DLPS037F October   2014  – June 2021 DLPC900

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements (1)
    7. 6.7  Power-Up and Power-Down Timing Requirements
      1. 6.7.1 Power-Up
      2. 6.7.2 Power-Down
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  JTAG Interface: I/O Boundary Scan Application Switching Characteristics
    10. 6.10 Programmable Output Clocks Switching Characteristics
    11. 6.11 Port 1 and 2 Input Pixel Interface Timing Requirements
    12. 6.12 Two Pixels Per Clock (48-Bit Bus) Timing Requirements
    13. 6.13 SSP Switching Characteristics
    14. 6.14 DMD Interface Switching Characteristics (1)
    15. 6.15 DMD LVDS Interface Switching Characteristics
    16. 6.16 Source Input Blanking Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DMD Configurations
      2. 7.3.2 Video Timing Input Blanking Specification
      3. 7.3.3 Board-Level Test Support
      4. 7.3.4 Two Controller Considerations
      5. 7.3.5 Memory Design Considerations
        1. 7.3.5.1 Flash Memory Optimization
        2. 7.3.5.2 Operating Modes
        3. 7.3.5.3 DLPC900 Memory Space
        4. 7.3.5.4 Minimizing Memory Space
        5. 7.3.5.5 Minimizing Board Size
          1. 7.3.5.5.1 Package Selection
          2. 7.3.5.5.2 Large Density Flash
            1. 7.3.5.5.2.1 Combining Two Chip-Selects with One 32-Megabyte Flash
              1. 7.3.5.5.2.1.1 Combining Three Chip-Selects with One 64-Megabyte Flash
            2. 7.3.5.5.2.2 Combining Three Chip-Selects with One 128-Megabyte Flash
        6. 7.3.5.6 Minimizing Board Space
        7. 7.3.5.7 Flash Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 Structured Light Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Two Controller Chipset
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 DLPC900 System Interfaces
            1. 8.2.1.2.1.1 Control Interface
            2. 8.2.1.2.1.2 Input Data Interfaces
            3. 8.2.1.2.1.3 DLPC900 System Output Interfaces
              1. 8.2.1.2.1.3.1 Illumination Interface
              2. 8.2.1.2.1.3.2 Trigger and Sync Interface
            4. 8.2.1.2.1.4 DLPC900 System Support Interfaces
              1. 8.2.1.2.1.4.1 Reference Clock and PLL
              2. 8.2.1.2.1.4.2 Program Memory Flash Interface
              3. 8.2.1.2.1.4.3 DMD Interface
      2. 8.2.2 Typical Single Controller Chipset
  9. Power Supply Recommendations
    1. 9.1 System Power Regulation
      1. 9.1.1 Power Distribution System
        1. 9.1.1.1 1.15-V System Power
        2. 9.1.1.2 1.8-V System Power
        3. 9.1.1.3 3.3-V System Power
    2. 9.2 System Environment and Defaults
      1. 9.2.1 DLPC900 System Power-Up and Reset Default Conditions
    3. 9.3 System Power-Up Sequence
      1. 9.3.1 Power-On Sense (POSENSE) Support
      2. 9.3.2 Power Good (PWRGOOD) Support
      3. 9.3.3 5-V Tolerant Support
    4. 9.4 System Reset Operation
      1. 9.4.1 Power-Up Reset Operation
      2. 9.4.2 System Reset Operation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  General PCB Recommendations
      2. 10.1.2  PCB Layout Guidelines for Internal Controller PLL Power
      3. 10.1.3  PCB Layout Guidelines for Quality Video Performance
      4. 10.1.4  Recommended MOSC Crystal Oscillator Configuration
      5. 10.1.5  Spread Spectrum Clock Generator Support
      6. 10.1.6  GPIO Interface
      7. 10.1.7  General Handling Guidelines for Unused CMOS-Type Pins
      8. 10.1.8  DMD Interface Considerations
        1. 10.1.8.1 Flex Connector Plating
      9. 10.1.9  PCB Design Standards
      10. 10.1.10 Signal Layers
      11. 10.1.11 Trace Widths and Minimum Spacing
      12. 10.1.12 Trace Impedance and Routing Priority
      13. 10.1.13 Power and Ground Planes
      14. 10.1.14 Power Vias
      15. 10.1.15 Decoupling
      16. 10.1.16 Fiducials
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
      3. 11.1.3 DEFINITIONS - Video Timing Parameters
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Structured Light Application

For structured light applications, the DLPC900 can be commanded to enter the following high speed sequential pattern modes.

  1. Video Pattern Mode
  2. Pre-Stored Pattern Mode
  3. Pattern On-The-Fly Mode
In each mode a specific set of patterns are selected with a maximum of 24 bits per pixel. The bit-depth of the patterns are then allocated into the corresponding time slots. Furthermore, an output trigger signal is also synchronized with these time slots to indicate when the image is displayed.

These pattern modes provide the capability to display a set of patterns and signal a camera to capture these patterns overlaid on an object. The DLPC900 controller is capable of pre-loading up to 400 1-bit binary patterns into internal memory from the external flash memory or from the USB or I2C interfaces. These pre-loaded binary patterns are then streamed to the DMD at high speed.

Note:

The DLPC900 internal DRAM is capable of holding 400 1-bit images. However, when using Pre-Stored Pattern Mode the number of patterns that can be stored in External Flash depends on the size of the external flash and level of compression achievable.

The DLPC900 controller is capable of synchronizing a camera to the displayed patterns. In video pattern mode, the vertical sync is used as trigger input. In pre-stored pattern mode and pattern on-the-fly mode, an internal user configurable trigger or a TRIG_IN_1 pulse indicates to the DLPC900 controller to advance to the next pattern, while TRIG_IN_2 starts and stops the pattern sequence. In all pattern modes, TRIG_OUT_1 frames the exposure time of the pattern, while TRIG_OUT_2 indicates the start of the pattern sequence.

Figure 7-16 shows an example timing diagram of video pattern mode. The VSYNC starts the pattern sequence display. The pattern sequence consists of a series of four patterns followed by a series of three patterns and then repeats. The first pattern sequence consists of P1, P2, P3, and P4. The second pattern sequence consists of P5, P6, and P7. TRIG_OUT_1 frames each pattern exposed, while TRIG_OUT_2 indicates the start of each pattern in the sequence. If the pattern sequence is configured without dark time between patterns, then the TRIG_OUT_1 output would be high for the entire pattern sequence.

GUID-FF339EDE-BC0C-4CEB-8DB1-846C444A5CDA-low.gifFigure 7-16 Video Pattern Mode Timing Diagram

Figure 7-17 shows an example of a pre-stored pattern mode timing diagram. Pattern sequences of four are displayed. TRIG_OUT_1 frames each pattern exposed, while TRIG_OUT_2 indicates the start of each pattern in the sequence. If the pattern sequence is configured without dark time between patterns, then the TRIG_OUT_1 output would be high for the entire pattern sequence.

GUID-E8E28684-31B8-426B-82AF-8E9ACA376EB0-low.gifFigure 7-17 Pre-Stored Pattern Mode Timing Diagram

Another example of a pre-stored pattern mode timing diagram is shown in Figure 7-18, where pattern sequences of three are displayed. TRIG_OUT_1 frames each pattern displayed, while TRIG_OUT_2 indicates the start of each pattern. TRIG_IN_2 serves as a start and stop signal. When high, the pattern sequence starts or continues. Note, in the middle of displaying the P4 pattern, TRIG_IN_2 is low, so the sequence stops displaying P4. When TRIG_IN_2 is raised, the pattern sequence continues where it stopped by re-displaying P4.

GUID-2661CECD-6BBC-4129-8E0B-F904B4E0F143-low.gifFigure 7-18 Pre-Stored Pattern Mode Timing Diagram for 3-Patterns

Table 7-3 shows the allowed pattern combinations in relation to the bit depth of the pattern. If the pattern sequence is configured without dark time between patterns, then the TRIG_OUT_1 output would be high for the entire pattern sequence. For faster 8-bit pattern speeds, the illumination source can be modulated to shorten the smallest bits, and thus the larger bits. This method will introduce dark time into the pattern and affect the brightness, but it is capable of 8-bit pattern speeds up to four times faster than patterns without illumination modulation. More information on illumination modulation can be found in the DLP® LightCrafter™ Single DLPC900 Evaluation Module (EVM) User's Guide (DLPU101) or DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) User's Guide (DLPU102).

Table 7-3 Minimum Exposure in Any Pattern Mode
BIT DEPTHDLP6500 (µs)DLP9000 (µs)DLP500YX (µs)DLP670S (µs)
110510562105
2304304184343
3394380269438
4823733458768
5121512156821299
6148714878071488
71998199810832000
84046404622634046
8(3)969969496969
Minimum achievable exposure using illumination modulated light source.
Table 7-4 shows the minimum pattern exposure time for a 1-bit pattern in relation to the number of active DMD blocks.
Table 7-4 Minimum Exposures for Number of Active DMD Blocks
ACTIVE BLOCKSDLP6500 (µs)DLP9000 (µs)DLP500YX (µs)DLP670S (µs)
124243027
245423027
345423027
445423033
548453438
654513838
760564249
866614655
972675061
1078725466
1184775872
1290836277
139688N/A83
1410193N/A89
1510599N/A94
16N/A105N/A100