DLPS037F October 2014 – June 2021 DLPC900
The DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) PCB is targeted at 14 layers with layer stack up shown in Figure 10-7. The PCB layer stack can vary depending on system design. However, careful attention is required to meet design considerations. Layers 1 and 14 consist of the component layers. Layers 2, 4, 6, 9, 11, and 13 consist of solid ground planes. Layers 7 and 8 consist of solid power planes. Layers 1, 3, 5, 10, 12, and 14 are used as the primary routing layers. Routing on external layers must be less than 0.25 inches for priority one and two signals. Refer to the Table 10-9 for signal priority groups. Board material must be FR-370HR or similar. PCB must be designed for lead-free assembly with the stackup geometry shown in Figure 10-7 and Figure 10-8.
Refer to Section 10.2 for a complete set of documentation for the DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) reference design.