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SN74LVC2G53

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5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (available in the NanoFree™ package)

Data sheet
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5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (available in the NanoFree™ package)

SN74LVC2G53

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Data sheet Order now

Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 6.5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 19.5 Supply current (Typ) (uA) 1 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 SSOP (DCT) 8 8 mm² 2.95 x 2.80 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Available in the Texas Instruments
    NanoFree™ Package
  • 1.65-V to 5.5-V VCC Operation
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed, Typically 0.5 ns (VCC = 3 V,
    CL = 50 pF)
  • Low ON-State Resistance, Typically 6.5 Ω
    (VCC = 4.5 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II

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Description

This single 2:1 analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G53 device can handle both analog and digital signals. This device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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Type Title Date
* Datasheet SN74LVC2G53 Single-Pole Double-Throw (SPDT) Analog Switch 2:1 Analog Multiplexer/Demultiplexer datasheet (Rev. Q) Jan. 10, 2019
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature SN74LVC1G3157 and SNS74LVC2G53 SPDT Analog Switches Jun. 12, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
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Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

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Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
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EVALUATION BOARD Download
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199
Description
This EVM provides the user with the ability to evaluate the TL16C750E device and its features. The EVM includes an onboard 3.3-V LDO as well as level translation for processors which operate at a higher voltage rail.
Features
  • Fractional baudrate support
  • 128-byte FIFO depth
View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


View details
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM481.ZIP (99 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Scalable 20.8 GSPS reference design for 12 bit digitizers
TIDA-010128 — This reference design describes a 20.8 GSPS sampling system using RF sampling analog-to-digital converters (ADCs) in time interleaved configuration. Time interleaving method is a proven and traditional way of increasing sample rate, however, matching individual ADCs offset, gain and sampling time (...)
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REFERENCE DESIGNS Download
Reference design synchronizing data converter DDC and NCO features for multi-channel RF systems
TIDA-010122 — This reference design provides the solution for synchronization design challenges associated with emerging 5G adapted applications like massive multiple input multiple output (mMIMO), phase array RADAR and communication payload. The typical RF front end contains antenna, low noise amplifier (LNA (...)
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REFERENCE DESIGNS Download
12.8-GSPS analog front end reference design for high-speed oscilloscope and wide-band digitizer
TIDA-01028 — This reference design provides a practical example of interleaved RF-sampling analog-to-digital converters (ADCs) to achieve a 12.8-GSPS sampling rate. This is achieved by time-terleaving two RF-sampling ADCs. Interleaving requires a phase shift between the ADCs, which this reference design achieves (...)
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REFERENCE DESIGNS Download
Low noise power-supply reference design maximizing performance in 12.8 GSPS data acquisition systems
TIDA-01027 — This reference design demonstrates an efficient, low noise 5-rail power-supply design for very high-speed DAQ systems capable of > 12.8 GSPS. The power supply DC/DC converters are frequency synchronized and phase-shifted in order to minimize input current ripple and control frequency content (...)
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REFERENCE DESIGNS Download
Multichannel RF transceiver clocking reference design for RADARs and wireless 5G testers
TIDA-010131 — Analog front end for high-speed end equipments like phased-array radars, wireless communication testers, and electronic warfare require synchronized, multipletransceiver signal chains. Each transceiver signal chain includes high-speed, analog-to-digital converters (ADCs), digital-to-analog (...)
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REFERENCE DESIGNS Download
High Channel Count JESD204B Clock Generation Reference Design for RADAR and 5G Wireless Testers
TIDA-01023 — High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports high channel count JESD204B synchronized clocks using one master and multiple (...)
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REFERENCE DESIGNS Download
High Channel Count JESD204B Daisy Chain Clock Reference Design for RADAR and 5G Wireless Testers
TIDA-01024 — High-speed multi-channel applications require low noise and scalable clocking solutions capable of precise channel-to-channel skew adjustment to achieve optimal system SNR, SFDR, and ENOB. This reference design supports scaling up JESD204B synchronized clocks in daisy chain configuration. This (...)
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REFERENCE DESIGNS Download
Flexible 3.2-GSPS multi-channel AFE reference design for DSOs, radar and 5G wireless test systems
TIDA-01022 — This high speed multi-channel data capture reference design enables optimum system performance. System designers needs to consider critical design parameters like clock jitter and skew for high speed multi-channel clock generation, which affects overall system SNR, SFDR, channel to channel skew and (...)
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CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options
SM8 (DCT) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

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  • Qualification summary
  • Ongoing reliability monitoring

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