SLASFM6 October   2026 TAS2573

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
      1. 6.3.1 Operational Modes
        1. 6.3.1.1 Hardware Shutdown
        2. 6.3.1.2 Software Power Modes Control and Software Reset
        3. 6.3.1.3 Efficiency and power saving modes
          1. 6.3.1.3.1 Noise Gate
          2. 6.3.1.3.2 Music Efficiency Mode
          3. 6.3.1.3.3 VDD Y-bridge
          4. 6.3.1.3.4 Class-H Boost
        4. 6.3.1.4 2S Battery Mode
        5. 6.3.1.5 Low voltage battery mode
        6. 6.3.1.6 External PVDD Mode
      2. 6.3.2 Faults and Status
        1. 6.3.2.1 Interrupt generation and clearing
    4. 6.4 Feature Description
      1. 6.4.1 PurePath™ Console 3 Software
      2. 6.4.2 Playback Signal Path
        1. 6.4.2.1 Digital Signal Processor
          1. 6.4.2.1.1 Algorithm Blocks
          2. 6.4.2.1.2 Algorithm Features
          3. 6.4.2.1.3 Factory Calibration
        2. 6.4.2.2 Digital Volume Control and Amplifier Output Level
        3. 6.4.2.3 High Pass Filter
        4. 6.4.2.4 Class-D Amplifier
        5. 6.4.2.5 Supply Tracking Limiters with Brown Out Prevention
          1. 6.4.2.5.1 Voltage Limiter and Clipping protection
        6. 6.4.2.6 Tone Generator
      3. 6.4.3 Digital Audio Serial Interface
      4. 6.4.4 Boost
      5. 6.4.5 Speaker current and voltage (IV) sensing
      6. 6.4.6 Supply Voltage Monitors
      7. 6.4.7 Thermal Protection
      8. 6.4.8 Clocks and PLL
        1. 6.4.8.1 Auto clock based wakeup and clock errors
      9. 6.4.9 Digital IO pins
    5. 6.5 Programming
      1. 6.5.1 I2C Control Interface
      2. 6.5.2 I2C Address Selection
      3. 6.5.3 General I2C Operation
      4. 6.5.4 I2C Single-Byte and Multiple-Byte Transfers
      5. 6.5.5 I2C Single-Byte Write
      6. 6.5.6 I2C Multiple-Byte Write
      7. 6.5.7 I2C Single-Byte Read
      8. 6.5.8 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 PAGE_0 Registers
    2. 7.2 PAGE_1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 What to Do and What Not to Do
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

5.4 Thermal Information

THERMAL METRIC(1) Standard JEDEC(2) EVM Board(3) UNIT
YCG (DSBGA) YCG (DSBGA)
36 PINS 36 PINS
RθJA Junction-to-ambient thermal resistance 61.9 28.8 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 0.3 - ℃/W
RθJB Junction-to-board thermal resistance 14.1 - ℃/W
ΨJT Junction-to-top characterization parameter 0.2 0.9 ℃/W
ΨJB Junction-to-board characterization parameter 13.9 14 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) JEDEC Standard 4 Layer PCB
(3) Measured using EVM Board