SLUSG35 August   2026 TPS12S24F-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 SPI Timing Requirements
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply Input
      2. 7.3.2 Charge Pump and Gate Driver Output (VS, GATEx, BSTx, SRCx)
      3. 7.3.3 Driving Capacitive, Resistive and Inductive Loads
        1. 7.3.3.1 Capacitive Load Driving
          1. 7.3.3.1.1 Using SCP Based Auto-Retry Method (GATEx):
          2. 7.3.3.1.2 Using Main Path Gate Slew Rate Control Method (GATEx, SRCx):
          3. 7.3.3.1.3 Using PWM Control Method (GATEx):
        2. 7.3.3.2 Resistive or Inductive Load Driving
      4. 7.3.4 Protection Mechanisms
        1. 7.3.4.1 I2T Based Overcurrent and Short-Circuit Protection
        2. 7.3.4.2 NTC-Based External FET Over-Temperature Protection
        3. 7.3.4.3 Device Junction Overtemperature Warning
        4. 7.3.4.4 Input Undervoltage and Overvoltage Protection
        5. 7.3.4.5 External FET Drain to Source Voltage (VDS) Overvoltage Protection
        6. 7.3.4.6 Bi-VDS Based Short-Circuit Protection
        7. 7.3.4.7 Reverse Polarity Protection
        8. 7.3.4.8 Loss of Ground
      5. 7.3.5 Diagnostic Mechanisms
        1. 7.3.5.1 ADC Sense Signals
        2. 7.3.5.2 Analog and Digital Current Monitor (VIMONx)
        3. 7.3.5.3 Input Supply Voltage Measurement
        4. 7.3.5.4 Output Voltage Measurement
        5. 7.3.5.5 External FET Temperature Measurement
        6. 7.3.5.6 External FET Bi-Directional Drain to Source (Bi-VDS) Measurement
        7. 7.3.5.7 Controller Temperature Measurement
        8. 7.3.5.8 VOUT Short-to-Battery or FET Short and Open-Load Detection
          1. 7.3.5.8.1 Measurement With Main FET (GATEx) Enabled
          2. 7.3.5.8.2 Detection With Main FET (GATEx) Disabled
        9. 7.3.5.9 VOUT Short-to-Battery or FET Short Detection For Power At All Times (PAAT) Loads
      6. 7.3.6 Fault Indication (FLT / WAKE)
      7. 7.3.7 Output Disable (OUT_DISx) Function
      8. 7.3.8 Brief Supply Interruptions Behaviour
      9. 7.3.9 SPI Mode Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Diagram
      2. 7.4.2 Power Down
      3. 7.4.3 Sleep Mode
      4. 7.4.4 Config or Active Mode (AM)
      5. 7.4.5 Low Power Mode (LPM)
      6. 7.4.6 Limphome Mode
    5. 7.5 TPS12S24F-Q1 Pre-Production Silicon Limitations
      1. 7.5.1 SDO Pin Tristate Discrete Workaround (Only for parallel SPI configuration not for daisy chain)
  9. 8 Register Maps
    1. 8.1 TPS12S24F-Q1 Registers
    2. 8.2 EEPROM (NVM) Overview
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Driving Power at All Times (PAAT) Loads With Automatic Load Wakeup and Output Bulk Capacitor Charging
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 TPS12S24F-Q1 System Level Configurations
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient and EMI/EMC Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

7.3.3 Driving Capacitive, Resistive and Inductive Loads

All off-board loads have different type. Each load profile will interact differently with the Smart High Side Switch or Controller and require different considerations to ensure robust protection. Whether the load is resistive, capacitive, inductive, or does not fall neatly into one of those categories such as LEDs will change how driving the load must be approached and designed. A proper output power protection designer needs to understand what load profile will be expected, and then understand how that impacts the design of the output stage.

Table 7-1 Load Driving Using TPS12SxxF-Q1
TYPE OF LOADLOAD DRIVING METHODREGISTER SETTING
Capacitive Load, CAP_CHRG_CHx = 0x0, 0x1 or 0x3Using Short-circuit protection (SCP) based auto-retry method

CAP_CHRG_CHx = 0x0

INRUSH_DURATION_CHx = 0x0 to 0x7 (used only for VOUT_ERR_CHx indication)

FWD_SCP_SET_CHx = 0x0 to 0xF

AUTO_RETRY_DURATION_CHx = 0x0 to 0x3

LATCH_CHx = 0x0

FOLDBACK_LOCK_DIS_CHx = 0x1

Using main path gate slew control

CAP_CHRG_CHx = 0x1

INRUSH_DURATION_CHx = 0x0 to 0x7 (used only for VOUT_ERR_CHx indication)

Using main path PWM mode

CAP_CHRG_CHx = 0x3, PWM_DTY_CHx = 0x00 to 0xFF and PWM_FREQ_CHx = 0x0 to 0xF

INRUSH_DURATION_CHx = 0x0 to 0x7

Resistive or Inductive LoadUsing main path PWM method

CAP_CHRG_CHx = 0x0

PWM_EN_CHx = 0x1, PWM_DTY_CHx = 0x00 to 0xFF to and PWM_FREQ_CHx = 0x0 to 0xF