TIDUF18A October   2022  – February 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1 CLLLC System Description
    1. 1.1 Key System Specifications
  8. 2 CLLLC System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations and System Design Theory
      1. 2.2.1 Tank Design
        1. 2.2.1.1 Voltage Gain
        2. 2.2.1.2 Transformer Gain Ratio Design (NCLLLC)
        3. 2.2.1.3 Magnetizing Inductance Selection (Lm)
        4. 2.2.1.4 Resonant Inductor and Capacitor Selection (Lrp and Crp)
      2. 2.2.2 Current and Voltage Sensing
        1. 2.2.2.1 VPRIM Voltage Sensing
        2. 2.2.2.2 VSEC Voltage Sensing
        3. 2.2.2.3 ISEC Current Sensing
        4. 2.2.2.4 ISEC TANK and IPRIM TANK
        5. 2.2.2.5 IPRIM Current Sensing
        6. 2.2.2.6 Protection (CMPSS and X-Bar)
      3. 2.2.3 PWM Modulation
  9. 3 Totem Pole PFC System Description
    1. 3.1 Benefits of Totem-Pole Bridgeless PFC
    2. 3.2 Totem-Pole Bridgeless PFC Operation
    3. 3.3 Key System Specifications
    4. 3.4 System Overview
      1. 3.4.1 Block Diagram
    5. 3.5 System Design Theory
      1. 3.5.1 PWM
      2. 3.5.2 Current Loop Model
      3. 3.5.3 DC Bus Regulation Loop
      4. 3.5.4 Soft Start Around Zero-Crossing for Eliminating or Reducing Current Spike
      5. 3.5.5 Current Calculation
      6. 3.5.6 Inductor Calculation
      7. 3.5.7 Output Capacitor Calculation
      8. 3.5.8 Current and Voltage Sense
  10. 4 Highlighted Products
    1. 4.1 C2000 MCU TMS320F28003x
    2. 4.2 LMG352xR30-Q1
    3. 4.3 UCC21222-Q1
    4. 4.4 AMC3330-Q1
    5. 4.5 AMC3302-Q1
  11. 5 Hardware, Software, Testing Requirements, and Test Results
    1. 5.1 Required Hardware and Software
      1. 5.1.1 Hardware Settings
        1. 5.1.1.1 Control Card Settings
      2. 5.1.2 Software
        1. 5.1.2.1 Opening the Project Inside Code Composer Studio
        2. 5.1.2.2 Project Structure
    2. 5.2 Testing and Results
      1. 5.2.1 Test Setup (Initial)
      2. 5.2.2 CLLLC Test Procedure
        1. 5.2.2.1 Lab 1. Primary to Secondary Power Flow, Open Loop Check PWM Driver
        2. 5.2.2.2 Lab 2. Primary to Secondary Power Flow, Open Loop CheckPWM Driver and ADC with Protection, Resistive Load Connected on Secondary
          1. 5.2.2.2.1 Setting Software Options for Lab 2
          2. 5.2.2.2.2 Building and Loading the Project and Setting up Debug Environment
          3. 5.2.2.2.3 Using Real-time Emulation
          4. 5.2.2.2.4 Running the Code
          5. 5.2.2.2.5 Measure SFRA Plant for Voltage Loop
          6. 5.2.2.2.6 Verify Active Synchronous Rectification
          7. 5.2.2.2.7 Measure SFRA Plant for Current Loop
        3. 5.2.2.3 Lab 3. Primary to Secondary Power Flow, Closed Voltage Loop Check, With Resistive Load Connected on Secondary
          1. 5.2.2.3.1 Setting Software Options for Lab 3
          2. 5.2.2.3.2 Building and Loading the Project and Setting up Debug Environment
          3. 5.2.2.3.3 Running the Code
          4. 5.2.2.3.4 Measure SFRA for Closed Voltage Loop
        4. 5.2.2.4 Lab 4. Primary to Secondary Power Flow, Closed Current Loop Check, With Resistive Load Connected on Secondary
          1. 5.2.2.4.1 Setting Software Options for Lab 4
          2. 5.2.2.4.2 Building and Loading the Project and Setting up Debug
          3. 5.2.2.4.3 Running the Code
          4. 5.2.2.4.4 Measure SFRA for Closed Current Loop
        5. 5.2.2.5 Lab 5. Primary to Secondary Power Flow, Closed Current Loop Check, With Resistive Load Connected on Secondary in Parallel to a Voltage Source to Emulate a Battery Connection on Secondary Side
          1. 5.2.2.5.1 Setting Software Options for Lab 5
          2. 5.2.2.5.2 Designing Current Loop Compensator
          3. 5.2.2.5.3 Building and Loading the Project and Setting up Debug
          4. 5.2.2.5.4 Running the Code
          5. 5.2.2.5.5 Measure SFRA for Closed Current Loop in Battery Emulated Mode
      3. 5.2.3 TTPLPFC Test procedure
        1. 5.2.3.1 Lab 1: Open Loop, DC
          1. 5.2.3.1.1 Setting Software Options for BUILD 1
          2. 5.2.3.1.2 Building and Loading Project
          3. 5.2.3.1.3 Setup Debug Environment Windows
          4. 5.2.3.1.4 Using Real-Time Emulation
          5. 5.2.3.1.5 Running Code
        2. 5.2.3.2 Lab 2: Closed Current Loop DC
          1. 5.2.3.2.1 Setting Software Options for BUILD 2
          2. 5.2.3.2.2 Designing Current Loop Compensator
          3. 5.2.3.2.3 Building and Loading Project and Setting Up Debug
          4. 5.2.3.2.4 Running Code
        3. 5.2.3.3 Lab 3: Closed Current Loop, AC
          1. 5.2.3.3.1 Setting Software Options for Lab 3
          2. 5.2.3.3.2 Building and Loading Project and Setting Up Debug
          3. 5.2.3.3.3 Running Code
        4. 5.2.3.4 Lab 4: Closed Voltage and Current Loop
          1. 5.2.3.4.1 Setting Software Options for BUILD 4
          2. 5.2.3.4.2 Building and Loading Project and Setting up Debug
          3. 5.2.3.4.3 Running Code
      4. 5.2.4 Test Results
        1. 5.2.4.1 Efficiency
        2. 5.2.4.2 System Performance
        3. 5.2.4.3 Bode Plots
        4. 5.2.4.4 Efficiency and Regulation Data
        5. 5.2.4.5 Thermal Data
        6. 5.2.4.6 PFC Waveforms
        7. 5.2.4.7 CLLLC Waveforms
  12. 6 Design Files
    1. 6.1 Schematics
    2. 6.2 Bill of Materials
    3. 6.3 Altium Project
    4. 6.4 Gerber Files
  13. 7 Software Files
  14. 8 Related Documentation
    1. 8.1 Trademarks
  15. 9 Terminology
  16. 10About the Author
  17. 11Revision History

1.1 Key System Specifications

The CLLLC reference design power specifications are listed in Table 1-1.

Table 1-1 Key System Specifications
PARAMETERSPECIFICATIONS
Prim Voltage (Vprim)400 V–450 V DC (average)
Sec Voltage (Vsec)250 V–450 V DC

Max

Power Rating forward7.4 kW
Output Current (IOUT)

20

A Max
Efficiency (CLLLC)Peak 98%
PWM Switching Frequency500 kHz Nominal (200 kHz–800 kHz Range)
GUID-29AE15FE-AF13-45D2-A625-8E9B2BC02D71-low.gif
WARNING:

TI intends this reference design to be operated in a lab environment only and does not consider it to be a finished product for general consumer use. The design is intended to be run at ambient room temperature and is not tested for operation under other ambient temperatures.

TI intends this reference design to be used only by qualified engineers and technicians familiar with risks associated with handling high-voltage electrical and mechanical components, systems, and subsystems.

There are accessible high voltages present on the board. The board operates at voltages and currents that may cause shock, fire, or injury if not properly handled or applied. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property.

GUID-29AE15FE-AF13-45D2-A625-8E9B2BC02D71-low.gif
CAUTION:

Do not leave the design powered when unattended.

GUID-7E668C4A-CE46-4781-B19F-3DD84C142DC7-low.png
WARNING:

High voltage! There are accessible high voltages present on the board. Electric shock is possible. The board operates at voltages and currents that may cause shock, fire, or injury if not properly handled. Use the equipment with necessary caution and appropriate safeguards to avoid injuring yourself or damaging property. For safety, use of isolated test equipment with over-voltage and over-current protection is highly recommended.

TI considers it the user's responsibility to confirm that the voltages and isolation requirements are identified and understood before energizing the board or simulation. When energized, do not touch the design or components connected to the design.

GUID-3133A1E0-7435-41DB-9C23-ADB4B93A4E0B-low.gif
WARNING:

Hot surface! Contact may cause burns. Do not touch!

Some components may reach high temperatures >55°C when the board is powered on. The user must not touch the board at any point during operation or immediately after operating, as high temperatures may be present.