DLPS037F October   2014  – June 2021 DLPC900

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Oscillators Timing Requirements (1)
    7. 6.7  Power-Up and Power-Down Timing Requirements
      1. 6.7.1 Power-Up
      2. 6.7.2 Power-Down
    8. 6.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 6.9  JTAG Interface: I/O Boundary Scan Application Switching Characteristics
    10. 6.10 Programmable Output Clocks Switching Characteristics
    11. 6.11 Port 1 and 2 Input Pixel Interface Timing Requirements
    12. 6.12 Two Pixels Per Clock (48-Bit Bus) Timing Requirements
    13. 6.13 SSP Switching Characteristics
    14. 6.14 DMD Interface Switching Characteristics (1)
    15. 6.15 DMD LVDS Interface Switching Characteristics
    16. 6.16 Source Input Blanking Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DMD Configurations
      2. 7.3.2 Video Timing Input Blanking Specification
      3. 7.3.3 Board-Level Test Support
      4. 7.3.4 Two Controller Considerations
      5. 7.3.5 Memory Design Considerations
        1. 7.3.5.1 Flash Memory Optimization
        2. 7.3.5.2 Operating Modes
        3. 7.3.5.3 DLPC900 Memory Space
        4. 7.3.5.4 Minimizing Memory Space
        5. 7.3.5.5 Minimizing Board Size
          1. 7.3.5.5.1 Package Selection
          2. 7.3.5.5.2 Large Density Flash
            1. 7.3.5.5.2.1 Combining Two Chip-Selects with One 32-Megabyte Flash
              1. 7.3.5.5.2.1.1 Combining Three Chip-Selects with One 64-Megabyte Flash
            2. 7.3.5.5.2.2 Combining Three Chip-Selects with One 128-Megabyte Flash
        6. 7.3.5.6 Minimizing Board Space
        7. 7.3.5.7 Flash Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 Structured Light Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Two Controller Chipset
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 DLPC900 System Interfaces
            1. 8.2.1.2.1.1 Control Interface
            2. 8.2.1.2.1.2 Input Data Interfaces
            3. 8.2.1.2.1.3 DLPC900 System Output Interfaces
              1. 8.2.1.2.1.3.1 Illumination Interface
              2. 8.2.1.2.1.3.2 Trigger and Sync Interface
            4. 8.2.1.2.1.4 DLPC900 System Support Interfaces
              1. 8.2.1.2.1.4.1 Reference Clock and PLL
              2. 8.2.1.2.1.4.2 Program Memory Flash Interface
              3. 8.2.1.2.1.4.3 DMD Interface
      2. 8.2.2 Typical Single Controller Chipset
  9. Power Supply Recommendations
    1. 9.1 System Power Regulation
      1. 9.1.1 Power Distribution System
        1. 9.1.1.1 1.15-V System Power
        2. 9.1.1.2 1.8-V System Power
        3. 9.1.1.3 3.3-V System Power
    2. 9.2 System Environment and Defaults
      1. 9.2.1 DLPC900 System Power-Up and Reset Default Conditions
    3. 9.3 System Power-Up Sequence
      1. 9.3.1 Power-On Sense (POSENSE) Support
      2. 9.3.2 Power Good (PWRGOOD) Support
      3. 9.3.3 5-V Tolerant Support
    4. 9.4 System Reset Operation
      1. 9.4.1 Power-Up Reset Operation
      2. 9.4.2 System Reset Operation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  General PCB Recommendations
      2. 10.1.2  PCB Layout Guidelines for Internal Controller PLL Power
      3. 10.1.3  PCB Layout Guidelines for Quality Video Performance
      4. 10.1.4  Recommended MOSC Crystal Oscillator Configuration
      5. 10.1.5  Spread Spectrum Clock Generator Support
      6. 10.1.6  GPIO Interface
      7. 10.1.7  General Handling Guidelines for Unused CMOS-Type Pins
      8. 10.1.8  DMD Interface Considerations
        1. 10.1.8.1 Flex Connector Plating
      9. 10.1.9  PCB Design Standards
      10. 10.1.10 Signal Layers
      11. 10.1.11 Trace Widths and Minimum Spacing
      12. 10.1.12 Trace Impedance and Routing Priority
      13. 10.1.13 Power and Ground Planes
      14. 10.1.14 Power Vias
      15. 10.1.15 Decoupling
      16. 10.1.16 Fiducials
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
      3. 11.1.3 DEFINITIONS - Video Timing Parameters
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRICDLPC900UNIT
ZPC (BGA)
516 PINS
RθJC (1)Junction-to-case thermal resistance4.4°C/W
RθJA at 0 m/s of forced airflow (2)Junction-to-air thermal resistance14.4°C/W
RθJA at 1 m/s of forced airflow (2)Junction-to-air thermal resistance9.5°C/W
RθJA at 2 m/s of forced airflow (2)Junction-to-air thermal resistance9.0°C/W
φJT (3)Temperature variance from junction to package top center temperature, per unit power dissipation0.4°C/W
RθJC analysis assumptions: The heat generated in the chip flows into overmold (top side) and also into the package laminate (bottom side) and then into PCB via package solder balls. Used for heat sink analysis only.
Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC900 PCB and thus the reported thermal resistance can be inaccurate in the actual product application. Although the actual thermal resistance can be different, it is the best information available during the design phase to estimate thermal performance.
Example: (3.2 W) × (0.4 C/W) ≈ 1.28°C temperature rise.