SLVSHO1 March   2025 TPS1689

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  PMBus and GPIO DC Characteristics
    7. 5.7  Telemetry
    8. 5.8  Logic Interface
    9. 5.9  Timing Requirements
    10. 5.10 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Undervoltage Protection
      2. 6.3.2  Insertion Delay
      3. 6.3.3  Overvoltage Protection
      4. 6.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 6.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 6.3.4.1.1 Start-Up Timeout
        2. 6.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 6.3.4.3 Active Current Limiting During Start-Up
        4. 6.3.4.4 Short-Circuit Protection
      5. 6.3.5  Analog Load Current Monitor (IMON)
      6. 6.3.6  Overtemperature Protection
      7. 6.3.7  Analog Junction Temperature Monitor (TEMP)
      8. 6.3.8  FET Health Monitoring
      9. 6.3.9  Single Point Failure Mitigation
        1. 6.3.9.1 IMON Pin Single Point Failure
        2. 6.3.9.2 IREF Pin Single Point Failure
      10. 6.3.10 General Purpose Digital Input/Output Pins
        1. 6.3.10.1 Fault Response and Indication (FLT)
        2. 6.3.10.2 Power Good Indication (PG)
        3. 6.3.10.3 Parallel Device Synchronization (SWEN)
      11. 6.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 6.3.11.1 Current Balancing During Start-Up
      12. 6.3.12 Quick Output Discharge(QOD)
      13. 6.3.13 Write Protect Feature(WP#)
      14. 6.3.14 PMBus® Digital Interface
        1. 6.3.14.1  PMBus® Device Addressing
        2. 6.3.14.2  SMBus Protocol
        3. 6.3.14.3  SMBusâ„¢ Message Formats
        4. 6.3.14.4  Packet Error Checking
        5. 6.3.14.5  Group Commands
        6. 6.3.14.6  SMBusâ„¢ Alert Response Address (ARA)
        7. 6.3.14.7  PMBus® Commands
        8. 6.3.14.8  Analog-to-digital Converter
        9. 6.3.14.9  Digital-to-analog Converters
        10. 6.3.14.10 DIRECT format Conversion
        11. 6.3.14.11 Blackbox Fault Recording
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Single Device, Standalone Operation
      2. 7.1.2 Single TPS1689 and multiple TPS1685 Devices, Parallel Connection
      3. 7.1.3 Multiple TPS1689 Devices: Parallel Connection With Individual Telemetry
      4. 7.1.4 Multiple Devices, Independent Operation (Multi-zone)
    2. 7.2 Typical Application: 54-V, 2-kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Performance Plots
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Transient Protection
      2. 7.3.2 Output Short-Circuit Measurements
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Application Limitation and Errata
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
VINMAX, VDDMAX Maximum Input and Supply Voltage  (-40℃ ≤ TJ ≤ 125℃ )   IN, VDD –0.3 90 V
VINMAX,25, VDDMAX,25 Maximum Input and Supply Voltage (25℃ ≤ TJ ≤ 125℃ )   IN, VDD –0.3 92 V
VOUTMAX Maximum Output Voltage  OUT –5(2) Min(92 V, VIN + 0.3)
VIN - VOUT Maximum difference between IN and OUT IN, OUT -0.3 90 V
VIILIMMAX Maximum ILIM Pin Voltage  ILIM –0.3 Internally Limited V
VIMONMAX Maximum IMON Pin Voltage  IMON –0.3 Internally Limited V
VADDRMAX Maximum ADDR1, ADDR0 Pin Voltage  ADDR1, ADDR0 –0.3 Internally Limited V
VI2CMAX Maximum SCL, SDA Pin Voltage  SCL, SDA –0.3 6 V
VIREFMAX Maximum IREF Pin Voltage  IREF –0.3 6 V
VDVDTMAX Maximum DVDT Pin Voltage  DVDT –0.3 6 V
VAUXMAX Maximum AUX/EEDATA/GPIO2 Pin Voltage  AUX/EEDATA/GPIO2 –0.3 6 V
VSWENMAX Maximum SWEN Pin Voltage  SWEN –0.3 6 V
ISWENMAX Maximum SWEN Pin Sink  SWEN 10 mA
VENMAX Maximum EN/UVLO Pin Voltage  EN/UVLO –0.3 6 V
VFLTBMAX Maximum SMBA/FLT Pin Voltage  SMBA/FLT –0.3 6 V
IFLTBMAX Maximum SMBA/FLT Pin Sink Current SMBA/FLT 10 mA
VPGOODMAX Maximum PGOOD Pin Voltage  PGOOD –0.3 6 V
IPGOODMAX Maximum PGOOD Pin Sink Current PGOOD 10 mA
VTEMPMAX Maximum TEMP/EECLK/GPIO1 Pin Voltage  TEMP/EECLK/GPIO1 –0.3 6 V
IMAX Maximum Continuous Switch Current IN to OUT Internally Limited A
TJMAX Junction temperature Internally Limited °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
During FET OFF condition for negative transients up-to 5µs.