SLAAEG4B October   2023  – July 2025 MSPM0C1104 , MSPM0C1105 , MSPM0C1106 , MSPM0H3216 , MSPM0L1306

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 MSPM0C Hardware Design Check List
  5. 2 Power Supplies in MSPM0C Devices
    1. 2.1 Digital Power Supply
    2. 2.2 Analog Power Supply
    3. 2.3 Built-in Power Supply and Voltage Reference
    4. 2.4 Recommended Decoupling Circuit for Power Supply
  6. 3 Reset and Power Supply Supervisor
    1. 3.1 Digital Power Supply
    2. 3.2 Power Supply Supervisor
      1. 3.2.1 Power-On Reset (POR) Monitor
      2. 3.2.2 Brownout Reset (BOR) Monitor
      3. 3.2.3 POR and BOR Behavior During Supply Changes
  7. 4 Clock System
    1. 4.1 Internal Oscillators
      1. 4.1.1 Internal Low-Frequency Oscillator (LFOSC)
      2. 4.1.2 Internal System Oscillator (SYSOSC)
    2. 4.2 External Oscillators & External Clock Input
      1. 4.2.1 Low-Frequency Crystal Oscillator (LFXT)
      2. 4.2.2 LFCLK_IN (Digital Clock)
      3. 4.2.3 High-Frequency Crystal Oscillator (HFXT)
      4. 4.2.4 HFCLK_IN (Digital Clock)
    3. 4.3 External Clock Output (CLK_OUT)
    4. 4.4 Frequency Clock Counter (FCC)
  8. 5 Debugger
    1. 5.1 Debug Port Pins and Pinout
    2. 5.2 Debug Port Connection With Standard JTAG Connector
      1. 5.2.1 Standard XDS110
      2. 5.2.2 Lite XDS110 (MSPM0 LaunchPad™ kit)
  9. 6 Key Analog Peripherals
    1. 6.1 ADC Design Considerations
    2. 6.2 COMP and DAC Design Considerations
  10. 7 Key Digital Peripherals
    1. 7.1 Timer Resources and Design Considerations
    2. 7.2 UART and LIN Resources and Design Considerations
    3. 7.3 I2C and SPI Design Considerations
  11. 8 GPIOs
    1. 8.1 GPIO Output Switching Speed and Load Capacitance
    2. 8.2 GPIO Current Sink and Source
    3. 8.3 Open-Drain GPIOs Enable 5V Communication Without a Level Shifter
    4. 8.4 Communicate With 1.8V Devices Without a Level Shifter
    5. 8.5 Unused Pins Connection
  12. 9 Layout Guides
    1. 9.1 Power Supply Layout
    2. 9.2 Considerations for Ground Layout
      1. 9.2.1 What is Ground Noise?
    3. 9.3 Traces, Vias, and Other PCB Components
    4. 9.4 How to Select Board Layers and Recommended Stack-up
  13. 10Bootloader
  14. 11Summary
  15. 12References
  16. 13Revision History

6.1 ADC Design Considerations

MSPM0C1103 and MSPM0C1104 have a 12bit, up to 1.5Msps, analog-to-digital converter (ADC), and MSPM0C1105 and MSPM0C1106 have a 12bit, up to 1.6Msps, ADC. The ADC supports fast 12, 10, and 8bit analog-to-digital conversions. The ADC implements a 12bit SAR core, sample and conversion mode control, and up to four independent conversion-and-control buffers.

ADC Input Network Figure 6-1 ADC Input Network

To achieve the desired conversion speed and keep high accuracy, set the proper sampling time in the hardware design. Sampling (sample-and-hold) time determines how long to sample a signal before digital conversion. During sample time, an internal switch lets the input capacitor charge. The required time to fully charge the capacitor is dependent on the external analog front-end (AFE) connected to the ADC input pin. Figure 6-1 shows a typical ADC model of an MSPM0C MCU. The Rin and CS/H values can be obtained from the device-specific data sheet. Understand the AFE drive capability and calculate the minimum sampling time required to sample the signal. The resistance of Rpar and Rin affects tsample. Equation 1 can be used to calculate a conservative value of the minimum sample time tsample for an n-bit and fixed settling error conversion:

Equation 1. tsample ≥ ( ln(2n/Settling error) - ln( (Cpar + CI) / CS/H ) ) × ( (Rpar + Rin) × CS/H + Rpar × (Cpar + CI) )