SBAS813 June   2018 ADS8688AT

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: Serial Interface
    7. 6.7 Switching Characteristics: Serial Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs
      2. 7.3.2  Analog Input Impedance
      3. 7.3.3  Input Overvoltage Protection Circuit
      4. 7.3.4  Programmable Gain Amplifier (PGA)
      5. 7.3.5  Second-Order, Low-Pass Filter (LPF)
      6. 7.3.6  ADC Driver
      7. 7.3.7  Multiplexer (MUX)
      8. 7.3.8  Reference
        1. 7.3.8.1 Internal Reference
        2. 7.3.8.2 External Reference
      9. 7.3.9  Auxiliary Channel
        1. 7.3.9.1 Input Driver for the AUX Channel
      10. 7.3.10 ADC Transfer Function
      11. 7.3.11 Alarm Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Interface
        1. 7.4.1.1 Digital Pin Description
          1. 7.4.1.1.1 CS (Input)
          2. 7.4.1.1.2 SCLK (Input)
          3. 7.4.1.1.3 SDI (Input)
          4. 7.4.1.1.4 SDO (Output)
          5. 7.4.1.1.5 DAISY (Input)
          6. 7.4.1.1.6 RST/PD (Input)
        2. 7.4.1.2 Data Acquisition Example
        3. 7.4.1.3 Host-to-Device Connection Topologies
          1. 7.4.1.3.1 Daisy-Chain Topology
          2. 7.4.1.3.2 Star Topology
      2. 7.4.2 Device Modes
        1. 7.4.2.1 Continued Operation in the Selected Mode (NO_OP)
        2. 7.4.2.2 Frame Abort Condition (FRAME_ABORT)
        3. 7.4.2.3 STANDBY Mode (STDBY)
        4. 7.4.2.4 Power-Down Mode (PWR_DN)
        5. 7.4.2.5 Auto Channel Enable With Reset (AUTO_RST)
        6. 7.4.2.6 Manual Channel n Select (MAN_Ch_n)
        7. 7.4.2.7 Channel Sequencing Modes
        8. 7.4.2.8 Reset Program Registers (RST)
    5. 7.5 Register Maps
      1. 7.5.1 Command Register Description
      2. 7.5.2 Program Register Description
        1. 7.5.2.1 Program Register Read/Write Operation
        2. 7.5.2.2 Program Register Map
        3. 7.5.2.3 Program Register Descriptions
          1. 7.5.2.3.1 Auto-Scan Sequencing Control Registers
            1. 7.5.2.3.1.1 Auto-Scan Sequence Enable Register (address = 01h)
              1. Table 11. AUTO_SEQ_EN Field Descriptions
            2. 7.5.2.3.1.2 Channel Power Down Register (address = 02h)
              1. Table 12. Channel Power Down Register Field Descriptions
          2. 7.5.2.3.2 Device Features Selection Control Register (address = 03h)
            1. Table 13. Feature Select Register Field Descriptions
          3. 7.5.2.3.3 Range Select Registers (addresses 05h-0Ch)
            1. Table 16. Channel n Input Range Registers Field Descriptions
          4. 7.5.2.3.4 Alarm Flag Registers (Read-Only)
            1. 7.5.2.3.4.1 ALARM Overview Tripped-Flag Register (address = 10h)
              1. Table 17. ALARM Overview Tripped-Flag Register Field Descriptions
            2. 7.5.2.3.4.2 Alarm Flag Registers: Tripped and Active (address = 11h to 14h)
              1. Table 18. ALARM Ch0-3 Tripped-Flag Register Field Descriptions
              2. Table 19. ALARM Ch0-3 Active-Flag Register Field Descriptions
              3. Table 20. ALARM Ch4-7 Tripped-Flag Register Field Descriptions
              4. Table 21. ALARM Ch4-7 Active-Flag Register Field Descriptions
          5. 7.5.2.3.5 Alarm Threshold Setting Registers
            1. Table 22. Channel n Hysteresis Register Field Descriptions (n = 0 to 7)
            2. Table 23. Channel n High Threshold MSB Register Field Descriptions (n = 0 to 7)
            3. Table 24. Channel n High Threshold LSB Register Field Descriptions (n = 0 to 7)
            4. Table 25. Channel n Low Threshold MSB Register Field Descriptions (n = 0 to 7)
            5. Table 26. Channel n Low Threshold MSB Register Field Descriptions (n = 0 to 7)
          6. 7.5.2.3.6 Command Read-Back Register (address = 3Fh)
            1. Table 27. Command Read-Back Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Phase-Compensated, 8-Channel, Multiplexed Data Acquisition System for Power Automation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 16-Bit, 8-Channel, Integrated Analog Input Module for Programmable Logic Controllers (PLCs)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Figure 126 illustrates a PCB layout example for the ADS8688AT.

  • Partition the PCB into analog and digital sections. Care must be taken to ensure that the analog signals are kept away from the digital lines. This layout helps keep the analog input and reference input signals away from the digital noise. In this layout example, the analog input and reference signals are routed on the lower side of the board and the digital connections are routed on the top side of the board.
  • Using a single dedicated ground plane is strongly encouraged.
  • Power sources to the ADS8688AT must be clean and well-bypassed. TI recommends using a
    1-μF, X7R-grade, 0603-size ceramic capacitor with at least a 10-V rating in close proximity to the analog (AVDD) supply pins. For decoupling the digital (DVDD) supply pin, a 10-μF, X7R-grade, 0805-size ceramic capacitor with at least a 10-V rating is recommended. Placing vias between the AVDD, DVDD pins and the bypass capacitors must be avoided. All ground pins must be connected to the ground plane using short, low impedance paths.
  • There are two decoupling capacitors used for the REFCAP pin. The first is a small, 1-μF, X7R-grade, 0603-size ceramic capacitor placed close to the device pins for decoupling the high-frequency signals and the second is a 22-µF, X7R-grade, 1210-size ceramic capacitor to provide the charge required by the reference circuit of the device. Both of these capacitors must be directly connected to the device pins without any vias between the pins and capacitors.
  • The REFIO pin also must be decoupled with a 10-µF ceramic capacitor, if the internal reference of the device is used. The capacitor must be placed close to the device pins.
  • For the auxiliary channel, the fly-wheel RC filter components must be placed close to the device. Among ceramic surface-mount capacitors, COG (NPO) ceramic capacitors provide the best capacitance precision. The type of dielectric used in COG (NPO) ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes.