SLAAEG4B October   2023  – July 2025 MSPM0C1104 , MSPM0C1105 , MSPM0C1106 , MSPM0H3216 , MSPM0L1306

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. MSPM0C Hardware Design Check List
  5. Power Supplies in MSPM0C Devices
    1. 2.1 Digital Power Supply
    2. 2.2 Analog Power Supply
    3. 2.3 Built-in Power Supply and Voltage Reference
    4. 2.4 Recommended Decoupling Circuit for Power Supply
  6. Reset and Power Supply Supervisor
    1. 3.1 Digital Power Supply
    2. 3.2 Power Supply Supervisor
      1. 3.2.1 Power-On Reset (POR) Monitor
      2. 3.2.2 Brownout Reset (BOR) Monitor
      3. 3.2.3 POR and BOR Behavior During Supply Changes
  7. Clock System
    1. 4.1 Internal Oscillators
      1. 4.1.1 Internal Low-Frequency Oscillator (LFOSC)
      2. 4.1.2 Internal System Oscillator (SYSOSC)
    2. 4.2 External Oscillators & External Clock Input
      1. 4.2.1 Low-Frequency Crystal Oscillator (LFXT)
      2. 4.2.2 LFCLK_IN (Digital Clock)
      3. 4.2.3 High-Frequency Crystal Oscillator (HFXT)
      4. 4.2.4 HFCLK_IN (Digital Clock)
    3. 4.3 External Clock Output (CLK_OUT)
    4. 4.4 Frequency Clock Counter (FCC)
  8. Debugger
    1. 5.1 Debug Port Pins and Pinout
    2. 5.2 Debug Port Connection With Standard JTAG Connector
      1. 5.2.1 Standard XDS110
      2. 5.2.2 Lite XDS110 (MSPM0 LaunchPad™ kit)
  9. Key Analog Peripherals
    1. 6.1 ADC Design Considerations
    2. 6.2 COMP and DAC Design Considerations
  10. Key Digital Peripherals
    1. 7.1 Timer Resources and Design Considerations
    2. 7.2 UART and LIN Resources and Design Considerations
    3. 7.3 I2C and SPI Design Considerations
  11. GPIOs
    1. 8.1 GPIO Output Switching Speed and Load Capacitance
    2. 8.2 GPIO Current Sink and Source
    3. 8.3 Open-Drain GPIOs Enable 5V Communication Without a Level Shifter
    4. 8.4 Communicate With 1.8V Devices Without a Level Shifter
    5. 8.5 Unused Pins Connection
  12. Layout Guides
    1. 9.1 Power Supply Layout
    2. 9.2 Considerations for Ground Layout
      1. 9.2.1 What is Ground Noise?
    3. 9.3 Traces, Vias, and Other PCB Components
    4. 9.4 How to Select Board Layers and Recommended Stack-up
  13. 10Bootloader
  14. 11Summary
  15. 12References
  16. 13Revision History

What is Ground Noise?

Each signal originating from a circuit (for example, driver) has a return current flow to the source by ground path. As the frequency increases, or even for simple but high-current switching like relays, there is a voltage drop due to line impedance generating interference in the grounding scheme. The return path is always by the least resistance. For DC signals, that can be the lowest resistive path. For high frequency signals, that can be the lowest impedance path. This explains how a ground plane simplifies the issue and is the key to making sure of signal integrity.

TI does not recommend that the digital return signals propagate inside the analog return (ground) area; therefore, split the ground plane to keep all the digital signal return loops within the ground area. This splitting must be done carefully. Many designs use a single (common) voltage regulator to generate a digital and analog supply of the same voltage level (for example, 3.3V). Isolate the analog rail and digital supply rails and the respective grounds from each other. Be careful while isolating ground, as both grounds have to be shorted somewhere. Figure 9-2 shows how possible return paths for digital signals are not allowed to form a loop passing through the analog ground. On each design, decide the common point considering the component placements and so forth. Do not add any inductors (ferrite bead) or resistors (not even zero Ω) in the series with any ground trace. The impedance increases due to associated inductance at a high frequency, causing a voltage differential. Do not route a signal referenced to digital ground over analog ground or the other direction.

 Digital and Analog Grounds and
                    Common Area Figure 9-2 Digital and Analog Grounds and Common Area