SNOSDG7 May   2025 TPS7H6101-SEP

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Timing Measurement
    2. 7.2 Deadtime Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Gate Drive Input Voltage
      2. 8.3.2  Linear Regulator Operation
      3. 8.3.3  Bootstrap Operation
        1. 8.3.3.1 Bootstrap Charging Methods
        2. 8.3.3.2 Bootstrap Capacitor
        3. 8.3.3.3 Bootstrap Diode
        4. 8.3.3.4 Bootstrap Resistor
      4. 8.3.4  High-Side Driver Startup
      5. 8.3.5  PWM_LI and EN_HI
      6. 8.3.6  Dead Time
      7. 8.3.7  Input Interlock Protection
      8. 8.3.8  Undervoltage Lockout and Power Good (PGOOD)
      9. 8.3.9  Negative SW Voltage Transients
      10. 8.3.10 Level Shifter
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bootstrap and Bypass Capacitor
        2. 9.2.2.2 Bootstrap Diode
      3. 9.2.3 Application Results
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Absolute Maximum Ratings

over operating temperature (unless otherwise noted)(1)
MIN MAX UNIT
Breakdown voltage High side drain-source  breakdown voltage (HVIN to SW_HS) voltage, BVDS(HS) 200 V
Low side drain-source breakdown voltage (SW_LS to GND) voltage, BVDS(LS) 200 V
Input voltage HVIN –0.3 200 V
VIN, EN_HI, PWM_LI, DLH, DHL –0.3 16
BOOT 0 216
Output voltage
PGOOD

–0.3 5.5 V
BP7L –0.3 8
BP5L –0.3 7
SW_HS –10 200
SW_LS –10 200
BST –0.3 16
Input voltage
(Referenced to SW_HS)
BOOT –0.3 VSW_HS + 16 V
HVIN –10 200
Output voltage
(Referenced to SW_HS)
BP5H –0.3 7 V
Sink current Continuous drain-source current, IOUT(CONT)  18 A
Single-pulse drain current tp ≤ 80 μs, TA = 25℃, IOUT(PULSE)  72 A
BST current (3-µs transient pulse, non-repetitive), IBST 4 A
Operating junction temperature –55 150 °C
Storage temperature, Tstg –65 150
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.