The TPSM560R6H is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM560R6H an excellent device to power a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package.

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類型 標題 日期
* Data sheet TPSM560R6H, 60-V Input, 1-V to 16-V Output, 600-mA Power Module in an Enhanced HotRod™ QFN Package datasheet PDF | HTML 2021年 9月 20日
EVM User's guide Using the TPSM560R6HEVM PDF | HTML 2021年 7月 6日
Certificate TPSM560R6HSEVM EU Declaration of Conformity (DoC) 2021年 4月 23日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

參考設計

TIDA-010265 — 採用 C2000™ MCU 和 MSPM0 的 750W 馬達逆變器參考設計

此參考設計是用於洗衣機或類似設備的 750W 馬達驅動器,展示了一種使用磁通、角度、速度和扭矩觀察器 (FAST) 軟體編碼器或增強型滑動模式觀察器 (eSMO) 實現三相永磁同步馬達 (PMSM) 的無感測器磁場定向控制 (FOC) 的方法。此參考設計採用模組化設計,可在同一主機板上同時支援 C2000™ 微控制器 (MCU) 和 MSPM0 MCU 子板。此參考設計提供的軟硬體皆經過測試且隨時可用,有助於加快開發至上市時間。硬體設計詳細資訊和測試結果可在設計指南中找到。
Design guide: PDF
參考設計

TIDA-010255 — 適用於機器人和伺服驅動器的 230VAC、2kW 三相 GaN 逆變器參考設計

此參考設計展示了高效率 320VDC 輸入三相功率級,採用六個快速切換 GaN FET,具有集成驅動器、保護和溫度報告以及熱側微控制器控制功能,尤其適合馬達整合式伺服驅動與機器人應用。通過隔離式 ΔΣ 調變器實現精確的相位電流感測。DC 鏈路電壓是以非隔離式小型 Δ Σ 調變器進行測量,類比相位電壓回饋選項可驗證 InstaSPIN-FOC™ 等先進的無感測器設計。為了便於評估,此設計提供 3.3V I/O 介面訊號和一個用於 C2000™ 微控制器 controlCARD 的 180 針腳連接器,以及用於連接其他微控制器 (例如 Sitara™ AM2631) 的標準介面。
Design guide: PDF
封裝 引腳 下載
B3QFN (RDA) 15 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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